An optical device for detecting the drift of a light beam of a laser machining system includes a beam splitter for obtaining a first light beam along a first optical path and a second light beam along a second optical path. The optical device further includes a focal module positioned at least partially along the first optical path to obtain a focused light beam that is directed towards a first light beam matrix detection means positioned in a focusing plane associated with the focal module. The optical device also includes an afocal module positioned at least partially along the second optical path to obtain a collimated light beam that is directed towards a second light beam matrix detection means.

A laser engraving apparatus (100) is calibrated using a number of predetermined calibration images (12). The calibration images (12) are engraved on a predefined substrate surface (14, 15) of a substrate (16) by varying only a single laser parameter. Based on measured colour values of the engraved calibration images, a relationship between said colour values and a predefined laser parameter value, for example, a predefined laser power, is established. This relationship is then used to generate a map for mapping a grayscale value of an input image to a grayscale value of an output image, which is then engraved on the substrate (16) while varying the same laser parameter that was varied during the calibration.

A laser processing system includes a laser oscillator that forms a fusion zone in a workpiece by irradiating a fusion-scheduled region of a processing target surface of the workpiece with a laser beam, a photometer that measures intensity of light from the fusion zone of the workpiece, and a jig disposed on the processing target surface of the workpiece not to overlap the fusion-scheduled region in order to press the workpiece. The jig has a reflection surface inclined in a manner that the reflection surface is further away from the fusion-scheduled region as the reflection surface is further away from the processing target surface in a normal direction of the processing target surface of the workpiece.

A device for introducing patterns by radiating a wound continuous substrate. The device provides patterning during continuous roll-to-roll movement without material slippage and with minimal distortion by providing a dancer roll between a processing drum and an unwinder roll on one side, and a winder roll on the other side, for tautly guiding the continuous substrate along a contact surface of at least half of the circumference of the processing drum in order to drive the continuous substrate without slippage. The dancer rolls are adapted to tautly guide the advancing substrate web and returning substrate web with a constant force, and an equilibrium is adjustable between a defined counterforce and the constant action of force on the dancer roll by a stabilization device, and is maintained constant by a controller based on measured deflections of the dancer roll by controlling the rotational speed of the unwinder and winder rolls.

A laser processing apparatus includes a process laser light source, a first optical system, a pulse laser light source, a second optical system, and an optical detection portion. The process laser light source generates a process laser beam having a continuous energy density during a certain period of time. The first optical system directs the process laser beam to a surface of a workpiece. The pulse laser light source generates a pulse laser beam having an energy density with a peak value that is higher than the energy density of the process laser beam. The second optical system directs the pulse laser beam to a process portion of the workpiece. The optical detection portion detects plasma light produced at the process portion of the workpiece.

A processing apparatus is equipped with: a first stage system that has a table on which a workpiece is placed and moves the workpiece held by the table; a beam irradiation system that includes a condensing optical system to emit beams; and a controller to control the first stage system and the beam irradiation system, and processing is performed to a target portion of the workpiece while the table and the beams from the condensing optical system are relatively moved, and at least one of an intensity distribution of the beams at a first plane on an exit surface side of the condensing optical system and an intensity distribution of the beams at a second plane whose position in a direction of an optical axis of the condensing optical system is different from the first plane can be changed.

A laser processing device includes a support unit, a laser light source, a reflecting spatial light modulator, a light collection optical system, an imaging optical system, a mirror, a first sensor configured to acquire displacement data on a laser light entry surface, and a second sensor configured to acquire displacement data on the laser light entry surface. An optical path of the laser light extending from the mirror to the light collection optical system is set along a first direction. An optical path of the laser light extending from the reflecting spatial light modulator to the mirror through the imaging optical system is set along a second direction. The first sensor is disposed on one side of the light collection optical system in a third direction.

A laser system includes a laser radiation source for emitting light, and an optical fiber unit that includes an optical fiber. The optical fiber includes a light guiding region, an input coupling end having a first fiber end surface for coupling the light into the light guiding region, and an output coupling end having a second fiber end surface for coupling the light out of the light guiding region. The laser system further includes a coupling device for coupling the light into the optical fiber unit, a reflection element configured to reflect the light coupled out of the light guiding region back toward the second fiber end surface to be coupled back into the light guiding region via the second fiber end surface, and a measuring device configured to capture the light reflected by the reflection element.

An optical fiber unit includes an optical fiber. The optical fiber includes a light guiding region configured for guiding light through the optical fiber, an input coupling end having a first fiber end surface for coupling the light into the light guiding region, and an output coupling end having a second fiber end surface for coupling the light out of the light guiding region. The optical fiber unit further includes a first end piece arranged at one of the input coupling end and the output coupling end. The first end piece is configured to couple the light into the light guiding region or couple the light out of the light guiding region. The first end piece includes a reflection element configured to divert a portion of the light propagating along a direction of propagation through the light guiding region away from the direction of propagation.

A machining condition adjustment device adjusts settings of an ionizer so as to neutralize a charge carried by plasma generated during laser beam machining of a workpiece by a laser beam machining device, calculates an amount of charge per unit time that is to be radiated from the ionizer, based on the amount of charge carried by the plasma generated during the laser beam machining, and sets the ionizer to radiate the calculated amount of charge per unit time.