LASER PROCESSING HEAD HAVING A DIAPHRAGM TO INCREASE SCAN FIELD OF THE LASER BEAM
20220234137 · 2022-07-28
Inventors
Cpc classification
B23K26/082
PERFORMING OPERATIONS; TRANSPORTING
B23K26/704
PERFORMING OPERATIONS; TRANSPORTING
B23K26/064
PERFORMING OPERATIONS; TRANSPORTING
B23K26/0626
PERFORMING OPERATIONS; TRANSPORTING
International classification
B23K26/06
PERFORMING OPERATIONS; TRANSPORTING
B23K26/082
PERFORMING OPERATIONS; TRANSPORTING
Abstract
A laser processing head is presented. The laser processing head includes a laser entry module for introducing a laser beam; a collimating module for collimating the laser beam; a scanning module for deflecting the laser beam; a focusing module for focusing the laser beam; and at least one diaphragm for increasing a scan field of the laser beam. The diaphragm comprises a diaphragm body and an opening, and is configured to limit a cross-sectional area of the laser beam by the diaphragm body. The at least one diaphragm is positioned optically downstream of the laser entry module and optically upstream of the focusing module. A laser processing system including the laser processing head is also presented. Furthermore, a method for increasing a scan field of the laser beam is also provided.
Claims
1. A laser processing head, comprising: a laser entry module for introducing a laser beam; a collimating module configured to collimate the laser beam; a scanning module configured to deflect the laser beam; and a focusing module configured to focus the laser beam; and at least one diaphragm for increasing a scan field of the laser beam; wherein the at least one diaphragm comprises a diaphragm body and an opening, and is configured to limit a cross-sectional area of the laser beam by the diaphragm body; and wherein the at least one diaphragm is positioned between the laser entry module and the focusing module.
2. The laser processing head according to claim 1, wherein: the at least one diaphragm is positioned such that an entire cross-sectional area of the laser beam having passed through the opening of the diaphragm is incident on an optical surface of an optical element; and the optical element is comprised in at least one of the collimating module, the scanning module and the focusing module.
3. The laser processing head according to claim 1, wherein the diaphragm body is arranged to obstruct an entire edge of the laser beam or to obstruct only a part of an entire edge of the laser beam.
4. The laser processing head according to claim 1, wherein the opening of the at least one diaphragm is smaller than an aperture of the focusing module.
5. The laser processing head according to claim 1, wherein the at least one diaphragm includes at least one of: a first diaphragm positioned between the laser entry module and the collimating module (44), and configured to limit the cross-sectional area of the laser beam propagating from the laser entry module (40) to the collimating module; a second diaphragm positioned between the collimating module and the scanning module, and configured to limit the cross-sectional area of the laser beam propagating from the collimating module to the scanning module; and a third diaphragm positioned between the scanning module and the focusing module, and configured to limit the cross-sectional area of the laser beam propagating from the scanning module to the focusing module.
6. The laser processing head according to claim 1, wherein the at least one diaphragm is configured such that the laser beam passing through the at least one diaphragm has a width less than 95% of a width of the laser beam received at the at least one diaphragm.
7. The laser processing head according to claim 1, wherein the at least one diaphragm is configured to adjustably limit a cross-sectional area of the laser beam passing therethrough.
8. The laser processing head according to claim 7, wherein the at least one diaphragm is configured to adjust a cross-sectional area of the opening to adjustably limit the cross-sectional area of the laser beam passing therethrough.
9. The laser processing head according to claim 7, wherein the at least one diaphragm is configured to move along an optical axis of the at least one diaphragm and/or in a plane perpendicular to the optical axis of the at least one diaphragm to adjustably limit the cross-sectional area of the laser beam passing therethrough.
10. The laser processing head according to claim 1, wherein: the diaphragm body comprises a coolant-based cooling mechanism to remove heat from the diaphragm body; and/or the diaphragm body comprises a surface coating configured to increase absorption of a portion of the laser beam hitting the diaphragm body; and/or the diaphragm body comprises a beam trap configured to trap, by repeated total internal reflections, a portion of the laser beam hitting the diaphragm body; and/or the diaphragm body comprises a reflector and an absorbing unit, and the reflector is arranged to reflect a portion of the laser beam hitting the diaphragm body towards the absorbing unit for absorbing the reflected portion of the laser beam.
