A laser cutting head powered by a laser emission apparatus including optical transmission devices and associated with a cutting machine tool, includes a collimation device to collimate a laser beam coming from the laser emission apparatus, a focusing device to focus a collimated laser beam leaving the collimation devices, and a casing to house the focusing unit. The focusing unit includes one focusing lens and support devices to house and hold the focusing lens and move it along an adjustment direction within the casing in order to vary a focal point of the laser beam leaving the focusing lens. The laser cutting head includes a cooling unit secured to the casing and heat conducting devices used to connect the support devices with the cooling unit in order to extract the heat generated by the laser beam crossing the focusing lens by thermal conduction from the support devices and the focusing lens.

Systems provide cooling of an optic such as an optically addressed light valve such that the valve is sensitive to temperature and pressure variations and is thus temperature and pressure controlled. In the case of an optic such as an optically addressed light valve, the fluid pressure outside the valve is low enough that it does not compress the liquid crystal gap of the valve. The cooling fluid is transparent to the high powered wavelength of light used during operation such as in an additive manufacturing process.

A laser processing system includes an irradiation device that irradiates a laser beam to a workpiece and includes a housing, a box positioned inside the housing and housing at least a part of a path of the laser beam, and at least one infrared sensor positioned inside the housing and around the box.

A machining apparatus for laser machining a workpiece (12) in a machining zone (13) is provided, having a first interface (14) for a machining laser source for generating a machining laser beam (15), an outlet opening (18) for the machining laser beam (15), In an optical system between the first interface (14) and the outlet opening (18), which has at least one laser beam guiding device (22) having at least one movable surface (24) and at least one actuator (26), with which the movable surface (24) is dynamically adjustable, and a cooling device (28) for cooling the at least one actuator (26), wherein the cooling device (28) has at least one primary circuit (30) through which a first cooling fluid can flow without contact with the actuator (26). Furthermore, a set of parts for a machining apparatus for laser machining a workpiece (12) and a method of laser machining a workpiece (12) using such machining apparatus are also provided.

A laser processing head is presented. The laser processing head includes a laser entry module for introducing a laser beam; a collimating module for collimating the laser beam; a scanning module for deflecting the laser beam; a focusing module for focusing the laser beam; and at least one diaphragm for increasing a scan field of the laser beam. The diaphragm comprises a diaphragm body and an opening, and is configured to limit a cross-sectional area of the laser beam by the diaphragm body. The at least one diaphragm is positioned optically downstream of the laser entry module and optically upstream of the focusing module. A laser processing system including the laser processing head is also presented. Furthermore, a method for increasing a scan field of the laser beam is also provided.

In various embodiments, a laser emitter such as a diode bar is cooled during operation via jets of cooling fluid formed by ports in a cooler on which the laser emitter is positioned. The jets strike an impingement surface of the cooler that is thermally coupled to the laser emitter but prevents direct contact between the cooling fluid and the laser emitter itself.

A laser processing system for a glass workpiece comprises a frame with a first laser module thereon, a modifying device, and a blanking device. The blanking device comprises a second laser module, a hollow support element, a clamping module disposed on the frame, a heater disposed on the hollow support element, and a cooler connected to the clamping module. A method adapted to the system comprises a modifying process, a determining process, and a blanking process. In the modifying process, a first laser beam is irradiated to the glass workpiece along a processing contour line to intermittently modify the glass workpiece. According to the determining process, the blanking process is processed to have a crack being generated in a modified portion of the glass workpiece, wherein the crack divides the glass workpiece into an outer area and an inner area, and changes a temperature of the glass workpiece to have the glass workpiece being deformed, so that the outer area and the inner area are separated.

Systems (100) and methods (1000) for additively manufacturing or repairing a component from a base material (10). The system may include a laser metal deposition (LMD) system (200) operably connected to a means for cooling (300) the base material during laser processing of additive materials deposited in a melt pool on the base material. The LMD system includes a laser energy source (202) configured to direct laser energy towards the base material to form the melt pool thereon and to processes the deposited additive materials to form layers on the base material upon solidification. The means for cooling may be configured to cool the base material to within a cooling temperature range during the LMD process, which results in, e.g., a cooling/freezing effect. This cooling effect shortens the solidification period during laser processing and allows for weld heat to be released from the base material.

The invention relates to a device for roughening cylinder bores using a beam tool and offering a very high level of process reliability even for a large quantity.

A laser machining apparatus includes: a laser beam emission device; a guide beam emission device; a scanner; a processor; and a memory. The memory stores a set of computer-readable instructions therein. The set of computer-readable instructions, when executed by the processor, causes the laser machining apparatus to perform: acquiring workpiece contour information specifying a contour of the workpiece; extracting a plurality of feature points from the workpiece contour information, each of the plurality of feature points being on the contour of the workpiece; generating a guide pattern indicating a setup position of the workpiece according to the plurality of feature points; and drawing the guide pattern with the guide beam by controlling the guide beam emission device and the scanner.