The present disclosure provides a copper-phosphorus-tin brazing wire and a preparation method thereof, relates to the technical field of brazing materials. The copper-phosphorus-tin brazing wire is of a three-layer structure, the inner layer is Cu, the middle layer is Cu-14P alloy, and the outer layer is Sn, wherein the mass percentage of Sn is over 7%. The present disclosure solves the technical problems in the prior art that the copper-phosphorus-silver brazing filler metal is prone to produce defects such as pores and inclusions when brazing copper alloys, which leads to the decline of the mechanical properties of the joint, and simultaneously provides the preparation method of the copper-phosphorus-tin brazing wire, such that the technical problem that it is difficult to obtain copper-phosphorus-tin brazing wire with a wire diameter below 0.5 mm under the condition of high Sn content is solved.

A system for manufacturing of a sintered wire and in-situ feeding to a laser wire welding system is presented. The system includes a pressure vessel connected to a powder feed system for delivering at least two powders to a powder mixing zone of the pressure vessel. The at least two powders are mixed via a rotating cone in the pressure vessel. After mixing, a heating device contained within the pressure vessel heats the mixture so that liquid phase sintering occurs and a sintered rod is created. The sintered wire is continuously fed to a laser metal deposition system for depositing a layer of additive material on a base material. A method of additively manufacturing or repairing a superalloy component is also presented.

A wire comprising a wire core with a surface, the wire core having a coating layer superimposed on its surface, wherein the wire core includes: (a) pure silver consisting of silver and further components; or (b) doped silver consisting of silver, at least one doping element, and further components; or (c) a silver alloy consisting of silver, palladium and further components; or (d) a silver alloy consisting of silver, palladium, gold, and further components; or (e) a doped silver alloy consisting of silver, palladium, gold, at least one doping element, and further components, wherein the individual amount of any further component is less than 30 wt.-ppm and the individual amount of any doping element is at least 30 wt.-ppm, and the coating layer is a single-layer of gold or palladium or a double-layer comprised of an inner layer of nickel or palladium and an adjacent outer layer of gold.

A universal approach is described to produce welding filler materials with enhanced grain refining, for making welded objects with hot-crack resistance. Some variations provide a welding filler material comprising a functionalized metal-containing powder, wherein the functionalized metal-containing powder comprises metal or metal alloy particles and a plurality of nanoparticles disposed on surfaces of the metal or metal alloy particles, and wherein the nanoparticles are consolidated in a three-dimensional architecture throughout the welding filler material. A welded object contains a welding filler material comprising the functionalized metal-containing powder, enabling the welded object to be free of hot cracks. Other variations provide methods of making a welding filler material. This approach has been successfully demonstrated by incorporating zirconium-based nanoparticle grain refiners within a welding precursor material for welding aluminum alloy Al 7075, as one non-limiting example.

Implementations of the disclosure are directed to improving the ductility of a tin-enriched AuSn solder alloy by doping the solder alloy with Germanium (Ge). The final AuSnGe alloy may consist of 75 to 80 wt % Au, 20 to 25 wt % Sn, and 0.05 to 1.5 wt % Ge.

Disclosed herein are embodiments of lead-free (Pb-free) or lead-bearing solder column devices that can include an inner core, an outer sleeve surrounding a portion of the inner core, at least one space along a length of the outer sleeve, and a second layer including a solder material coupled with a portion of the inner core within the at least one space. The inner core can be configured to support the solder column so as to prevent a collapse of the solder column at temperatures above a liquidus temperature of the outer sleeve's solder material and the second layer's solder material. The column serves as a heat-sink to conduct excessive heat away from a heat generating semiconductor chip. Moreover, the compliant solder column absorbs strain and mechanical stress caused by a difference in the coefficient of thermal expansion (CTE) connecting the semiconductor chip to a printed circuit board (PCB).

The invention relates to a shaped, small diameter brazing preform for brazing components to one another, the preform comprising a length of aluminium-based filler alloy wire having a continuous, uniform cavity in a centre of the preform along its length, and a brazing flux material retained within the cavity, and wherein the aluminium-based filler alloy has a composition comprising, in wt. %, Si 7-14%, Zn 0.5-%, Cu 1.0-2.0%, balance aluminium, and having a liquidus temperature in a range of 560 C. to 585 C.

An aluminium extrusion material for use in a hybrid metal extrusion and bonding process is provided. The composition of the extrusion material comprises: 0 to 0.25 wt % iron; at least 0.05 wt % dispersoid-forming elements, wherein the dispersoid-forming elements comprise 0 to 1.2 wt % manganese, 0 to 0.25 wt % chromium, 0 to 0.25 wt % zirconium and 0 to 0.25 wt % scandium; and, except when the aluminium alloy of the aluminium extrusion material is in the 2xxx series, 0 to 0.05 wt % copper. The microstructure of the extrusion material is a deformed microstructure; and the nanostructure of the extrusion material comprises an aluminium matrix with dislocations and dispersoids, and wherein the majority of the alloying elements are in solid solution in the aluminium matrix. An aluminium rod for manufacturing the extrusion material, a joint comprising a extrudate made from the extrusion material a method of manufacturing the extrusion material and the aluminium rod and a method of joining two aluminium components using the extrusion material are also provided.

The disclosure relates to a method for welding steel sheets made of steel materials coated with an aluminum silicon anti-corrosion layer, in particular CMnB and CMn steel materials that can be hardened using the quench hardening method, wherein a welding filler rod is used in the welding of the sheets and the welding filler rod has the composition: C=0.80-2.28% C base material, Cr=8-20, Ni<5, Si=0.2-1, Mn=0.2-1, Mo<2, with the rest being composed of iron and unavoidable smelting-related impurities and with all indications expressed in % by mass.

Provided is a solder alloy that contains 0.01 mass % or more and 0.1 mass % or less of Fe, 0.005 mass % or more and less than 0.02 mass % of Co, 0.1 mass % or more and 4.5 mass % or less of Ag, 0.1 mass % or more and 0.8 mass % or less of Cu, and the balance being Sn.