11. The laser processing head according to claim 1, further comprising a sensor module comprising one or more sensors configured to sense a laser power of a portion of the laser beam having passed through the opening of the at least one diaphragm and/or to sense a laser power absorbed by the diaphragm body.
12. A laser processing system, comprising: The laser processing head according to claim 1; and a laser source module configured to generate the laser beam.
13. The laser processing system according to claim 12, wherein the laser source module comprises at least one of: a single-mode laser source, a multi-mode laser source, or a ring-mode laser source.
14. The laser processing system according to claim 12, wherein the laser source module comprises at least one of: a disk laser, a fiber laser, a fiber disk laser, a fiber laser with ring-mode, a disk laser with ring-mode, a diode laser, a single-mode fiber laser or a multi-mode fiber laser.
15. The laser processing system according to claim 12, wherein the laser source module is configured to generate a laser beam having a power of at least 200 W, or a power of at least 6 kW, or a power of at least 8 kW, or a power of at least 10 kW.
16. The laser processing system according to claim 12, further comprising a processor configured: to control the laser source module to adjust a laser power of the laser beam according to a sensed laser power of a portion of the laser beam passed through the opening (102) of the at least one diaphragm and/or according to a sensed laser power absorbed by the diaphragm body and/or according to a scan position of the laser beam deflected by the scanning module; and/or to control the at least one diaphragm to adjust the cross-sectional area of the laser beam passing through the at least one diaphragm according to a scan position of the laser beam deflected by the scanning module.
17. A method for controlling a laser processing head, the method comprising: introducing a laser beam at a laser entry module of the laser processing head; collimating the laser beam by a collimating module of the laser processing head; deflecting the laser beam by a scanning module of the laser processing head; and focusing the laser beam by a focusing module of the laser processing head; passing the laser beam through a diaphragm of the laser processing head such that a scan field of the laser beam is increased by limiting a cross-sectional area of the laser beam by the diaphragm.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0062] Any references to ‘radial’, ‘radially’, ‘circumferential’, ‘circumferentially’ and like phrases is to be understood with reference to a central axis of the component being referred to, unless otherwise stated.
[0063] The above mentioned attributes and other features and advantages of the present technique and the manner of attaining them will become more apparent and the present technique itself will be better understood by reference to the following description of embodiments of the present technique taken in conjunction with the accompanying drawings, wherein:
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DETAILED DESCRIPTION OF THE INVENTION
[0077] Hereinafter, above-mentioned and other features of the present technique are described in detail. Various embodiments are described with reference to the drawing, wherein like reference numerals are used to refer to like elements throughout. In the following description, for purpose of explanation, numerous specific details are set forth in order to provide a thorough understanding of one or more embodiments. It may be noted that the illustrated embodiments are intended to explain, and not to limit the invention. It may be evident that such embodiments may be practiced without these specific details.
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[0079] The laser processing system 2 may be any system which is used to transmit or irradiate a laser beam onto a target surface or a workpiece W. The laser processing system 2 may be one of, but not limited to, a laser cutting system, a laser engraving system, a laser ablation system, a laser drilling system, a laser beam machining system, a laser beam welding system, a laser hybrid welding system, a laser soldering system, an additive manufacturing system using laser such as a laser printing system, a laser cladding system, and so on and so forth.
[0080] The laser processing system 2 may include a laser beam generation source or laser source module 42, for generating a laser beam 9, and a laser processing head 1. The laser processing system may optionally include a processor 48.
[0081] The laser source module 42 may comprise a single-mode laser source or a multi-mode laser source. The laser source module 42 may be configured to generate a laser beam having a power of several hundreds of Watt, or a multi-kilowatt laser beam, e.g. of 2 kW or greater, for example 6 kW and greater or 8 kW and greater.
[0082] The laser processing head 1 may include a housing within which components of the laser processing head 1, e.g. optical elements for guiding the laser beam 9, may be disposed.
[0083] The laser processing head 1 includes a laser entry module 40 for introducing the laser beam 9, a collimating module 44 for collimating the laser beam 9, a scanning module 46 for scanning or deflecting the laser beam 9, and a focusing module 50 for focusing the laser beam 9 onto a work piece W.
