According to one or more embodiments, there is provided an apparatus for polishing a surface of a substrate to remove a resin layer formed on the surface of the substrate having a groove, the apparatus including: a laser irradiation apparatus configured to irradiate a laser to the resin layer to remove at least a portion of a resin from the resin layer except for a portion of the resin layer arranged in the groove.

The invention relates to a method for producing an axle housing of a vehicle axle, by means of integrally connecting an axle tube (1) to an axle shaft (2) which is positioned on the longitudinal axis (L) of the axle tube, is equipped with bearing surfaces (3) for mounting a vehicle wheel, and has a tube cross-section facing said axle tube (1) which is substantially the same as the tube cross-section of the axle tube. In order to develop a welding method for the production of an axle housing that consists of an axle tube and an axle shaft secured thereto, which method is optimised in terms of the dynamic loads to which the axle housing is typically subjected in a driving operation, the method comprises the following steps: arranging the axle tube (1) and the axle shaft (2), with the abutting surfaces of their tube cross-sections positioned coaxially to one another, in a workpiece receiving portion of a welding installation (10), said welding installation additionally comprising an arc welding device (11) and a laser welding device (12) which is operated in parallel, continuously miming a weld seam (20) in the peripheral direction of the tube cross-sections, both welding devices (11, 12) being directed, actively and from the outside, onto substantially the same peripheral section of the abutting surfaces, wherein the laser beam (S) meets the outside (14) of the tube at right angles, and intersects the longitudinal axis (L) of the axle tube (1), and stopping running the weld seam (20) once this has passed over a peripheral angle of at least 360. A corresponding axle housing is also disclosed.

An apparatus includes a beam splitter and a plurality of mirrors. The beam splitter is positioned to receive a laser beam from a source and split the received laser beam to a first plurality of split laser beams and a second plurality of split laser beams. The plurality of mirrors is configured to direct the first plurality of split laser beams and further configured to direct the second plurality of split laser beams. The first plurality of split laser beams is directed by the plurality of mirrors is configured to cut a glass substrate. The second plurality of split laser beams is directed by the plurality of mirrors is configured to shape the glass substrate.

The disclosure relates to methods and systems incorporating physical modeling to identify the ultrafast laser/material interaction mechanisms and the impact of laser parameters, to optimize implementation of ultrafast laser-based processing for a given material. The process determines a laser fluence near the ablation threshold for a given material and given pulse duration. The repetition rate, scanning speed and scanning strategy are subsequently optimized to minimize heat accumulation, having an operable line scan overlap between 50% to 85% for achieving smooth ultrafast-laser polishing, while maintaining an optic-quality surface.

Embodiments of the present disclosure generally relate to a method for forming and treating a component in semiconductor manufacturing. In one embodiment, a method for treating a chamber component used in vacuum processing includes obtaining the chamber component including a recess formed in a surface of the chamber component, the surface being fabricated from a metal, and the recess has a depth ranging from about 0.5 mm to about 10 mm and a width ranging from about 1 mm to about 15 mm. The method further includes polishing the bottom surface of the recess using a laser to form a polished bottom surface having an Ra number of 1 micron or less. The laser can achieve high quality surface finishing.

Disclosed is a multi-mode laser device for metal manufacturing applications including additive manufacturing (AM), laser cladding, laser welding, laser cutting, laser texturing and laser polishing. The multi-mode laser device configures off-axis, solid-state diode or diode-pumped lasers into an array to perform precision controlled, direct metal deposition printing, cladding, laser welding, laser cutting, laser texturing and laser polishing through a single device. Dual-mode printing, cladding and welding capability using metal wire and powder feedstock sources in the same device is provided with in-line control, precision wire feed driver/controller, adjustable shield gas diffuser, and nozzles tailored to wire feedstock diameter.

A firearm having a laser induced friction surface. A method for forming the laser induced friction surface on the firearm may includes the steps of disposing the laser machine adjacent to a component of the firearm, adjusting the laser machine, then applying the laser beam of the laser machine onto a component surface.

A SiC wafer is produced from a single crystal SiC ingot. A focal point of a pulsed laser beam having a transmission wavelength to the ingot is set inside the ingot at a predetermined depth from a flat surface of the ingot, the predetermined depth corresponding to the thickness of the wafer to be produced. The pulsed laser beam is applied to the ingot to thereby form a separation layer for separating the wafer from the ingot. The wafer is separated from the ingot along the separation layer, and a flat surface is formed by grinding an upper surface of the ingot as a rough separation surface left after separating the wafer, thereby removing the roughness of the upper surface of the ingot to flatten the upper surface of the ingot.

A firearm having a laser induced friction surface. A method for forming the laser induced friction surface on the firearm may includes the steps of disposing the laser machine adjacent to a component of the firearm, adjusting the laser machine, then applying the laser beam of the laser machine onto a component surface.

A method for producing a device support base in an embodiment according to the present disclosure includes step A of providing a support base having a first surface and a second surface parallel to the first surface; step B of forming a laser beam in a first direction parallel to the first surface of the support base; and step C of translating or rotating the laser beam in a second direction parallel to the first surface of the support base and crossing the first direction to remove at least a part of protruding portions or contamination elements on the first surface of the support base.