A manufacturing process of an element chip comprises a preparing step for preparing a substrate having first and second sides opposed to each other, the substrate containing a semiconductor layer, a wiring layer and a resin layer formed on the first side, and the substrate including a plurality of dicing regions and element regions defined by the dicing regions. Also, the manufacturing process comprises a laser grooving step for irradiating a laser beam onto the dicing regions to form grooves so as to expose the semiconductor layer along the dicing regions. Further, the manufacturing process comprises a dicing step for plasma-etching the semiconductor layer along the dicing regions through the second side to divide the substrate into a plurality of the element chips. The laser grooving step includes a melting step for melting a surface of the semiconductor layer exposed along the dicing regions.

A method for stripping ceramic from a component includes applying a liquid to a ceramic coating of an outer surface of the component. The method also includes directing a plurality of laser pulses at the ceramic coating with the applied liquid in order to spall the ceramic coating from the component.

A method for stripping ceramic from a component includes applying a liquid to a ceramic coating of an outer surface of the component. The method also includes directing a plurality of laser pulses at the ceramic coating with the applied liquid in order to spall the ceramic coating from the component.

A display apparatus includes a light source, a display panel, a light guide member, and an optical member. The light source is configured to generate light. The display panel is configured to display an image. The light guide member includes at least one surface adjacent to the light source. The optical member is between the light guide member and the display panel. The optical member includes a low refractive layer, a first cover layer, and a light conversion layer. The low refractive layer is on a light output surface of the light guide member and includes side surfaces. The first cover layer is on the low refractive layer and surrounds at least a portion of the side surfaces of the low refractive layer. The light conversion layer is on the first cover layer and is configured to covert a wavelength band of incident light.

A display apparatus includes a light source, a display panel, a light guide member, and an optical member. The light source is configured to generate light. The display panel is configured to display an image. The light guide member includes at least one surface adjacent to the light source. The optical member is between the light guide member and the display panel. The optical member includes a low refractive layer, a first cover layer, and a light conversion layer. The low refractive layer is on a light output surface of the light guide member and includes side surfaces. The first cover layer is on the low refractive layer and surrounds at least a portion of the side surfaces of the low refractive layer. The light conversion layer is on the first cover layer and is configured to covert a wavelength band of incident light.

A fixture used in the manufacture of an eyepiece, to cut the eyepiece to a particular shape, and a method of using the fixture to cut the eyepiece to have a desired shape. Embodiments are directed to a configurable fixture to align, hold, and protect a plastic sheet (e.g., a wafer) while a laser cutting apparatus is cutting one or more eyepieces out of the wafer. During the cutting, the fixture protects the eyepieces from reflected laser light by providing voids around the laser cutting lines, and by supporting each eyepiece near its perimeter. The fixture can be quickly rearranged for different eyepieces, different eyepiece shapes, and/or different plastic sheet sizes.

A fixture used in the manufacture of an eyepiece, to cut the eyepiece to a particular shape, and a method of using the fixture to cut the eyepiece to have a desired shape. Embodiments are directed to a configurable fixture to align, hold, and protect a plastic sheet (e.g., a wafer) while a laser cutting apparatus is cutting one or more eyepieces out of the wafer. During the cutting, the fixture protects the eyepieces from reflected laser light by providing voids around the laser cutting lines, and by supporting each eyepiece near its perimeter. The fixture can be quickly rearranged for different eyepieces, different eyepiece shapes, and/or different plastic sheet sizes.

Methods for singulating an optical waveguide material at a contour include directing a first laser beam onto a first side of the optical waveguide material to generate a first group of perforations in the optical waveguide material. A second laser beam is directed onto a second side of the optical waveguide material to generate a second group of perforations in the optical waveguide material. The second side is opposite the first side. The first group of perforations and the second group of perforations define a perforation zone at the contour. A third laser beam is directed at the perforation zone to singulate the optical waveguide material at the perforation zone.

A method for forming at least one freestanding microstructure on a diamond crystal includes the step of removing material from the diamond crystal so as to form a structured surface, wherein the removing of the material includes creating at least two trenches, each trench having a bottom and two side walls and wherein adjacent side walls of the at least two trenches form side walls of the structured surface. The method also includes the steps of depositing at least one masking layer on the structured surface, removing at least a portion of the at least one masking layer from the bottom of each of the at least two trenches, removing additional material from the diamond crystal at least along the side walls so as to deepen the trenches, and undercutting the diamond crystal so as to form the freestanding microstructure.

A method for forming at least one freestanding microstructure on a diamond crystal includes the step of removing material from the diamond crystal so as to form a structured surface, wherein the removing of the material includes creating at least two trenches, each trench having a bottom and two side walls and wherein adjacent side walls of the at least two trenches form side walls of the structured surface. The method also includes the steps of depositing at least one masking layer on the structured surface, removing at least a portion of the at least one masking layer from the bottom of each of the at least two trenches, removing additional material from the diamond crystal at least along the side walls so as to deepen the trenches, and undercutting the diamond crystal so as to form the freestanding microstructure.