Embodiments of the present disclosure relate to an alloy as a brazing alloy for an electric switch braze joint, an electric switch braze joint, an electric switch and a method of producing an electric switch braze joint. The alloy composition of said the alloy consists of at least one element selected from each of group I and group II listed below, and a balance of impurities, Ag, and at least one of Cu, and Zn. Group I encompasses Cd, Mn, Ni, P, Sb, Si, Sn, Ti, and oxides thereof in a total amount of 0.5 to 45.0 wt. %. Group II encompasses Bi, Mo, Te, W, and oxides thereof, oxides of Cu and Zn in a total amount of 0.1 to 15.0 wt. %.

A multi-layered brazing sheet material including an aluminum core alloy layer, a brazing clad layer material on one face of the core layer, an inter-layer between the core layer and brazing clad layer material, and a water-side layer on the other face of the core layer. The core layer made from aluminum alloy having, in wt. %, up to 0.6% Si, up to 0.45% Fe, 0.6% to 1.25% Cu, 0.6% to 1.4% Mn, 0.08% to 0.4% Mg, up to 0.2% Cr, up to 0.25% Zr, up to 0.2% Ti, up to 0.3% Zn, balance aluminum and impurities. The brazing layer made from aluminum alloy having 6% to 14% Si and up to 2% Mg, balance aluminum and impurities. The inter-layer made from 1xxx-series aluminum alloy. The water-side layer made from 3xxx-series aluminum alloy having 0.5% to 1.8% Mn and 1% to 3.5% Zn.

A flux composition which includes one or more organic compounds including one or more sulfonic acid groups, salts or anhydrides thereof is applied to tin or tin alloy deposits. The flux composition is then homogenized on the tin or tin alloy to inhibit tin or tin alloy oxidation and improve brightness of the tin or tin alloy.

A thermal conductive stress relaxation structure is interposed between a high-temperature substance and a low-temperature substance to conduct heat in a heat-transfer direction from the high-temperature substance to the low-temperature substance. The structure includes an assembly configured such that a thermal conductive material gathers in a non-bonded state having stress relaxation effect. Such an assembly is a rolled-up body configured such that a carbon-based sheet material and a metal-based sheet material are alternately rolled up, for example. This structure has one or more interfaces at which adjacent parts can slide, thereby dividing a deformable region to relax the thermal stress. It has a low rigidity and can thus deform to release the thermal stress. The structure can suppress the thermal stresses and the shape changes that would be generated in the high-temperature substance and the low-temperature substance, and each physical body located there between.

The invention concerns a method for the manufacturing of a clad sheet product comprising a core layer (6) and at least one cladding layer, the method comprising rolling an assembly of a core layer and at least one cladding layer and reducing the thickness to a desired gauge, the core layer being made of an aluminium alloy, the at least one cladding layer comprising a centre section (2) and at least two edge sections (4, 5) positioned at opposite sides of the centre section (2) along the edges of the at least one cladding layer, the centre section being made of a material being an aluminium alloy or a composite material comprising a matrix of aluminium or an aluminium alloy, the edge sections along (4, 5) the edges being made of a material different from the material of the centre section, wherein the edge sections (4, 5) are cut off during or after the rolling. The invention further concerns a cladding plate useful in the method.

A system for sealing an internal passage of a component includes a closure element positioned within the internal passage, and a joint material coupling the closure element to at least one passage wall that defines the internal passage. The system also includes a flexible braze element positioned proximate the closure element, the joint material, and the at least one passage wall.

The present invention describes a component for a secondary battery and a manufacturing method thereof, and a secondary battery manufactured by using the component. The component for a secondary battery according to the present invention comprises a lead-free soldering bridge having a melting point of 150 to 300 C. and containing tin (Sn) and copper (Cu) as a main ingredient; the first and second metal plates spaced therebetween through a gap and coupling with the lead-free soldering bridge. According to the present invention, when an over-current flows through the component for a secondary battery, the temperature of the lead-free soldering bridge is locally increased rapidly to melt the lead-free soldering bridge, thereby efficiently interrupting the flow of an over-current.

Provided are: an aluminum alloy material for a heat exchanger, including an aluminum alloy including 0.02 to 0.40 mass % Si, 1.0 to 2.5 mass % Cu, 0.5 to 2.0 mass % Mn, and a balance of Al and inevitable impurities, in which the number density of an AlCuMn-based intermetallic compound having an equivalent circle diameter of 0.1 to 1.0 m is 1.010.sup.6/mm.sup.2 or more; and a method for producing the aluminum alloy material.

Provided is a thinner CuNiSn based copper alloy foil that has a foil thickness of 0.1 mm or less, has improved solder wettability and improved solder adhesion strength, and can be suitably used as a conductive spring material for use in electronic device parts such as autofocus camera modules; a copper rolled product; an electronic device part; and an autofocus camera module. The CuNiSn based copper alloy foil according to one embodiment of the present invention has a foil thickness of 0.1 mm or less; and contains from 14% by mass to 22% by mass of Ni, from 4% by mass to 10% by mass of Sn, the balance being copper and inevitable impurities; and has a maximum height roughness Rz of from 0.1 m to 1 m, on a surface in a direction parallel to a rolling direction.

Provided is a thinner CuNiSn based copper alloy foil that has a foil thickness of 0.1 mm or less, has improved solder wettability and improved solder adhesion strength, and can be suitably used as a conductive spring material for use in electronic device parts such as autofocus camera modules; a copper rolled product; an electronic device part; and an autofocus camera module. The CuNiSn based copper alloy foil according to one embodiment of the present invention has a foil thickness of 0.1 mm or less; and contains from 14% by mass to 22% by mass of Ni, from 4% by mass to 10% by mass of Sn, the balance being copper and inevitable impurities; and has a 60-degrees glossiness G60.sub.RD of from 200 to 600 on a surface as measured in a direction parallel to a rolling direction.