There is provided a bonding material which forms a bonding portion between two objects, which material contains (1) first metal particles comprising a first metal and having a median particle diameter in the range of 20 nm to 1 μm, and (2) second metal particles comprising, as a second metal, at least one alloy of Sn and at least one selected from Bi, In and Zn and having a melting point of not higher than 200° C.

Some implementations of the disclosure are directed to low melting temperature (e.g., liquidus temperature below 210° C.) SnIn solder alloys. A SnIn solder alloy may consist of: 8 to 20 wt % In; greater than 0 wt % to 4 wt % Ag; optionally, one or more of greater than 0 wt % to 5 wt % Sb, greater than 0 wt % to 3 wt % Cu, greater than 0 wt % to 2.5 wt % Zn, greater than 0 wt % to 1.5 wt % Ni, greater than 0 wt % to 1.5 wt % Co, greater than 0 wt % to 1.5 wt % Ge, greater than 0 wt % to 1.5 wt % P, and greater than 0 wt % to 1.5 wt % Mn; and a remainder of Sn.

Undercooled liquid metallic core-shell particles, whose core is stable against solidification at ambient conditions, i.e. under near ambient temperature and pressure conditions, are used to join or repair metallic non-particulate components. The undercooled-shell particles in the form of nano-size or micro-size particles comprise an undercooled stable liquid metallic core encapsulated inside an outer shell, which can comprise an oxide or other stabilizer shell typically formed in-situ on the undercooled liquid metallic core. The shell is ruptured to release the liquid phase core material to join or repair a component(s).

A solder alloy is provided which suppresses the change in a solder paste over time, decreases the temperature difference between the liquidus-line temperature and the solidus temperature, and exhibits a high reliability. The solder alloy has an alloy constitution composed of: 10 ppm by mass or more and less than 25 ppm by mass of As; at least one selected from the group consisting of 0 ppm by mass to 10000 ppm by mass of Bi and 0 ppm by mass to 5100 ppm by mass of Pb; more than 0 ppm by mass and no more than 3000 ppm by mass of Sb; and a remaining amount of Sn; and satisfies both the formula (1) and the formula (2).
300≤3As+Sb+Bi+Pb  (1)
0.1≤{(3As+Sb)/(Bi+Pb)}×100≤200  (2) In the formula (1) and the formula (2), As, Sb, Bi, and Pb each represents an amount thereof (ppm by mass) in the alloy constitution.

A solder alloy comprises Ag: 3.1 to 4.0% by mass, Cu: 0.6 to 0.8% by mass, Bi: 1.5 to 5.5% by mass, Sb: 1.0 to 6.0% by mass, Co: 0.001 to 0.030% by mass, Fe: 0.02 to 0.05% by mass, and a balance Sn.

An iodine-containing cyclic compound including no carboxy group and including one ring skeleton or a plurality of ring skeletons forming a fused ring in one molecule, is provided. The ring of the ring skeleton includes only a carbon atom, or a carbon atom, and a nitrogen atom and/or an oxygen atom, and an iodine atom is bonded to at least one of the atoms constituting the ring of the ring skeleton.

An iodine-containing cyclic compound including no carboxy group and including one ring skeleton or a plurality of ring skeletons forming a fused ring in one molecule, is provided. The ring of the ring skeleton includes only a carbon atom, or a carbon atom, and a nitrogen atom and/or an oxygen atom, and an iodine atom is bonded to at least one of the atoms constituting the ring of the ring skeleton.

If a flux contains an amount of thixotropic agent necessary for obtaining the effect of suppressing a heating sagging, the amount of flux residue increases, and, if applied for uses that do not involve washing, a large amount of flux residue derived from the thixotropic agent remains around the soldered portions, thereby affecting chemical and electrical reliability; and that washing performance is poor in uses involving washing of the flux residue. Accordingly, this soldering flux contains nanofibers of one or more kinds from among polysaccharides, modified polysaccharides, and incompletely modified polysaccharides being modified from polysaccharides into modified polysaccharides, by an amount of 50 wt ppm or more and 3000 wt ppm or less with respect to a total amount of flux.

A component joining apparatus, which can realize positioning between a component and a substrate with high accuracy by avoiding influence of thermal expansion of the substrate at the time of joining the component to the substrate by heating at a high temperature, includes a component supply head holding a component and a heating stage heating and holding a substrate, in which a heating region where the heating stage contacts the substrate includes a joining region of the substrate in which the component is joined, and the substrate is larger than the heating stage and a peripheral part of the substrate does not contact the heating stage.

Provided are a solder alloy which has excellent temperature cycle characteristics and in which yellowish discoloration is suppressed, excellent wettability is maintained, and an increase in viscosity of a solder paste over time can be suppressed, and a solder paste, a solder ball, and a solder joint in which the solder alloy is used. The solder alloy consists of, by mass %, 1.0% to 5.0% of Ag, 0.5% to 3.0% of Cu, 0.5% to 7.0% of Sb, 0.0040% to 0.025% of As, and a balance of Sn.