A secondary-battery electrode manufacturing method that allows a secondary-battery electrode including a neat linear cut portion to be stably manufactured at a high speed is provided. A method of manufacturing a secondary-battery electrode (10), which is an example of an embodiment, comprises a first step of forming an active material layer (22) on at least one surface of a long core body (21). The method of manufacturing the secondary-battery electrode (10), which is an example of the embodiment also comprises a second step of cutting an electrode precursor (20) into a predetermined shape by using a continuous wave laser, the electrode precursor (20) being the long core body (21) having the active material layer (22) formed thereon.

A secondary-battery electrode manufacturing method that allows a secondary-battery electrode including a neat linear cut portion to be stably manufactured at a high speed is provided. A method of manufacturing a secondary-battery electrode (10), which is an example of an embodiment, comprises a first step of forming an active material layer (22) on at least one surface of a long core body (21). The method of manufacturing the secondary-battery electrode (10), which is an example of the embodiment also comprises a second step of cutting an electrode precursor (20) into a predetermined shape by using a continuous wave laser, the electrode precursor (20) being the long core body (21) having the active material layer (22) formed thereon.

An article includes a ceramic material and features a machined surface that is characteristic of cold ablation laser machining, and the machined surface exhibits no visible oxidation. A laser machining apparatus and technique is based on cold-ablation, but is modified or augmented with an inert assist gas to minimize deleterious surface modifications and mitigate oxide formation associated with laser machining.

An article includes a ceramic material and features a machined surface that is characteristic of cold ablation laser machining, and the machined surface exhibits no visible oxidation. A laser machining apparatus and technique is based on cold-ablation, but is modified or augmented with an inert assist gas to minimize deleterious surface modifications and mitigate oxide formation associated with laser machining.

A method for shaping a thin-film photovoltaic cell module from a photovoltaic cell sheet according to a predetermined contour of the module, where the cell sheet includes a flexible substrate based on a polymer or metal foil and a photovoltaic stack including one or more photo-active layers arranged on a front surface of the substrate. The method includes: providing the cell sheet, directing a laser beam towards a rear surface of the substrate; creating, by the laser beam, a trench in the rear surface, the trench shaped according to the contour such that the cell sheet is “divided” in a first portion within the contour and a second portion outside the contour; affixing a handling tool to one of the portions of the cell sheet on the rear surface of the substrate; selectively separating the portions by displacing the handling tool and one portion relative to the other portion.

A method for shaping a thin-film photovoltaic cell module from a photovoltaic cell sheet according to a predetermined contour of the module, where the cell sheet includes a flexible substrate based on a polymer or metal foil and a photovoltaic stack including one or more photo-active layers arranged on a front surface of the substrate. The method includes: providing the cell sheet, directing a laser beam towards a rear surface of the substrate; creating, by the laser beam, a trench in the rear surface, the trench shaped according to the contour such that the cell sheet is “divided” in a first portion within the contour and a second portion outside the contour; affixing a handling tool to one of the portions of the cell sheet on the rear surface of the substrate; selectively separating the portions by displacing the handling tool and one portion relative to the other portion.

A method of cutting a combined structure of a glass substrate and a light absorbing plate includes providing a glass substrate on a metal plate, providing a light absorbing material at an edge of the glass substrate, and cutting the glass substrate and the light absorbing plate by irradiating a laser beam to the glass substrate from the edge to which the light absorbing material is provided.

A method for manufacturing a display device including a display panel having a folding area to be folded along a virtual folding axis and first and second non-folding areas adjacent to both sides of the folding area, and a window disposed on the display panel, the method including preparing a mother substrate having an effective area and a non-effective area divided by a cutting line, performing a first laser process along a first cutting line disposed in the first non-folding area, performing a second laser process along a second cutting line disposed in the second non-folding area, and performing a third laser process along a third cutting line disposed in the folding area, in which one end of the third cutting line overlaps a first end of the first cutting line, and the other end of the third cutting line overlaps a first end of the second cutting line.

A laser beam irradiation unit of a laser processing apparatus includes a first splitting unit that causes a laser beam emitted from a laser oscillator to branch into a first optical path and a second optical path, a first beam condenser that focuses the laser beam having been introduced to the first optical path, and a second beam condenser that focuses the laser beam having been introduced to the second optical path. The laser beam irradiation unit further includes a second splitting unit on the first optical path between the first splitting unit and the first beam condenser that splits the laser beam into at least two laser beams, and a laser beam scanning unit on the second optical path between the first splitting unit and the second beam condenser that executes scanning with the laser beam and introduces the laser beam to the second beam condenser.

The present invention relates to a chamfered silicon carbide substrate which is essentially monocrystalline, and to a corresponding method of chamfering a silicon carbide substrate. A silicon carbide substrate according to the invention comprises a main surface (102), wherein an orientation of said main surface (102) is such that a normal vector ({right arrow over (O)}) of the main surface (102) includes a tilt angle with a normal vector ({right arrow over (N)}) of a basal lattice plane (106) of the substrate, and a chamfered peripheral region (110), wherein a surface of the chamfered peripheral region includes a bevel angle with said main surface, wherein said bevel angle is chosen so that, in more than 75% of the peripheral region, normal vectors ({right arrow over (F)}_i) of the chamfered peripheral region (110) differ from the normal vector of the basal lattice plane by less than a difference between the normal vector of the main surface and the normal vector of the basal lattice plane of the substrate.