[0084] The laser beam 9 may be fed to the laser processing head 1 via the laser entry module 40. The laser beam 9 is directed from the laser entry module 40 towards the focusing module 50, and thus defining an overall or general direction of transmission of the laser beam 9. The position or optical position of the different components relative to each other may be understood accordingly, for example, a location or position of the laser entry module 40 may be understood as an optically upstream location or position, whereas a location or position of the focusing module 50 may be understood as an optically downstream location or position. A direction generally extending from the laser entry module 40 towards the focusing module 50 may be understood as optically downstream, whereas a direction generally extending from the focusing module 50 towards the laser entry module 40 may be understood as optically upstream. All the directions may be understood along a direction of propagation or travel or transmission of the laser beam from the laser entry module 40 towards the focusing module 50. It may be noted that in the embodiment of
[0085] The laser source module 42 may be coupled to the laser entry module 40, for example by optical fibers. The laser beam 9 generated by the laser source module 42 may be fed or introduced or provided to the laser processing head 1 at or via the laser entry module 40. The laser entry module 40 may be for example be exit ends of the optical fibers (not shown).
[0086] The laser beam 9 emerging out of the laser entry module 40 is directed towards the collimating module 44. The collimating module 44 may comprise at least one collimating optical element, e.g. one or more collimating lenses. The laser beam 9 is collimated by the collimating module 44. The collimated laser beam 9 may then be directed towards the scanning module 46.
[0087] The scanning module 46 may deflect the laser beam 9 in one-dimension or in two-dimensions. The scanning module 46 may comprise at least one scanning optical element, e.g. one or more scanning mirrors.
[0088] In order to position the laser beam 9 in two dimensions, either a one mirror arrangement is used in which the mirror is rotated along two axes e.g. two orthogonal axis or X-axis and Y-axis, or a two mirror arrangement is used that has two closely spaced mirrors—one for each orthogonal axis to reflect the laser beam along the corresponding axis. Each of the two mirrors may be driven by a galvanometer or by other actuation means such as an electric motor. For example, the scanning module may be a galvanometer scanner i.e. the scanning module 46 may have two galvanometers, each having a corresponding reflector such as a mirror to deflect the laser beam 9.
[0089] The laser beam 9 deflected or positioned or steered by the scanning module 46 is directed towards the focusing module 50. The laser beam 9 is focused by the focusing module onto the workpiece W.
[0090] The focusing module 50 may comprise at least one focusing optical element, e.g. one or more focusing lenses. The focusing module 40 may comprise a F-Theta lens. In other words, the focusing optical element may be a F-Theta lens.
[0091] The laser beam 9 may exit the laser processing head 1 through or via an exit opening or nozzle 58. The nozzle 58 may be located optically downstream of the focusing module 50.
[0092] The laser processing head 1 further comprises at least one diaphragm 100 configured to limit a diameter or cross-sectional area of the laser beam 9 passing therethrough in order to increase a scan field of the laser beam 9. The structure and function of the diaphragm 100 has been explained later with reference to
[0093] As shown in
[0094] The at least one diaphragm 100 may include a second diaphragm 20 positioned between the collimating module 44 and the scanning module 46. The second diaphragm 20 may limit the cross-sectional area of the laser beam 9 transmitted from the collimating module 44 towards the scanning module 46. The position or location between the collimating module 44 and the scanning module 46 may be referred to as a second position. Generally, at this position, all beams in the laser processing head are coaxial. For instance, optical beams of coaxial illumination systems or of distance measuring systems, such as optical coherence tomography (OCT), conoscope, intensity-based measuring systems, etc., may be combined with the laser beam by a beam splitter. Thus, the second diaphragm 20 may prevent too high intensity of these optical beams being incident on the following optical elements and reduce a scattering of light for improving a signal to noise ratio or a contrast.
[0095] The at least one diaphragm 100 may include a third diaphragm 30 positioned between the scanning module 46 and the focusing module 50. The third diaphragm 30 may limit the cross-sectional area of the laser beam 9 transmitted from the scanning module 46 towards the focusing module 50. The position or location between the scanning module 46 and the focusing module 50 may be referred to as a third position.
