A lead-free solder alloy comprising from 35 to 59 wt % Bi; from 0 to 1.0 wt % Ag; from 0 to 1 wt % Cu; from 0 to 0.5 wt % Co; from 0.0001 to 1.0% Sb; and the balance Sn, together with any unavoidable impurities.

A flux applying device for applying flux to a surface of solder, wherein the flux applying device includes: a dipping means that applies the flux to the surface of the solder by dipping the solder into the flux; a load applying means that applies a predetermined load to the solder, the load applying means being provided at a upstream side of the dipping means; a constant speed conveying means that conveys the solder at a predetermined speed with being under load by the load applying means; a drying means that dries the solder to which the flux is applied; a cooling means that cools the dried solder; a conveying speed measurement means that measures a conveying speed of the solder; and a control means that controls the conveying speed of the solder.

A lead-free solder alloy comprising from 35 to 59 wt % Bi; from 0 to 1.0 wt % Ag; from 0.05 to 0.4 wt % Cu; from 0 to 0.5 wt % Co; and the balance Sn, together with any unavoidable impurities.

The present invention relates to an aluminum alloy brazing sheet with a thickness of 0.30 nm or less, including: a core material; a sacrificial material cladding one surface of the core material; and a brazing material cladding the other surface of the core material, in which the core material is made of A1MnSi-based aluminum alloy containing by mass %, Cu: 0.5 to 1.3%, the sacrificial material is made of aluminum alloy containing, by mass %, Zn: 4.0 to 7.0%, the brazing material is made of aluminum alloy containing, by mass %, Si: 6.0 to 11.0% and Zn: 0.1 to 3.0%, in a pitting potential after brazing beat treatment, a thickness of a region in which a potential difference from the noblest potential in the core material is 100 mV or more is 10% to 50% of the thickness of the brazing sheet.

The invention relates to a solder alloy comprising a mass fraction from at least 35% to at most 62% of silver, a mass fraction from at least 10% to at most 30% of copper, a mass fraction from at least 10% to at most 26% of zinc, wherein the remaining mass fractions to 100%, except for unavoidable impurities, comprise at least one element selected from a group consisting of tin, gallium, manganese, nickel, and indium.

A welding tape for thermally connecting metal workpieces by fusion, wherein the welding tape in a cross section has an outwardly closing cover layer which comprises an inner cover layer and an outer cover layer, wherein in the transverse direction provision is made at least in side edge regions of the inner cover layer for adhesive layers by means of which the welding tape can be fastened to the workpieces to be connected, wherein in the interior of the cover layer provision is made for a self-combusting exothermic substance, which during ignition provides the thermal energy which is required for the welding, wherein a non-combustible heat shield is arranged exclusively between the exothermic substance and the outer cover layer, and wherein a welding additive is provided between the exothermic substance and the inner cover layer.

This brazed structure includes a brazing sheet that has been brazed and that comprises: a core material comprising an aluminum alloy which contains 0.3-1.0 mass %, excluding 0.3 mass %, Si, 0.6-2.0 mass %, excluding 0.6 mass %, Mn, 0.3-1.0 mass %, excluding 0.3 mass %, Cu, and 0.15-0.5 mass %, excluding 0.15 mass %, Mg, with the remainder comprising Al and unavoidable impurities, and has an average crystal grain diameter of 50 m or larger and in which an MgSi intermetallic compound and an AlMgSiCu intermetallic compound account for 40% or less of the grain boundaries; and, clad to the core material, a brazing material comprising an AlSi alloy.

The invention belongs to the field of additive manufacturing of amorphous alloy, and discloses a laser 3D printing forming system of amorphous alloy foil and a forming method thereof. The unnecessary material of the amorphous alloy foil is cut by a first laser and then the remaining portion is selectively scanned and heated by a second laser so that the amorphous alloy is heated to be in a superplastic state in the supercooled liquid region. Then, the amorphous alloy foil is rolled by a preheated roller in combination with the ultrasonic vibration to achieve interatomic bonding between layers of the amorphous alloy foil, and the amorphous alloy foil is then rapidly cooled, so that an amorphous alloy part with a large size, a complicated shape and a porous structure is formed. The invention has overcome the limitation of the size and shape of the amorphous alloy prepared by the traditional amorphous alloy preparation methods, and uses amorphous alloy foil as a raw material, which has lower cost than the traditional 3D printing amorphous powder. In addition, a roller is used to roll the ultra-thin amorphous alloy foil such that the prepared amorphous alloy part has a more compact internal structure.

The present disclosure relates to a bonding system (100) comprising an adhesive (200), in contact with a first contact surface (115) and a second contact surface (125), and a solder mesh (310) positioned in the adhesive (200) in contact with the first contact surface (115). Also, the present disclosure relates to a bonding method to produce a solder-reinforced adhesive bond joining a first substrate (110) and a second substrate (120), comprising applying, on a first contact surface (115) of the first substrate (110), an adhesive (200), positioning, at least partially into the adhesive (200), a solder mesh (310), such that the solder mesh (310) contacts the first contact surface (115), connecting, to a portion of the adhesive (200) opposite the first contact surface (115), a second contact surface (125) of the second substrate (120), and applying heat to the first contact surface (115) such that at least one portion of the solder mesh (310) reaches a solder-bonding temperature.

Some forms relate to an electronic assembly includes a first substrate that has a copper pad mounted to the first substrate. The electronic assembly further includes a second substrate that includes a copper redistribution layer mounted on the second substrate. The electronic assembly further includes bismuth-rich solder that includes 10-40 w.t. % tin. The bismuth-rich solder is electrically engaged with the copper pad and the copper redistribution layer. In some forms, the copper redistribution layer is another copper pad. The first substrate may include a memory die and the second substrate may include a logic die. In other forms, the first and second substrates may be part of a variety of different electronic components. The types of electronic components that are associated with the first and second substrates will depend on part on the application where the electronic assembly is be utilized (among other factors).