A lead-free silver-free solder alloy may comprise tin, copper, bismuth, cobalt, and antimony. Alternatively, the alloy may comprise gallium in lieu of cobalt. The alloy may further comprise nickel, germanium, or both. The copper may be present in an amount from about 0.5% to 0.9% by weight of the solder. The bismuth may be present in an amount from about 1.0% to about 3.5% by weight of the solder. The cobalt may be present in an amount from about 0.02% to about 0.08% by weight of the solder. Where gallium is used in lieu of cobalt, the gallium may be present in an amount from about 0.2% to about 0.8% by weight of the solder. The antimony may be present in an amount between about 0.0% to about 0.09% by weight of the solder. The balance of the solder is tin.

A lead-free solder alloy may comprise tin, silver, copper, bismuth, cobalt, titanium, and antimony. The alloy may further comprise antimony, nickel, or both. The silver may be present in an amount from about 3.1% to 3.8% by weight of the solder. The copper may be present in an amount from about 0.5% to 0.8% by weight of the solder. The bismuth may be present in an amount from about 0.0% (or 1.5%) to about 3.2% by weight of the solder. The cobalt may be present in an amount from about 0.03% to about 1.0% (or 0.05%) by weight of the solder. The titanium may be present in an amount from about 0.005% to about 0.02% by weight of the solder. The antimony may be present in an amount between about 1.0% to about 3.0% by weight of the solder. The balance of the solder is tin.

A copper-tin brazing wire and a preparation method and use thereof are provided. A copper-tin brazing wire includes a plurality of copper wires each having a composite metal layer on a surface thereof; the copper-tin brazing wire includes, in parts by weight, 75-84 parts of Cu, 20-25 parts of Sn, and 0.4-0.5 parts of P; and the composite metal layer includes Cu, Sn, and P, in which a mass ratio of Cu, Sn, and P is (45-55):(46-56):(0.5-1.5).

The present invention relates to a method of producing a composite rod from a braze material and a sheet of material comprising cermet. The method comprises scoring a surface of the sheet to produce at least one line of localised stress and subsequently causing the sheet to break along the line or localised stress, thereby to produce a plurality of cermet chunks. The cermet chunks can be combined with the braze material to produce the composite rod. In a particular embodiment, the sheet of material may be a used cermet cutting tip.

A solder alloy has an alloy composition consisting of, in mass%, Cu: 0.1% to 2.0%, Ni: 0.01% to 0.4%, P: 0.001% to 0.08%, and Ge: 0.001% to 0.08%, with the balance being Sn. The alloy composition satisfies the following relations (1) to (3): (Cu+5Ni)≤0.945% (relation (1)), (P+Ge)≤0.15% (relation (2)), 2.0≤(Cu+5Ni)/(P+Ge)≤1000 (relation (3)). In the above relations (1) to (3), Cu, Ni, P, and Ge each represents a content (mass %) thereof in the solder alloy.

A composite material comprising a plurality of round particles bound together by a binding material. Each of the plurality of round particles includes a wear resistant element, an intermediate coating on the wear resistant element, and a round outer layer encapsulating the intermediate coating and the wear resistant element. The intermediate coating is metallurgically bonded to the wear resistant element, and is metallurgically bondable to the binding material.

The present invention relates to a method of producing a composite rod from a braze material and a sheet of material comprising cermet. The method comprises scoring a surface of the sheet to produce at least one line of localised stress and subsequently causing the sheet to break along the line of localised stress, thereby to produce a plurality of cermet chunks. The cermet chunks can be combined with the braze material to produce the composite rod. In a particular embodiment, the sheet of material may be a used cermet cutting tip.

Embodiments of the present invention provides an approach for repairing defects in a structure, located in difficult to reach area, by using a self-guiding and self-melting robotic thread. The approach can use an external guidance system to find the target location of the structure and deploy a robotic thread to the defective area. Portion of the robotic thread contains a filler material can have similar materials to the structure. After the system has determined the size, length and volume of the repair, the system calculates the required length of the robotic thread and guides the thread to the defective area. Once the robotic thread is in place, the filler material begins to melt via heat. The filler material, in a melted and pliable state, can flow into the defect area. Once cooled, the filler material can now support the structure.

A lead-free silver-free solder alloy may comprise tin, copper, bismuth, cobalt, and antimony. Alternatively, the alloy may comprise gallium in lieu of cobalt. The alloy may further comprise nickel, germanium, or both. The copper may be present in an amount from about 0.5% to 0.9% by weight of the solder. The bismuth may be present in an amount from about 1.0% to about 3.5% by weight of the solder. The cobalt may be present in an amount from about 0.02% to about 0.08% by weight of the solder. Where gallium is used in lieu of cobalt, the gallium may be present in an amount from about 0.2% to about 0.8% by weight of the solder. The antimony may be present in an amount between about 0.0% to about 0.09% by weight of the solder. The balance of the solder is tin.

A copper-based brazing material comprises an alloy having nickel in a proportion of from 20 to 35 percent by weight, zinc in a proportion of from 5 to 20 percent by weight, manganese in a proportion of from 5 to 20 percent by weight, chromium in a proportion of from 1 to 10 percent by weight, silicon in a proportion of from 0.1 to 5 percent by weight and molybdenum in a proportion of from 0 to 7 percent by weight, each based on the total weight of the alloy, and the remainder being copper and unavoidable impurities. The alloy is in particular free from boron, phosphorus and lead. The brazing material can be used for induction brazing of components made of iron materials for exhaust systems in motor vehicles.