There are provided a cutting/polishing tool that may be readily manufactured and have an improved cutting performance, and a manufacturing method thereof. The method for manufacturing the cutting/polishing tool including at least one cutting/polishing body may comprise preparing a tool body, and forming a cladding layer including cutting material particles by spraying, onto an outer surface of the tool body, the cutting material particles and a metal powder having a specific gravity greater than a specific gravity of the cutting material particles while heating the outer surface of the tool body using a heating device installed in a lower side of the outer surface of the tool body so that the metal powder is deposited on the outer surface of the tool body, wherein the cladding layer configures the at least one cutting/polishing body.

A device for surfacing a metal alloy part by laser welding, the part including a recess to be surfaced and located at a planar area of the part, the device including first and second protective elements arranged on either side of the recess, the first and second protective elements each having an irradiation surface which is to be at least partially covered with a layer of powder to enable welding by passing a laser beam over the powder, the laser beam passing over the irradiation surface of the first protective element during welding and then the irradiation surface of the second protective element, the second protective element having a shape for containing a layer of powder having a height that is greater at the end, in the direction of propagation of the laser beam during welding, of the second protective element than at the start of the second protective element.

A tool for forming a shaped product has a support body that is fabricated from a first material, such as for instance cast iron. The first material defines a first portion of a forming surface of the tool and has a feature supported thereon. The feature has a layer of a second material that is supported on the first material of the support body, a layer of a third material that is supported on the layer of the second material and a layer of a fourth material that is supported on the layer of the third material. The layer of the fourth material, such as for instance a tool steel alloy, defines a second portion of the forming surface of the tool. During use the first portion of the forming surface and the second portion of the forming surface cooperate to form a desired shape of the shaped product.

The present invention relates to a method for producing and/or repairing wear-stressed recesses or openings on components (22) of a turbomachine, especially of elements of a flow passage boundary, and also to corresponding components, wherein the method comprises:

producing an at least two-layer molded repair part (15), one layer (2) of which is formed by an Ni-solder and a further layer (3) of which is formed from a mixture of an Ni-solder (4) and hard material particles (5) of hard alloys on a base of cobalt or nickel and which at least partially has an outer shape which is complementary to the inner shape of the recess (20) or opening which is to be repaired,

inserting the molded repair part (15) into the recess (20) or opening and

at least partially heat-treating the component (22) for soldering the molded repair part (15) onto the component.

Embodiments of the present invention provide an improved method and structure for flip chip implementation. The interconnections between the electronic circuit (e.g. silicon die) and the circuit board substrate are comprised of a metal alloy that becomes liquid at the operating temperature of the chip. This allows a softer underfill to be used, which in turn reduces stresses during operation and thermal cycling that are caused by the different coefficient of thermal expansion (CTE) of the electronic circuit chip and the circuit board substrate.

A method for making a firmly-bonded connection involves a) providing an electronic component and a substrate having surfaces to be connected; b) applying a copper paste onto at least one of the surfaces and drying the layer of copper paste; c1) applying a solder agent onto the copper paste and arranging the component and the substrate in contact via the combination of copper paste and solder agent; or c2) arranging the component and the substrate in contact via the dried copper paste, and applying a solder agent next to the layer of dried copper paste; and d) soldering the arrangement. The copper paste contains (i) particles of copper, copper-rich copper/zinc alloy, and/or copper-rich copper/tin alloy containing a phosphorus fraction of 0 to ≦500 wt-ppm, (ii) solder particles which are tin, tin-rich tin/copper alloy, tin-rich tin/silver alloy, and/or tin-rich tin/copper/silver alloy, and (iii) vehicle.

A solder paste that contains or consists of (i) 10-30% by weight of at least one type of particles that each contain a phosphorus fraction of >0 to ≦500 wt-ppm and are selected from copper particles, copper-rich copper/zinc alloy particles, and copper-rich copper/tin alloy particles, (ii) 60-80% by weight of at least one type of particles selected from tin particles, tin-rich tin/copper alloy particles, tin-rich tin/silver alloy particles, and tin-rich tin/copper/silver alloy particles, and (iii) 3-30% by weight solder flux, in which the mean particle diameter of metallic particles (i) and (ii) is ≦15 μm.

Provided is a solder material which enables a growth of an oxide film to be inhibited. A solder ball which is a solder material is composed of a solder layer and a covering layer covering the solder layer. The solder layer is spherical and is composed of a metal material containing an alloy including Sn content of 40% and more. Otherwise the solder layer is composed of a metal material including Sn content of 100%. In the covering layer, a S.sub.nO film is formed outside the solder layer, and a S.sub.nO.sub.2 film is formed outside the S.sub.nO film. A thickness of the covering layer is preferably more than 0 nm and equal to or less than 4.5 nm. Additionally, a yellow chromaticity of the solder ball is preferably equal to or less than 5.7.

A soldering alloy includes an alloy composition consisting of 13-22 mass % of In, 0.5-2.8 mass % of Ag, 0.5-5.0 mass % of Bi, 0.002-0.05 mass % of Ni, and a balance Sn. A soldering alloy, a soldering paste, a preform solder, a soldering ball, a wire solder, a resin flux cored solder and a solder joint, each of which is composed of the soldering alloy. An electronic circuit board and a multi-layer electronic circuit board joined by using the solder joint.

Provided is a solder alloy, a solder paste, a solder preform, and a solder joint which suppress chip cracking during cooling, improve the heat dissipation characteristics of the solder joint, and exhibit high joint strength at high temperatures.

The solder alloy has an alloy composition of, by mass: Sb: 9.0 to 33.0%; Ag: more than 4.0% and less than 11.0%; and Cu: more than 2.0% and less than 6.0%, with the balance of Sn.

Moreover, the solder paste, the solder preform, and the solder joint all contain said solder alloy.