A method for the production of a silver sintering agent in the form of a layer-shaped silver sintering body having silver oxide surfaces and the use thereof are provided.

A solder alloy that contains 0.005 mass % or more and 0.1 mass % or less of Mn, 0.001 mass % or more and 0.1 mass % or less of Ge, and a balance of Sn. A plurality of Ge oxides is distributed on an outermost surface side of an oxide film including Sn oxide, Mn oxide and Ge oxide by adding 0.005 mass % or more and 0.1 mass % or less of Mn, 0.001 mass % or more and 0.1 mass % or less of Ge to the solder alloy having a principal ingredient of Sn, so that it is possible to obtain the discolor-inhibiting effect even under the high-temperature and high-humidity environment.

As electronic equipment has become smaller in size, printed circuit boards which cannot be subjected to cleaning have been developed, and a no-clean lead-free solder paste is becoming necessary. In order for a solder paste not to require cleaning, it is necessary that the color of the residue be transparent and that the residue be non-tacky. A maleated rosin, which is a rosin suited for no-clean paste, has a high acid value so it is not suitable for a flux for lead-free solder. As a means of suppressing a reaction between a flux containing a maleated rosin and a Sn—Ag—Cu based solder alloy powder, a Sn—Ag—Cu—Sb based solder alloy powder is used which adds 1-8 mass % of Sb to a Sn—Ag—Cu based solder alloy. As a result, it is possible to provide a solder paste which has the excellent effect that the solder paste does not easily undergo changes over time and has a long pot life.

Wires for use in electron beam or plasma arc additive manufacturing of titanium alloys are disclosed. The wires have a first portion comprising a first material, and a second portion comprising a second material. The combination of the first and second materials results in a titanium alloy product of the appropriate composition.

In one aspect, methods of making freestanding metal matrix composite articles and alloy articles are described. A method of making a freestanding composite article described herein comprises disposing over a surface of the temporary substrate a layered assembly comprising a layer of infiltration metal or alloy and a hard particle layer formed of a flexible sheet comprising organic binder and the hard particles. The layered assembly is heated to infiltrate the hard particle layer with metal or alloy providing a metal matrix composite, and the metal matrix composite is separated from the temporary substrate. Further, a method of making a freestanding alloy article described herein comprises disposing over the surface of a temporary substrate a flexible sheet comprising organic binder and powder alloy and heating the sheet to provide a sintered alloy article. The sintered alloy article is then separated from the temporary substrate.

The invention relates to a paste, preferably for joining components of power electronics modules, the paste comprising a solder powder, a metal powder and a binder, wherein the binder binds solder powder and metal powder before a first heating. According to the invention, the binder is free of flux or is a flux having only low activation. In this way, a joining layer which exhibits only few included voids and good mechanical and electrical stability can be provided between a first and a second component.

To provide a Ni ball having a low α dose and high sphericity even when it contains impurity elements other than Ni in certain amounts. The Ni ball contains an element U, a content thereof being 5 ppb or less, and an element Th, a content thereof being 5 ppb or less, wherein a purity of the Ni ball is 99.9% or more but 99.995% or less, an α dose thereof is 0.0200 cph/cm.sup.2 or less, a content of either Pb or Bi, or a total content of both Pb and Bi is 1 ppm or more, and a sphericity thereof is 0.90 or more, in order to prevent any software errors and reduce connection failure.

Various embodiments of a metal cored wires and methods are disclosed. In one embodiment of the present invention, a metal cored wire comprises a metal sheath and a metal-powder core material comprising manganese particles. The manganese particles are coated with a coating material to reduce the manganese fumes and exposure during welding.

The production method comprises the steps for producing a preform by selective melting, the preform comprising an assembly surface to be brazed to the part to be repaired and containing a brazing material, and then assembling the preform to the turbine engine part by diffusion brazing. The thermal amplitude of the main transformation peak (A1) of the brazing material used to make the preform must at least be twice that of each of the respective thermal amplitudes of the secondary transformation peaks (A2, A3) of this brazing material.

Provided is a flux for soldering that can suppress a crack in a flux residue even if the flux for soldering is exposed to a cooling and heating cycle at the highest temperature of 150° C. such as the inside of an engine room of automobiles for a long period of time, and a soldering paste composition including the flux for soldering. The flux for soldering includes a synthetic resin, an activator, an organic solvent, and a thixotropic agent, in which synthetic resin contains a triblock copolymer of methacrylic acid ester with acrylic acid ester configured of a linear alkyl moiety having 3 to 6 carbon atoms. In addition, a soldering paste composition including the flux for soldering is used.