Embedded die packaging for semiconductor devices and methods of fabrication wherein conductive vias are provided to interconnect contact areas on the die and package interconnect areas. Before embedding, a protective masking layer is provided selectively on regions of the electrical contact areas where vias are to be formed by laser drilling. The material of the protective masking layer is selected to protect against over-drilling and/or to control absorption properties of surface of the pad metal to reduce absorption of laser energy during laser drilling of micro-vias, thereby mitigating physical damage, overheating or other potential damage to the semiconductor device. The masking layer may be resistant to surface treatment of other regions of the electrical contact areas, e.g. to increase surface roughness to promote adhesion of package dielectric.

Embedded die packaging for semiconductor devices and methods of fabrication wherein conductive vias are provided to interconnect contact areas on the die and package interconnect areas. Before embedding, a protective masking layer is provided selectively on regions of the electrical contact areas where vias are to be formed by laser drilling. The material of the protective masking layer is selected to protect against over-drilling and/or to control absorption properties of surface of the pad metal to reduce absorption of laser energy during laser drilling of micro-vias, thereby mitigating physical damage, overheating or other potential damage to the semiconductor device. The masking layer may be resistant to surface treatment of other regions of the electrical contact areas, e.g. to increase surface roughness to promote adhesion of package dielectric.

The present invention is directed to a combination of hydrophilic and hydrophobic features disposed on a surface to control flow over the surface.

The present invention is directed to a combination of hydrophilic and hydrophobic features disposed on a surface to control flow over the surface.

A metal resin composite-molded article which can suppress deformation induced by laser processing in a technique for improving the adhesion between a metal plate and a resin by forming grooves on the surface of the metal plate by means of a laser, even if the metal plate is thin. A metal resin composite-molded article obtained by insert-molding a resin composition on a metal plate having a thickness of 500 μm or less, grooves are formed on the surface of the metal plate in which the resin composition is inserted, the width of the grooves is 30-300 μm, the depth of the grooves is at most 24% of the thickness of the metal plate, and the ratio of the width to the depth is 0.1-2.5.

A grain-oriented electrical steel sheet according to the present invention includes a base steel sheet having plural grooves on a surface and a glass film formed on the surface of the base steel sheet. In case of viewing region including grooves in cross section orthogonal to groove longitudinal direction, a straight line passing through peak point present on profile line of glass film and parallel to groove width direction orthogonal to sheet thickness direction in cross section is defined as reference line, a point present on boundary line between glass film and base steel sheet and present at lowest location in sheet thickness direction is defined as deepest point, and a point present on boundary line and present at the highest location in the sheet thickness direction in region having the deepest point in a center and having length of 2 μm in groove width direction is defined as shallowest point, a relationship between shortest distance A between reference line and deepest point and shortest distance B between reference line and shallowest point satisfies Expression (1).
0.1 μm≤A−B≤5.0 μm  (1)

A laser automatic focusing equipment for a laser engraving machine is provided. It includes a lifting mechanism, a laser assembly disposed at a lower end of a side of the lifting mechanism, and a lifting motor fixedly disposed on an upper end of the side of the lifting mechanism and is in transmission connection with the lifting mechanism. The laser assembly includes a heat sink, a laser disposed in the heat sink, a distance sensor disposed in the heat sink and on a side of the laser, and a contact device disposed in the heat sink and at a bottom of the laser. The whole focusing process is controlled by a program without human intervention, with high accuracy, no manual operation and no laser irradiation risk. It is suitable for focusing of engraving materials with different hardness and different materials by adding the contact device.

A laser automatic focusing equipment for a laser engraving machine is provided. It includes a lifting mechanism, a laser assembly disposed at a lower end of a side of the lifting mechanism, and a lifting motor fixedly disposed on an upper end of the side of the lifting mechanism and is in transmission connection with the lifting mechanism. The laser assembly includes a heat sink, a laser disposed in the heat sink, a distance sensor disposed in the heat sink and on a side of the laser, and a contact device disposed in the heat sink and at a bottom of the laser. The whole focusing process is controlled by a program without human intervention, with high accuracy, no manual operation and no laser irradiation risk. It is suitable for focusing of engraving materials with different hardness and different materials by adding the contact device.

A bearing raceway element configured as an inner ring or as an outer ring, or configured to be attachable to an element serving as an inner ring or as an outer ring for the bearing or to an inner ring or an outer ring of the bearing. The raceway element is manufactured from a sheet metal panel and includes at least one first joint edge and at least one second joint edge directed in the circumferential direction that are configured to be connected to each other in order to form an annular raceway element. The at least one first joint edge is at least partially configured as a first alignment element and/or includes the first alignment element. Also a bearing including the raceway element and an associated method.

A bearing raceway element configured as an inner ring or as an outer ring, or configured to be attachable to an element serving as an inner ring or as an outer ring for the bearing or to an inner ring or an outer ring of the bearing. The raceway element is manufactured from a sheet metal panel and includes at least one first joint edge and at least one second joint edge directed in the circumferential direction that are configured to be connected to each other in order to form an annular raceway element. The at least one first joint edge is at least partially configured as a first alignment element and/or includes the first alignment element. Also a bearing including the raceway element and an associated method.