[0096] The at least one diaphragm 100 may include only one of, only two of or all of the first diaphragm 10, the second diaphragm 20 and the third diaphragm 30. For example the at least one diaphragm 100 may include only the first diaphragm 10, or only the second diaphragm 20, or only the third diaphragm 30, or only the first diaphragm 10 and the second diaphragm 20, or only the first diaphragm 10 and the third diaphragm 30, or only the second diaphragm 20 and the third diaphragm 30, or all of the first diaphragm 10, the second diaphragm 20 and the third diaphragm 30.
[0097] In general, the at least diaphragm 100 is positioned optically downstream of the laser entry module 40 and optically upstream of the focusing module 50.
[0098] Hereinafter, structure and function of an exemplary embodiment of the at least one diaphragm 100 is described with reference to
[0099] As shown in
[0100] As previously mentioned, the focusing module 50 may comprise at least one focusing optical element, e.g. one or more focusing lenses. Similarly, the collimating module 44 may comprise at least one collimating optical element, e.g. one or more collimating lenses. Also, the scanning module may comprise at least one scanning optical element, e.g. one or more scanning mirrors. The focusing optical element and/or the collimating optical element and/or the scanning optical element may generally be referred to as the optical element 52.
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[0102] Generally, the diaphragm 100 is positioned upstream of the optical element 52, e.g. upstream of a F-theta lens functioning as the focusing optical element 52. Arrows 9x depict a direction of propagation or travel of the laser beam 9. The diaphragm 100 and the optical element 52 may be disposed to be spaced apart from each other, i.e. may not be in contact with each other.
[0103] The diaphragm 100 limits a cross-sectional area 9c of the laser beam 9 by the diaphragm body 104. In other words, the diaphragm 100 is dimensioned and positioned to allow a first part or portion 91 of the laser beam 9 to pass through the opening 102, while obstructing a second part or portion 92 of the laser beam 9 by the diaphragm body 104. The obstructing may be performed by physically blocking the beam, and for this purpose at least a part of the diaphragm body 104 may be disposed in the path of travel or propagation path of the laser beam 9. In other words, the cross-sectional area 9c of the laser beam 9 is sectioned or divided or cleaved by the diaphragm 100 into a cross-sectional area 91c of the laser beam 9 thereby defining the first portion 91 of the laser beam 9 which is allowed to pass towards the downstream side of the diaphragm 100 through the opening 102, and into a cross-sectional area 92c of the laser beam 9 thereby defining the second portion 92 of the laser beam 9 which is obstructed or stopped at the upstream side of the diaphragm 100 by the diaphragm body 104. In short, a part of the laser beam 9, i.e. the second portion 92, of the laser beam 9 is stopped by the diaphragm body 104 from being propagated or transmitted towards the optical element 52.
[0104] Simply put, as shown in
[0105] In other words, as shown in
[0106] In other words, as shown in
[0107] It may be noted that although
[0108] The diaphragm 100 may be disposed in the path of the laser beam 9 propagating towards the optical element 52, for example propagating towards the focusing module 50 after being deflected by the scanning module 46.
[0109] The laser processing head 1 may include a diaphragm positioning mechanism (not shown) configured to dispose and remove, i.e. reversibly dispose and remove, the diaphragm 100 in and from the path of the laser beam 9 propagating towards the optical element 52. By removing or disposing the diaphragm 100 in the path of the laser beam 9, beam characteristics such as power density distribution and beam size i.e. width or cross-sectional area of the laser beam 9, may be changed.
[0110] The laser processing head 1 may include a diaphragm aligning mechanism (not shown) configured to align, i.e. to move the diaphragm 100 for aligning or orienting the diaphragm 100 with respect to the laser beam 9. In other words, the laser beam 9 may be incident onto a first location on the optical surface 54 of the optical element 52 along with the diaphragm 100 disposed in the beam path, and then the laser beam 9 may be repositioned to be incident onto a second location on the optical surface 54 of the optical element 52. When the laser beam 9 is repositioned, the diaphragm aligning mechanism aligns or repositions the diaphragm 100 accordingly or correspondingly, such that the diaphragm 100 is redisposed or continues to remain disposed in the beam path of the laser beam 9 propagating towards the optical element 52. The movement of the diaphragm 100 for repositioning of the diaphragm 100 may be performed simultaneously along with the scanning movement of the laser beam 9 i.e. while the laser beam 9 is being repositioned by the scanning module 46.
