A method of pretinning a core wire for a guidewire having an elongate axis, comprising placing a ball of solder within a pocket in a soldering block; melting the ball of solder; holding a core wire over the ball of solder, with the elongate axis in a horizontal orientation; lowering a portion of the core wire into the ball of solder while maintaining the elongate axis in a horizontal orientation; removing the core wire from the ball of solder.

Provided are a solder alloy which has excellent temperature cycle characteristics and in which yellowish discoloration is suppressed, excellent wettability is maintained, and an increase in viscosity of a solder paste over time can be suppressed, and a solder paste, a solder ball, and a solder joint in which the solder alloy is used. The solder alloy consists of, by mass %, 1.0% to 5.0% of Ag, 0.5% to 3.0% of Cu, 0.5% to 7.0% of Sb, 0.0040% to 0.025% of As, and a balance of Sn.

A method of furnace-less brazing of a substrate is provided. The method includes providing a substrate having a brazing region thereon; disposing braze precursor material containing a nickel powder, an aluminum powder, and a platinum group metal powder on the brazing region; and initiating an exothermic reaction of the braze precursor material such that the exothermic reaction produces a braze material that reaches a braze temperature above the liquidus temperature for the braze material. A braze precursor material is also provided.

One object of the present invention is to provide a bonding material capable of forming a highly reliable bond, the present invention provides a bonding material having a plate shape or a sheet shape, wherein the bonding material includes: fine copper particles having an average particle diameter of 300 nm or less; coarse copper particles having an average particle diameter of 3 .Math.m or more and 11 .Math.m or less; and a reducing agent which reduces the fine copper particles and the coarse copper particles.

The present invention provides an alloy for overlay welding with which an alumina barrier layer containing an Al oxide can be formed on a projection that is overlay welded on an inner surface of a reaction tube, and a reaction tube having a projection that is overlay welded on the inner surface as a stirring member. An alloy for overlay welding according to the present invention is an alloy for overlay welding that is to be used in overlay welding, and the alloy contains C in an amount of 0.2 mass % to 0.6 mass %, Si in an amount of more than 0 mass % to 1.0 mass %, Mn in an amount of more than 0 mass % to 0.6 mass % or less, Cr in an amount of 25 mass % to 35 mass %, Ni in an amount of 35 mass % to 50 mass %, Nb in an amount of 0.5 mass % to 2.0 mass %, Al in an amount of 3.0 mass % to 6.0 mass %, Y in an amount of 0.005 mass % to 0.05 mass %, wherein Y/Al is 0.002 or more to 0.015 or less; and the balance being Fe and inevitable impurities.

An object of the present invention is to provide an Ag alloy bonding wire for a semiconductor device capable of extending the high-temperature life of a wire, reducing chip damage during ball bonding, and improving characteristics such as ball bonding strength in applications of on-vehicle memory devices. The Ag alloy bonding wire for a semiconductor device according to the present invention contains one or more of In and Ga for a total of 110 at ppm or more and less than 500 at ppm, and one or more of Pd and Pt for a total of 150 at ppm or more and less than 12,000 at ppm, and a balance being made up of Ag and unavoidable impurities.

A bonding member (10) includes surface-processed silver surfaces (11a, 11b).

An iron-based alloy composition including: boron (B): 1.6-2.4 wt. %; carbon (C): 2.2-3.0 wt. %; chromium (Cr): 3.5-5.0 wt. %; manganese (Mn): below 0.8 wt. %; molybdenum (Mo): 16.0-19.5 wt. %; nickel (Ni): 1.0-2.0 wt. %; silicon (Si): 0.2-2.0 wt. %; vanadium (V): 10.8-13.2 wt. %; and balanced with iron (Fe). Further, an item including a substrate portion and a hardfacing coating bonded to the substrate portion, wherein the hardfacing coating is made by an overlay welding process using the iron-based alloy composition.

A composite material includes: an iron-based alloy layer; an intermediate layer provided on the iron-based alloy layer; and a tungsten-containing layer provided on the intermediate layer, wherein the intermediate layer is composed of pure nickel or is an alloy that contains at least one selected from a group consisting of copper, cobalt, and iron at more than 0 mass % and less than or equal to 71 mass % in total, and that contains nickel at more than or equal to 29 mass % and less than 100 mass %.

The disclosed technology generally relates welding electrodes, and more particularly to consumable welding electrodes having functional coatings. In one aspect, a welding electrode comprises a core wire having a base metal composition and two or more coatings covering at least a portion of the core wire. The two or more coatings comprise an electrically conductive coating including one or more electrically conducting elements or compounds in addition to or other than copper (Cu). The two or more coatings additionally comprises an additional functional coating including one or more additional elements or compounds adapted to modify a surface tension of a molten droplet formed from the welding electrode. In another aspect, a method of manufacturing a welding electrode comprises providing the core wire having the base metal composition and forming the two or more coating layers.