Patent classifications
B23K26/402
ENDOSCOPIC BENDABLE TUBE, ENDOSCOPE, AND METHOD OF MANUFACTURING ENDOSCOPIC BENDABLE TUBE
An endoscopic bendable tube includes: an integrally formed resin tube; at least two wires embedded in a tube wall of the resin tube from a proximal end side to a distal end side of the resin tube, the at least two wires being parallel to a tube axis direction of the resin tube and being at positions facing each other; and a plurality of pairs of through slits formed in the tube wall of the resin tube in the tube axis direction, each pair of through slits being formed facing each other in the tube wall of the resin tube.
LASER PROCESSING APPARATUS, THICKNESS DETECTION METHOD, AND THICKNESS DETECTION APPARATUS
Provided is a laser processing apparatus configured to machine a corner portion of a machining target object by causing the corner portion to be relatively displaced toward a laser, the laser having an optical axis extending in a predetermined direction, the corner portion being formed by a plurality of adjacent surfaces of the machining target object and including a coating layer comprising a light-transmissive material, the laser processing apparatus including: displacement control means for controlling an actuator such that the machining target object becomes relatively close to or away from the optical axis; a detection unit provided at a position at least outside an irradiation region of the laser, the irradiation region extending in a tubular shape in a plan view intersecting the optical axis, the detection unit being configured to detect intensity of light reaching the position; and detection means for detecting a distance of relative displacement of the machining target object between points of detection of a first intensity and a third intensity as a thickness of the coating layer in a case where the predetermined first intensity, a second intensity smaller than the first intensity, and the third intensity larger than the first intensity are detected in order by the detection unit while the machining target object becomes relatively close to or away from the optical axis.
LASER PROCESSING APPARATUS, THICKNESS DETECTION METHOD, AND THICKNESS DETECTION APPARATUS
Provided is a laser processing apparatus configured to machine a corner portion of a machining target object by causing the corner portion to be relatively displaced toward a laser, the laser having an optical axis extending in a predetermined direction, the corner portion being formed by a plurality of adjacent surfaces of the machining target object and including a coating layer comprising a light-transmissive material, the laser processing apparatus including: displacement control means for controlling an actuator such that the machining target object becomes relatively close to or away from the optical axis; a detection unit provided at a position at least outside an irradiation region of the laser, the irradiation region extending in a tubular shape in a plan view intersecting the optical axis, the detection unit being configured to detect intensity of light reaching the position; and detection means for detecting a distance of relative displacement of the machining target object between points of detection of a first intensity and a third intensity as a thickness of the coating layer in a case where the predetermined first intensity, a second intensity smaller than the first intensity, and the third intensity larger than the first intensity are detected in order by the detection unit while the machining target object becomes relatively close to or away from the optical axis.
ONE-PIECE WOVEN OCCUPANT RESTRAINT SYSTEM
A method for manufacturing a one-piece woven (OPW) air bag includes providing yarns and warping the yarns on at least one beam of a loom. Yarns are simultaneously woven into a fabric air bag structure having two layer portions defining both an inflatable volume and non-inflatable portions and single layer portions forming seams delimiting the inflatable volume. The air bag structure is cut to define the OPW air bag and at least one opening extending through only one layer of the two layer portions.
METHOD OF LASER BEAM MACHINING OF A TRANSPARENT BRITTLE MATERIAL AND DEVICE EMBODYING SUCH METHOD
The invention relates to laser equipment, specifically pulsed scanning lasers used to cut brittle substrates. The authors propose a method and device for forming a stressed edge in the substrate for cleaving of the substrate, to which end a track of cavities is formed through optically induced breakdown in the body of tire material during its irradiation with a focused laser beam with a fixed focal distance during the course of angled scanning of the laser beam, with longitudinal movement along the length of the substrate. The technical result is: improved strength parameters of products and better quality of straight and oblique edges formed during substrate cleaving, absence of chips and microcracks, high rate of formation of the stressed cleaving edge, which implies faster laser cutting.
PANE-SHAPED GLASS ELEMENT AND METHOD OF SEPARATING A GLASS SUBSTRATE INTO A PLURALITY OF SUCH GLASS ELEMENTS
A pane-shaped glass element having two opposing side surfaces which are edge-wise interconnected by a number of edge surfaces, wherein in the or each edge surface there are provided filamentary damages forming side-by-side elongate depressions, and wherein the or each edge surface lies obliquely to the side surfaces, is to be further formed for particularly good usability in a plurality of possible applications. For this purpose, according to the invention, the respective edge surface has a surface roughness with a mean roughness value of at least 0.3 μm, and preferably of at most 2 μm, in a particularly advantageous embodiment of about 1 μm, in its region provided with the filamentary damages.
PANE-SHAPED GLASS ELEMENT AND METHOD OF SEPARATING A GLASS SUBSTRATE INTO A PLURALITY OF SUCH GLASS ELEMENTS
A pane-shaped glass element having two opposing side surfaces which are edge-wise interconnected by a number of edge surfaces, wherein in the or each edge surface there are provided filamentary damages forming side-by-side elongate depressions, and wherein the or each edge surface lies obliquely to the side surfaces, is to be further formed for particularly good usability in a plurality of possible applications. For this purpose, according to the invention, the respective edge surface has a surface roughness with a mean roughness value of at least 0.3 μm, and preferably of at most 2 μm, in a particularly advantageous embodiment of about 1 μm, in its region provided with the filamentary damages.
Manufacturing Apparatus and Manufacturing Method of Electrode for Secondary Battery Using Laser, and Electrode for Secondary Battery Manufactured by the Same
Provided are a manufacturing apparatus and a manufacturing method of an electrode for a secondary battery which forms a large number of holes in the electrode mixture having a level difference in thickness, by irradiating twice or less with a nanosecond laser, and an electrode for a secondary battery manufactured by the same.
TOOL AND METHOD OF MANUFACTURING TOOL
A tool of the present disclosure includes a tip end portion. The tip end portion has a surface. At least a part of the surface includes a plurality of protrusions, a first recess provided by contact between ends of two adjacent protrusions of the protrusions, and a second recess different from the first recess. The second recess is provided inside at least one of the protrusions or provided to extend across the two adjacent protrusions.
CHAMFERED SILICON CARBIDE SUBSTRATE AND METHOD OF CHAMFERING
The present invention relates to a chamfered silicon carbide substrate which is essentially monocrystalline, and to a corresponding method of chamfering a silicon carbide substrate. A silicon carbide substrate according to the invention comprises a main surface (102), wherein an orientation of said main surface (102) is such that a normal vector ({right arrow over (O)}) of the main surface (102) includes a tilt angle with a normal vector ({right arrow over (N)}) of a basal lattice plane (106) of the substrate, and a chamfered peripheral region (110), wherein a surface of the chamfered peripheral region includes a bevel angle with said main surface, wherein said bevel angle is chosen so that, in more than 75% of the peripheral region, normal vectors ({right arrow over (F)}_i) of the chamfered peripheral region (110) differ from the normal vector of the basal lattice plane by less than a difference between the normal vector of the main surface and the normal vector of the basal lattice plane of the substrate.