[0111] The diaphragm aligning mechanism may be configured to move the diaphragm parallel to or along the optical axis 100x of the diaphragm 100 and/or parallel to or along the optical axis 52x of the optical element 52 and/or in a plane perpendicular to the optical axis 100x of the diaphragm 100 and/or perpendicular to the optical axis 52x of the optical element 52—to variably or adjustably limit the cross-sectional area 91c of the laser beam 9 passing therethrough. The variable or adjustable limiting of the cross-sectional area 9c of the laser beam 9 has been explained later with respect to
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[0113] The curve 80 represents a typical laser beam 9 having a Gaussian-shaped intensity distribution or an intensity distribution similar to a Gaussian-shaped intensity distribution. I.sub.0 i.e. the maximum value provided on the axis 82 describes the intensity, and correspondingly the power, at its maximum. Radial distance Wo, i.e. distance from the center axis of the laser beam 9 depicts the distance or radius, at which the intensity of the beam drops to 1/e.sup.2 of the maximum. The areas of the beam 9 farther away from the center axis of the beam 9 experience a further drop in intensity, i.e. lesser than 1/e.sup.2, as can be seen from
[0114] As can be seen from
[0115] As explained above, ω.sub.0 is radial distance from the central axis of the laser beam 9 at which the intensity has dropped to 1/e.sup.2 i.e. approx. 13.5%. The energy beyond or outside of the radius ω.sub.0, for example in the region of the laser beam 9 between the lines I and II and between the lines III and IV, may be high enough to heat up and destroy structures but may be too low or little to be used for processing. Thus, the diaphragm 100 is such that the first portion 91 of the laser beam 9 extends from the central axis of the laser beam 9 up to a radial distance ω.sub.0, and the second portion 92 of the laser beam 9 extends beyond or radially outward of radial distance ω.sub.0.
[0116] In other words, the diaphragm 100 may be configured, i.e. positioned and/or oriented and/or dimensioned such that the laser beam 9 passing through the diaphragm has 1/e.sup.2 width or radius of the laser beam 9 received at the diaphragm 100. In other words, the diameter 91d or radius of the first portion 91 of the laser beam 9 is 1/e.sup.2 of the diameter 9d or radius of the laser beam 9 upstream of the diaphragm 100.
[0117] The at least one diaphragm 100 may be configured such that an intensity of the laser beam exiting optically downstream therefrom is between 75% and 90%, preferably between 85% and 87%, and more preferably about 86.5% of a total intensity of the laser beam received at the at least one diaphragm.
[0118] When the at least one diaphragm 100 includes at least two of the first, the second and the third diaphragm 10, 20, 30, the cross-sectional areas of the openings of the first diaphragm 10, the second diaphragm 20 and the third diaphragm 30 may be such that an intensity of the laser beam 9 exiting the diaphragm 100 positioned farthest downstream is between 75% and 90%, preferably between 85% and 87%, and more preferably about 86.5% of a total intensity of the laser beam 9 received at the diaphragm 100 positioned farthest upstream.
[0119] For comparative understanding,
[0120] However, in the laser processing head 1 of the present technique as shown in
[0121] As shown in
[0122] As shown in
[0123] It may be noted that the opening 102 of the diaphragm 100 may be smaller than an aperture of the optical element 52 such as than an aperture of the F-theta lens. However, the function of the diaphragm 100 as explained with reference to
[0124] It may further be noted that although the diaphragm 100 is depicted as one diaphragm 100 at one position, the at least one diaphragm 100 may include a plurality of diaphragms 100a, 100b as shown in
[0125] One or more of each of the first, the second and the third diaphragms 10, 20, 30 may include the upstream and the downstream diaphragms 100a, 100b, as explained hereinabove.
[0126] The at least one diaphragm 100 may be configured to adjustably or variably limit the cross-sectional area of the laser beam 9, i.e. to vary the cross-sectional area 91c of the first portion 91 of the laser beam 9, passing therethrough.
