A brazed heat exchanger includes plates that are stacked or nested to define flow channels for multiple media. Inserts are arranged within at least some of the flow channels. Two different braze alloys having compositions based on different metals are used to form braze joints between the plates and the inserts. In some cases, a copper-based braze alloy is used for joints corresponding to flow channels for one of the media in order to provide high pressure-resisting strength to those flow channels, while an iron-based braze alloy is used for joints corresponding to flow channels for another of the media where dissolved copper is undesirable.

A turbine rotor blade is additively manufactured and includes an airfoil body with a radially extending chamber for receiving a coolant flow, a tip end at a radial outer end of the airfoil body, and a shank at a radial inner end of the airfoil body. The radially extending chamber extends at least partially into the shank to define a shank inner surface. An integral impingement cooling structure is within the radially extending chamber. The integral impingement cooling structure allows an exterior surface of a hollow body thereof to be uniformly spaced from the airfoil inner surface despite the curvature of the chamber. The turbine rotor blade has impingement cooling throughout the blade.

A boroscope includes a working head having first and second ends. A first optical fiber extends through the boroscope to a position between the first and second ends. A second optical fiber extends through the boroscope to the second end of the working head. A laser optical fiber extends through the boroscope. At least one lens is arranged between the first end and the second end of the working head and a mirror is gimballed to the second end of the working head. The laser optical fiber directs laser light transmitted through the laser optical fiber onto the lens and then onto the mirror. A first LED is arranged at a position between the first end and the second end of the working head and a second LED is arranged at the second end of the working head and an actuator devices adjust the position of the mirror.

There is a problem that contact resistance increases due to formation of an oxide film on a contact interface or biting of abrasion powder caused by micro-sliding when a contact connecting portion of a connection terminal including non-noble metal members is exposed to high temperature environment or a repetitious temperature cycle. An object of the present invention is to provide an in-vehicle electronic module that has connection reliability equivalent to that of the conventional in-vehicle electronic module even when being placed in the environment of an engine compartment and can achieve cost reduction by reducing the number of parts and assembly steps. The electronic module includes a mounting board having a circuit board on which an electronic component is mounted, and a case member for accommodating and protecting the mounting board from surrounding environment, The electronic module has a connection structure in which a portion of the circuit board is protruded to the outside through an opening of the case and inserts a board terminal into an external female connector to obtain electrical continuity, and a portion of the case member forms a connector housing that receives the female connector and isolates a space in which the board terminal is present from surrounding environment and an insulating resin member for fixing the circuit board in the case is integrally molded or joined with the circuit board.

A Cu core ball and a method of manufacturing such a Cu core ball. Purity of the Cu internal ball is at least 99.9% and not greater than 99.995%. A total contained amount of Pb and/or Bi in impurity contained in the Cu ball is equal to or larger than 1 ppm. Its sphericity is at least 0.95. A solder plating film coated on the Cu ball is of Sn solder or a lead free solder alloy whose primary component is Sn. In the solder plating film, a contained amount of U is not more than 5 ppb and that of Th is not more than 5 ppb. A total alpha dose of the Cu ball and the solder plating film is not more than 0./0200 cph/cm2. An arithmetic average roughness of the Cu core ball is equal to or less than 0.3 μm.

A solder and methods of forming an electrical interconnection are shown. Examples of solders include gallium based solders. A solder including gallium is shown that includes particles of other solders mixed with a gallium based matrix. Methods of applying a solder are shown that include swiping a solder material over a surface that includes a resist pattern. Methods of applying a solder are also shown that include applying a solder that is immersed in an acid solution that provides a fluxing function to aid in solder adhesion.

A method includes disposing a braze material adjacent a first body and a second body; heating the braze material and forming a transient liquid phase; and transforming the transient liquid phase to a solid phase and forming a bond between the first body and the second body. The braze material includes copper, silver, zinc, magnesium, and at least one material selected from the group consisting of nickel, tin, cobalt, iron, phosphorous, indium, lead, antimony, cadmium, and bismuth.

A solder alloy has an alloy composition consisting of, in mass %, Ag: 0 to 4%, Cu: 0.1 to 1.0%, Ni: 0.01 to 0.3%, Sb: 5.1 to 7.5%, Bi: 0.1 to 4.5%, Co: 0.001 to 0.3%, P: 0.001 to 0.2%, and the balance being Sn.

A chromium-free, distributed hardfacing disposable on a surface of a wellsite component is disclosed. The hardfacing includes a metal filler (e.g., nickel) and particles distributed about the filler. The particles include pellets made of tungsten carbide and pieces made of angular molybdenum carbide. The pieces are smaller than the pellets for distribution in the filler between the pellets whereby a uniform distribution of particles is provided about the filler.

Various embodiments of a metal cored wires, hardband alloys, and methods are disclosed. In one embodiment of the present invention, a hardbanding wire comprises from about from about 16% to about 30% by weight chromium; from about 4% to about 10% by weight nickel; from about 0.05% to about 0.8% by weight nitrogen; from about 1% to about 4% by weight manganese; from about 1% to about 4% by weight carbon from about 0.5% to about 5% by weight molybdenum; from about 0.25% to about 2% by weight silicon; and the remainder is iron including trace elements. The hardband alloy produced by the metal cored wire meets API magnetic permeability specifications and has improved metal to metal, adhesive wear resistance compared to conventional hardband alloys.