B23K35/0233

METHOD FOR CONNECTING AT LEAST TWO COMPONENTS OF AN ENDOSCOPE, COMPONENT OF AN ENDOSCOPE AND ENDOSCOPE

In the case of a method according to the invention for connecting at least two components of an endoscope, at least one brazing preform, which contains a high-temperature brazing solder, is introduced into at least one brazing solder reservoir of at least one of the components, the at least two components are held in relation to one another in such a way that at least one brazing gap that is in capillary connection with the at least one brazing solder reservoir is formed between joining regions of the at least two components that are assigned to one another, and the arrangement comprising the at least two components and the at least one brazing preform is heated to a brazing temperature of the high-temperature brazing solder. The invention also relates to a component of an endoscope and to an endoscope.

BONDING SHEET AND METHOD FOR PRODUCING SAME
20240269780 · 2024-08-15 ·

A bonding sheet according to the present invention contains a matrix resin; solder particles; and a fluxing agent. In the bonding sheet, the solder particles are dispersed in the matrix resin, and the fluxing agent is unevenly distributed around the solder particles in the matrix resin. The method for producing the bonding sheet of the present invention includes a first step of dissolving a fluxing agent in a first solvent to prepare a fluxing agent solution; a second step of mixing a second solvent, a matrix resin component, solder particles, and the fluxing agent solution to prepare a mixed composition; and a third step of applying the mixed composition onto a substrate to form a coated film, and then drying the coated film to form a bonding sheet.

Ni-BASED AMORPHOUS BRAZING FOIL
20240269781 · 2024-08-15 ·

There is provided a Ni-based amorphous brazing foil containing: in mass %: Cr: from 19.0% to 30.0%; P: from 4.0% to 9.0%; Si: from 0.2% to 4.0%; B: from 0.3% to 1.0%; and a balance of Ni and impurities, in which B/Cr is 0.17 or less in terms of an atomic ratio.

Printed wiring board with a reinforcing member having a diffusion-bonded nickel layer

A printed wiring board includes a base member that includes a ground wiring pattern and a printed wiring board reinforcing member bonded to the ground wiring pattern in a conductive state. The printed wiring board reinforcing member includes a metal base material layer and a nickel layer bonded to at least a surface on a side opposite to a side bonded to the ground wiring pattern of the metal base material layer by diffusion bonding.

CERAMIC/ALUMINUM JOINED BODY, INSULATING CIRCUIT BOARD, POWER MODULE, LED MODULE, AND THERMOELECTRIC MODULE
20180346387 · 2018-12-06 ·

A joined body according to the invention is a ceramic/aluminum joined body including: a ceramic member; and an aluminum member made of aluminum or an aluminum alloy, in which the ceramic member and the aluminum member are joined to each other, the ceramic member is formed of silicon nitride containing magnesium, and a joining layer in which magnesium is contained in an aluminum-silicon-oxygen-nitrogen compound is formed at a joining interface between the ceramic member and the aluminum member.

Sn-Cu-based lead-free solder alloy

Provided is a solder alloy having excellent wettability on both of a Cu surface and an Ni surface. The solder alloy has such an alloy composition that 0.6 to 0.9 mass % of Cu and 0.01 to 0.1 mass % of Al are contained, 0.02 to 0.1 mass % of Ti and/or 0.01 to 0.05 mass % of Co may be contained as required and the remainder is made up by Sn.

Nickel-based brazing foil and process for brazing

An amorphous, ductile brazing foil is provided. According to one example embodiment, the composition consists essentially of Ni.sub.restCr.sub.aB.sub.bP.sub.cSi.sub.d with 2 atomic percenta30 atomic percent; 0.5 atomic percentb14 atomic percent; 2 atomic percentc20 atomic percent; 0 atomic percentd14 atomic percent; incidental impurities0.5 atomic percent; rest Ni, where c>b>c/15 and 10 atomic percentb+c+d25 atomic percent.

Apparatus and Method for Connecting Metal Workpieces
20180318960 · 2018-11-08 ·

A welding tape for thermally connecting metal workpieces by fusion, wherein the welding tape in a cross section has an outwardly closing cover layer which comprises an inner cover layer and an outer cover layer, wherein in the transverse direction provision is made at least in side edge regions of the inner cover layer for adhesive layers by means of which the welding tape can be fastened to the workpieces to be connected, wherein in the interior of the cover layer provision is made for a self-combusting exothermic substance, which during ignition provides the thermal energy which is required for the welding, wherein a non-combustible heat shield is arranged exclusively between the exothermic substance and the outer cover layer, and wherein a welding additive is provided between the exothermic substance and the inner cover layer.

ALUMINUM ALLOY BRAZING SHEET AND BRAZING METHOD
20180304415 · 2018-10-25 · ·

A brazing method of performing brazing on an aluminum alloy brazing sheet by increasing a temperature from 200 C. to a brazing temperature in an inert gas atmosphere with a dew point controlled to 20 C. or lower, thereafter increasing the temperature in an inert gas atmosphere with a dew point controlled to 40 C. or lower and an oxygen concentration controlled to 100 ppm or lower, and performing brazing heating in an inert gas atmosphere at a temperature of 580 C. to 615 C. without using flux. The aluminum alloy brazing sheet has a structure in which one or both of a core material and a brazing material includes any one or two or more types of X atoms (X is Mg, Li, Be, Ca, Ce, La, Y, and Zr), and oxide particles including the X atoms and having a volume change ratio of 0.99 or lower are formed on a surface thereof.

Solder transfer sheet, solder bump, and solder precoating method using solder transfer sheet

Provided is a solder transfer sheet which is capable of increasing the amount of solder to be transferred without the occurrence of bridging. A solder transfer sheet 1A includes a base material 5, an adhesive layer 4 formed on the surface of the base material 5, a solder powder-containing adhesive layer 3 formed on the surface of the adhesive layer 4, and a solder powder layer 2 formed on the surface of the solder powder-containing adhesive layer 3. In the solder powder layer 2, particles of solder powder 20 are arranged in a one-layer sheet form. In the solder powder-containing adhesive layer 3, solder powder 30 and an adhesive component 31 are mixed so as to have such a thickness that two or more layers of the solder powder 30 are stacked.