Provided is a manufacturing method in which a coated solder wire having a dense polysiloxane coating film that is uniformly provided over the entire surface of the solder wire can be efficiently obtained in a single process. A coated solder wire is obtained by a manufacturing method that includes; a radicalization step for forming a radicalized organic silicon compound by mixing a reaction gas that has been plasmatized under atmospheric pressure and an organic silicon compound that is introduced by way of a carrier gas, and radicalizing that organic silicon compound; a reaction area formation step for forming a reaction area that is defined by a helical gas flow and in which the radicalized organic silicon compound is uniformly dispersed; and a coating step for forming a 4 nm to 200 nm thick polysiloxane coating film on the surface of a solder wire by transporting a solder wire inside the reaction area and causing the radicalized organic silicon compound to react with metal on the surface of that solder wire.

An improved method for forming a capacitor is provided as is a capacitor, or electrical component, formed by the method. The method includes providing an aluminum containing anode with an aluminum oxide dielectric thereon; forming a cathode on a first portion of the aluminum oxide dielectric; bonding an anode lead to the aluminum anode on a second portion of the aluminum oxide by a transient liquid phase sintered conductive material thereby metallurgical bonding the aluminum anode to the anode lead; and bonding a cathode lead to said cathode.

An aluminum wire body, in which an aluminum or aluminum alloy electric wire and a metal to be joined are joined by solder, wherein the solder includes an oxide glass including vanadium and a conducting particle. Preferably, the conducting particle contained in the solder is 90% by volume or less and the oxide glass is 20% by volume to 90% by volume. Further preferably, the oxide glass includes 40% by mass or more of Ag.sub.2O in terms of oxides and the glass transition point is 180° C. or less.

The present disclosure provides a plow blade edge device for mounting to a moldboard of a plow comprising at least one adapter blade including a bottom edge having selectively carbide insert(s) along at least a portion of the bottom edge. The disclosure further provides for a method of brazing the carbide insert(s) in a cavity along at least a portion of the bottom edge. The device further includes at least one wear block selectively reversible to present the adapter blade at a first angle or a second angle. The at least one wear block can include a bottom edge having a carbide insert along at least a portion of the bottom edge.

Provided are a Cu column, a Cu core column, a solder joint, and a through-silicon via, which have the low Vickers hardness and the small arithmetic mean roughness. For the Cu column 1 according to the present invention, its purity is equal to or higher than 99.9% and equal to or lower than 99.995%, its arithmetic mean roughness is equal to or less than 0.3 μm, and its Vickers hardness is equal to or higher than 20 HV and equal to or less than 60 HV. Since the Cu column 1 is not melted at a melting temperature in the soldering and a definite stand-off height (a space between the substrates) can be maintained, it is preferably applied to the three dimensional mounting or the pitch narrowing mounting.

This disclosure includes the description of a braze alloy composition. The braze composition contains nickel, about 5% by weight to about 25% by weight germanium; and about 1% by weight to about 4% by weight boron. The composition has an amorphous structure, and is free of silicon.

A clad material includes a core material, a first skin material covering one side of the core material, and a second skin material covering the other side of the core material. The clad material is brazed in a state in which the first and second skin materials overlap each other. The core material is made of an Al alloy containing Mn (0.6 to 1.5 mass %), Ti (0.05 to 0.25 mass %), Cu (less than 0.05 mass %), Zn (less than 0.05 mass %), Fe (0.2 mass % or less), and Si (0.45 mass % or less) (balance: Al and unavoidable impurities). The first skin material is made of an Al alloy containing Si (6.8 to 11.0 mass %) and Zn (0.05 mass % or less) (balance: Al and unavoidable impurities). The second skin material is made of an Al alloy containing Si (4.0 to 6.0 mass %) and Cu (0.5 to 1.0 mass %) (balance: Al and unavoidable impurities).

The present invention provides a solder alloy, a solder paste, a solder ball, a resin flux-cored solder and a solder joint, both of which has the low-melting point to suppress the occurrence of the fusion failure, improves the ductility and the shear strength, and has excellent heat-cycle resistance. The solder alloy comprises an alloy composition composed of 35 to 68 mass % of Bi, 0.1 to 2.0 mass % of Sb, 0.01 to 0.10 mass % of Ni, and a balance of Sn. The alloy composition may contain at least one of Co, Ti, Al and Mn in total amount of 0.1 mass % or less. The solder alloy may be suitably used for a solder paste, a solder ball, a resin flux-cored solder and a solder joint.

A brazing or soldering wire has a pair channels recessed therein. A divider separates the pair of channels. The divider has opposing walls extending outwardly from corresponding base portions of the pair of channels. A first engagement surface is located between the opposing walls. A pair of outer walls is separated by the pair of channels and the divider. A second engagement surface is formed between an outer surface of the elongated wire and a terminal end of one of the outer walls and is substantially coplanar with the first engagement surface. A third engagement surface is formed between the outer surface of the elongated wire and a terminal end of the other of the outer walls and is substantially coplanar with the first engagement surface. A cured flux solution is located within the pair of channels.

A method includes disposing a braze material adjacent a first body and a second body; heating the braze material and forming a transient liquid phase; and transforming the transient liquid phase to a solid phase and forming a bond between the first body and the second body. The braze material includes copper, silver, zinc, magnesium, and at least one material selected from the group consisting of nickel, tin, cobalt, iron, phosphorous, indium, lead, antimony, cadmium, and bismuth.