A device is provided for cleaning and/or replacement of a laser window of a process chamber, enclosed by an outer wall, containing a modified atmosphere, in particular a process chamber for layered printing of a 3D object by a technique such as Selective Laser Sintering (SLS), where this device features an opening in the outer wall that is fitted with the laser window and where this laser window allows a laser beam from a laser source located outside of the process chamber into the process chamber, where an external sealing ring is provided that extends between the outer wall and this laser window. A method is also provided for cleaning and/or replacement of the laser window in the opening of the outer wall of the enclosed process chamber.

A laser reflow apparatus capable of reducing tact time for a single bonding object, and accelerating an overall bonding process for all of a plurality of bonding objects is provided. The laser reflow apparatus comprises a bonding object transfer unit including a stage, a laser emission unit, a beam transmission plate, and a beam transmission plate transfer unit.

A laser etching apparatus includes a chamber, a laser port, a laser emitter, a particle grabber, and a revolving window module. The chamber is configured to receive a substrate. The laser port is disposed below the chamber in a downward direction. The laser emitter is configured to emit a laser to the substrate disposed within the chamber through the laser port. The particle grabber is disposed within the chamber and includes a body disposed over the laser port. An opening is formed through the body. The opening is configured to pass the laser therethrough. The revolving window module includes a revolving window and a driving part configured to drive the revolving window. The revolving window is disposed between the particle grabber and the laser port.

A debris control apparatus is provided for selective assembly and disassembly with a cutting tool. The debris control apparatus includes a debris control enclosure and a mounting assembly for mounting the enclosure to the cutting tool. The enclosure comprises a vacuum opening assembled and in fluid communication with a vacuum conduit, the vacuum conduit connected to a vacuum source, for extracting the debris from the enclosure. The enclosure and vacuum conduit may be sized, shaped, and contoured to reduce recirculation of debris within the enclosure.

A laser device includes a condensing assembly for condensing laser light output from a laser oscillator and a cover for accommodating the condensing assembly, the cover including protection windows permeable to the laser light on an optical path of the laser light. The protection windows include at least one first protection window having a positive refractive index temperature coefficient and at least one second protection window having a negative refractive index temperature coefficient, the at least one first protection window and the at least one second protection window being arranged along the optical path of the laser light.

A spatter protection system for an additive manufacturing machine can include a sheet configured to be disposed over a build area of the additive manufacturing machine. The sheet can include an aperture configured to allow a spatter from the build area to eject through the aperture during energy application and to land on a back side of the sheet to prevent the spatter from landing on the build area. The system can include a motive system supporting the sheet and configured to move the sheet to locate the aperture over an energy application area.

A laser processing apparatus 3 includes: a laser head H; a head driving mechanism that moves the laser head H above a workpiece W; and a dust collecting box 60 that moves below the workpiece W and follows the laser head H. A non-contact support unit 7 is provided at an opening 61 of the dust collecting box 60, and the non-contact support unit 7 suctions a lower surface of the workpiece W toward a suction surface 71 and supports the workpiece W without bringing the lower surface of the workpiece W and the suction surface 71 into contact with each other. An outer support roller 81 and an inner support roller 82 that are each rotatable about an axis parallel to a width direction orthogonal or substantially orthogonal to a conveying direction Fy are provided at the opening 61.

Systems and methods are disclosed for an enclosure providing a sealed environment. The enclosure employs movable paneling that seals an area for a laser welding cell, while allowing access for an operator to load a workpiece in and unload the workpiece from a welding cell. Barriers are arranged on the enclosure, such that in a closed configuration activation of a pneumatic tube forces the barriers to extend toward a rotated paneling, such that the edges of the enclosure contact or overlap with the edges of the paneling to result in a light-tight seal. Presence of the fluid increases the pressure in the tube such that an external boundary of the tube expands, forcing the barrier toward the edges of the paneling, thereby closing the gap and providing a light-tight enclosure.

A laser processing device includes a laser irradiation unit that performs processing on a workpiece by using a laser while scanning a workpiece surface to form a kerf, jet nozzles that respectively form jet flows flowing toward a bottom surface of the kerf on front and rear sides in a scanning direction of the laser, and an intake part that sucks, above injection ports of the jet nozzles, a gas in a region surrounded by the jet flows from the front and rear sides. In a state in which a certain region of the kerf is isolated by the jet flows, the gas is sucked from this region by the intake part. As a result, a suction force by the intake part can reach the bottom surface of the kerf.

A laser processing apparatus 3 includes: a laser head H; a head driving mechanism that moves the laser head H above a workpiece W; and a dust collecting box 60 that moves below the workpiece W and follows the laser head H. A non-contact support unit 7 is provided at an opening 61 of the dust collecting box 60, and the non-contact support unit 7 suctions a lower surface of the workpiece W toward a suction surface 71 and supports the workpiece W without bringing the lower surface of the workpiece W and the suction surface 71 into contact with each other. An outer support roller 81 and an inner support roller 82 that are each rotatable about an axis parallel to a width direction orthogonal or substantially orthogonal to a conveying direction Fy are provided at the opening 61.