Patent classifications
B23K26/3576
WAFER PRODUCING METHOD
A peeling layer is formed by applying a laser beam only to a central region of a workpiece other than a peripheral region extending inward from the peripheral edge of the workpiece by a predetermined distance. In this case, the application of the laser beam does not form the peeling layer in the peripheral region of the workpiece, and the formation of an ablation trace on the outer peripheral surface of the workpiece is prevented. As a result, it is possible to reduce a probability of occurrence of chipping in the peripheral region of a wafer peeled off from the workpiece when the wafer is subjected to a post-process.
METHOD AND APPARATUS FOR CUTTING AND ABLATING A WORKPIECE WITH A COMPLEX FLUID-JET-GUIDED LASER BEAM
The invention relates to a method 100 and an apparatus 300 for cutting or ablating a particular material of the workpiece with a pulsed laser beam coupled into a fluid jet. The method comprises producing the pulsed laser beam with at least one laser source, providing the pressurized fluid jet onto the workpiece, and coupling the pulsed laser beam into the fluid jet towards the workpiece. The pulsed laser beam comprises at least two superimposed pulsations selected based on the particular material of the workpiece. A first pulsation has a different power and frequency than a second pulsation.
Method Of Manufacturing Watch Component, And Watch Component
A method of manufacturing a watch component is a method of manufacturing a watch component in which while a laser irradiation unit and a base member made of metal are moved relatively, laser irradiation is performed to decorate the base member, and includes a first step of irradiating the base member with the laser to form a recessed portion in the base member, a second step of irradiating, with the laser, the base member in which the recessed portion is formed at irradiation intensity less than irradiation intensity of the first step, to clean the base member, and a third step of performing surface treatment on the base member after the cleaning.
ELECTROSTATIC CHUCK WITH LASER-MACHINED MESAS
Electrostatic chucks (ESCs) for reactor or plasma processing chambers, and methods of fabricating ESCs, are described. In an example, a method of fabricating a substrate support assembly includes providing a ceramic top plate having a top surface with a processing region. A plurality of mesas is formed within the processing region and on the top surface of the ceramic plate. Laser-machining of one or more of the plurality of mesas is performed to reduce or to increase a surface roughness of the one or more of the plurality of mesas.
Electrosurgical forceps for grasping, treating, and/or dividing tissue
A knife configured for use with an electrosurgical forceps having curved jaw members and a method of manufacturing the same. The knife includes a distal body having an inner side and an outer side, a first etching on the outer side of the distal body defining a distal cutting edge and a second etching on the outer side of the distal body extending along a portion of a length of the distal body to define relatively protruded and relatively recessed surfaces extending along a portion of the length of the distal body on the outer side thereof.
Multi-mode laser device for metal manufacturing applications
Disclosed is a multi-mode laser device for metal manufacturing applications including additive manufacturing (AM), laser cladding, laser welding, laser cutting, laser texturing and laser polishing. The multi-mode laser device configures off-axis, solid-state diode or diode-pumped lasers into an array to perform precision controlled, direct metal deposition printing, cladding, laser welding, laser cutting, laser texturing and laser polishing through a single device. Dual-mode printing, cladding and welding capability using metal wire and powder feedstock sources in the same device is provided with in-line control, precision wire feed driver/controller, adjustable shield gas diffuser, and nozzles tailored to wire feedstock diameter.
POST-PROCESSING OF AN OBJECT OBTAINED BY DIRECT METAL LASER SINTERING
The present invention relates to a method and a system for treating a surface of an object obtained by direct metal laser sintering. The object is sintered from a metal powder with a grain size distribution. Due to the manufacturing process, the object can comprise a rough surface with remaining grains of the metal powder attached to the surface. The method according to the present invention provides parameters for post-processing the object to achieve a smooth surface suitable for use in medical imaging systems.
ABRASIVE COATING INCLUDING METAL MATRIX AND CERAMIC PARTICLES
A system may include a powder source; a powder delivery device; an energy delivery device; and a computing device. The computing device may be configured to: control the powder source to deliver metal powder to the powder delivery device; control the powder delivery device to deliver the metal powder to a surface of an abrasive coating; and control the energy delivery device to deliver energy to at least one of the abrasive coating or the metal powder to cause the metal powder to be joined to the abrasive coating.
ABRASIVE COATING INCLUDING METAL MATRIX AND CERAMIC PARTICLES
A system may include a powder source; a powder delivery device; an energy delivery device; and a computing device. The computing device may be configured to: control the powder source to deliver metal powder to the powder delivery device; control the powder delivery device to deliver the metal powder to a surface of an abrasive coating; and control the energy delivery device to deliver energy to at least one of the abrasive coating or the metal powder to cause the metal powder to be joined to the abrasive coating.
Method for producing a transmissive optics
In a method for the manufacture of a transmissive optical system from a blank, material ablation is achieved on the blank with an ablative laser, and the pulse duration of the ablative laser is less than 1 ns, and preferably lies between 3 fs and 100 fs, or between 100 fs and 10 ps.