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[0129] It may be noted that the diaphragm aligning mechanism may be configured to simultaneously move the diaphragm 100 along or parallel to the optical axis 100x of the diaphragm 100 and/or along or parallel to the optical axis 52x of the optical element 52 and/or in a plane perpendicular to the optical axis 100x of the diaphragm 100 and/or in a plane perpendicular to the optical axis 52x of the optical element 52—to variably or adjustably limit the cross-sectional area of the laser beam 9 passing therethrough.
[0130] Hereinafter, with reference to
[0131]
[0132]
[0133]
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[0135] As shown in
[0136] As previously mentioned with reference to
[0137] One or more of the sensors 61, 62 of the sensor module 60 may communicate with a processor 48 of the laser processing head 1 or the system 2.
[0138] One or more of the sensors 63, 64 of the sensor module 60 may communicate with the processor 48 of the laser processing head 1. From a difference in sensed temperatures by the temperature sensors 63, 64, the processor 48 may determine a laser power of a portion, e.g. the first portion 91, of the laser beam 9 passed through the opening 102 of the diaphragm 100 and/or to sense a laser power absorbed by the diaphragm body 104.
[0139] The processor 48 may be configured to control the laser source module 42 to adjust a laser power of the laser beam 9 generated by the laser source module 42 according to a sensed or determined laser power of a portion, i.e. the first portion 91, of the laser beam 9 passed through the opening 102 of the diaphragm 100 and/or according to a sensed laser power absorbed by the diaphragm body 104.
[0140] The processor 48 may be configured to control the diaphragm 100 to adjust or vary the cross-sectional area 91c of the laser beam 9 passing through the diaphragm 100, for example according to a sensed or determined laser power of a portion, i.e. the first portion 91, of the laser beam 9 having passed through the opening 102 of the diaphragm 100 and/or according to a sensed laser power absorbed by the diaphragm body 104 and/or according to a scan position of the laser beam deflected by the scanning module.
[0141] The processor 48 may control the diaphragm body 104 or a corresponding actuator to vary or adjust the cross-sectional area 102c of the opening 102 of the at least one diaphragm 100 to variably or adjustably limit the cross-sectional area 91c of the laser beam 9 passing therethrough—as explained with reference to
[0142] The processor 48 may control the diaphragm body 104 or the corresponding aligning mechanism or actuator to move the diaphragm 100 along or parallel to the optical axis 100x of the diaphragm 100 and/or along or parallel to the optical axis 52x of the optical element 52 and/or in a plane perpendicular to the optical axis 100x of the diaphragm 100 and/or in a plane perpendicular to the optical axis 52x of the optical element 52, e.g. according to a scan position of the laser beam deflected by the scanning module, to variably or adjustably limit the cross-sectional area of the laser beam passing therethrough—as explained with reference to
[0143] In a third aspect of the present technique, a method for increasing a scan field S of the laser beam 9 is presented. The method may be for the laser processing head 1 or for the laser processing system 2 as explained hereinabove with reference to
[0144] In the present technique, when a multi-mode laser is used, by inserted the diaphragm 100 between the collimating module 44 and the laser entry module 40, some or all higher transverse modes may be cut off by the diaphragm body 104. The remaining laser beam can be focused to a smaller focus diameter, since the beam parameter product remains constant. The inserted diaphragm 100 may act like an optical fiber with a smaller fiber diameter.
[0145] Thus, it is possible to adjust the beam quality of the laser by inserting or moving an diaphragm 100 along the optical axis between the collimating module and the laser entry module. Thus, a single laser processing head or system can be used to perform both joining tasks that require high laser power but are less demanding in terms of the lateral extension of the joint, and tasks that require a very small focus diameter in order to perform the most precise processing possible. Switching or changing the beam quality and thus the focus size can be done during processing. Also, laser beam sources with a relatively low spatial beam quality, such as diode lasers or multi-mode fiber lasers, may be used with a small and compact scanning module, while maintaining a good processing quality.
[0146] In the present technique, the diaphragm 100 may also be understood as an aperture or stop.
[0147] While the present technique has been described in detail with reference to certain embodiments, it should be appreciated that the present technique is not limited to those precise embodiments. Rather, in view of the present disclosure which describes exemplary modes for practicing the invention, many modifications and variations would present themselves, to those skilled in the art without departing from the scope of the appended claims. The scope of the invention is, therefore, indicated by the following claims rather than by the foregoing description.