Patent classifications
B23K35/0227
NICKEL BASED SUPERALLOY BRAZE FILLER
A weld filler is proposed which significantly improves the weldability of some nickel-based superalloys and includes the following constituents (in wt %): 11.2%-15.6% chromium (Cr), 9.6%-11.4% cobalt (Co) 2.4%-5.0%, molybdenum (Mo) 0.1%-3.3%, 4.4%-7.5% tungsten (W), 1.4%-2.6% tantalum (Ta), 3.0%-4.8% aluminum (Al), 0.4-1.0% titanium (Ti), 0.07%-0.08% carbon (C), 0.5%-1.4% hafnium (Hf), trace elements, and remainder nickel. A method is also provided. The method includes providing a nickel-based substrate to weld, applying a ductile weld filler having a closely matched coefficient of thermal expansion to a surface of the substrate, applying heat to melt the weld filler to form molten weld filler, welding the substrate with the weld filler at ambient temperature, and resolidifying the molten weld filler to form a solidified joint material.
Process for Producing Tinned Copper Wires
Provided is a process for producing a tinned copper wire. The process comprises subjecting a copper wire sequentially to activation treatment, a first hot tinning treatment, a first cooling, a second hot tinning treatment, and a second cooling to obtain a tinned copper wire. The first hot tinning treatment is carried out at a first temperature and the second hot tinning treatment is carried out at a second temperature. The first temperature is higher than the second temperature. The first temperature is at least 38° C. higher than the melting point of tin. The second temperature is at least 8° C. higher than the melting point of tin.
NICKEL BASED SUPERALLOY WELD FILLER
A weld filler is proposed which significantly improves the weldability of some nickel-based superalloys and includes the following constituents (in wt %): 14.6%-15.6% chromium (Cr), 10.4%-11.4% cobalt (Co) 4.6%-5.0%, molybdenum (Mo), 4.4%-5.2% tungsten (W), 1.4%-1.8% tantalum (Ta), 3.0%-3.7% aluminum (Al), 0.7-1.3% titanium (Ti), 0.14%-0.16% carbon (C), 0.0425-0.0575% zirconium, 0.7%-1.2% hafnium (Hf), at most 0.15% iron, at most 0.1% manganese, at most 0.1% silicon, at most 0.1% vanadium, at most 0.015% boron, trace elements, and remainder nickel.
Copper-based brazing material and use of the brazing material
A copper-based brazing material comprises an alloy having nickel in a proportion of from 20 to 35 percent by weight, zinc in a proportion of from 5 to 20 percent by weight, manganese in a proportion of from 5 to 20 percent by weight, chromium in a proportion of from 1 to 10 percent by weight, silicon in a proportion of from 0.1 to 5 percent by weight and molybdenum in a proportion of from 0 to 7 percent by weight, each based on the total weight of the alloy, and the remainder being copper and unavoidable impurities. The alloy is in particular free from boron, phosphorus and lead. The brazing material can be used for induction brazing of components made of iron materials for exhaust systems in motor vehicles.
Cost-effective lead-free solder alloy for electronic applications
A lead-free silver-free solder alloy may comprise tin, copper, bismuth, cobalt, and antimony. Alternatively, the alloy may comprise gallium in lieu of cobalt. The alloy may further comprise nickel, germanium, or both. The copper may be present in an amount from about 0.5% to 0.9% by weight of the solder. The bismuth may be present in an amount from about 1.0% to about 3.5% by weight of the solder. The cobalt may be present in an amount from about 0.02% to about 0.08% by weight of the solder. Where gallium is used in lieu of cobalt, the gallium may be present in an amount from about 0.2% to about 0.8% by weight of the solder. The antimony may be present in an amount between about 0.0% to about 0.09% by weight of the solder. The balance of the solder is tin.
Aluminum alloy welding wire
A composition for welding or brazing aluminum comprises silicon (Si) and magnesium (Mg) along with aluminum in an alloy suitable for use in welding and brazing. The Si content may vary between approximately 5.0 and 6.0 wt %, and the Mg content may vary between approximately 0.15 wt % and 0.50 wt %. The alloy is well suited for operations in which little or no dilution from the base metal affects the Si and/or Mg content of the filler metal. The Si content promotes fluidity and avoids stress concentrations and cracking. The Mg content provides enhanced strength. Resulting joints may have a strength at least equal to that of the base metal with little or no dilution (e.g., draw of Mg). The joints may be both heat treated and artificially aged or naturally aged.
Lead-free and antimony-free tin solder reliable at high temperatures
A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises up to 10 wt % Ag, up to 10 wt % Bi, up to 3 wt % Cu, other optional additives, balance tin, and unavoidable impurities.
COATED WIRE
A wire comprising a wire core with a surface, the wire core having a coating layer superimposed on its surface, wherein the wire core itself consists of: (a) pure silver consisting of (a1) silver in an amount in the range of from 99.99 to 100 wt.-% and (a2) further components in a total amount of from 0 to 100 wt.-ppm or (b) doped silver consisting of (b1) silver in an amount in the range of from >99.49 to 99.997 wt.-%, (b2) at least one doping element selected from the group consisting of calcium, nickel, platinum, palladium, gold, copper, rhodium and ruthenium in a total amount of from 30 to <5000 wt.-ppm and (b3) further components in a total amount of from 0 to 100 wt.-ppm, or (c) a silver alloy consisting of (c1) silver in an amount in the range of from 89.99 to 99.5 wt.-%, (c2) at least one alloying element selected from the group consisting of nickel, platinum, palladium, gold, copper, rhodium and ruthenium in a total amount in the range of from 0.5 to 10 wt.-% and (c3) further components in a total amount of from 0 to 100 wt.-ppm, or (d) a doped silver alloy consisting of (d1) silver in an amount in the range of from >89.49 to 99.497 wt.-%, (d2) at least one doping element selected from the group consisting of calcium, nickel, platinum, palladium, gold, copper, rhodium and ruthenium in a total amount of from 30 to <5000 wt.-ppm, (d3) at least one alloying element selected from the group consisting of nickel, platinum, palladium, gold, copper, rhodium and ruthenium in a total amount in the range of from 0.5 to 10 wt.-% and (d4) further components in a total amount of from 0 to 100 wt.-ppm, wherein the at least one doping element (d2) is other than the at least one alloying element (d3), wherein the individual amount of any further component is less than 30 wt.-ppm, wherein the individual amount of any doping element is at least 30 wt.-ppm, wherein all amounts in wt.-% and wt.-ppm are based on the total weight of the core, and wherein the coating layer is a double-layer comprised of a 1 to 1000 nm inner layer of gold and an adjacent 0.5 to 100 nm thick outer layer of palladium or a double-layer comprised of a 0.5 to 100 nm thick inner layer of palladium and an adjacent >200 to 1000 nm thick outer layer of gold.
HIGH-PERFORMANCE Al-Zn-Mg-Zr BASE ALUMINUM ALLOYS FOR WELDING AND ADDITIVE MANUFACTURING
Aluminum-zinc-magnesium-zirconium base alloys and aluminum-zinc-magnesium-copper-zirconium base alloys that exhibit ultra-high strength and superior weldability, and methods of fabricating them.
Filler wire for brazing aluminum and steel
A filler wire may include a rod including an aluminum-silicon (Al—Si) alloy powder and a fluoride flux powder, and a sheath including zinc (Zn) alloy and surrounding the rod.