B23K35/30

COMPOSITE SOLDER BALLS METALLISED ON THE SURFACE AND CALIBRATED FOR THE ASSEMBLY OF ELECTRONIC BOARDS
20220339742 · 2022-10-27 ·

The present invention relates to a method for manufacturing composite solder balls that are metallized on the surface and calibrated, these balls comprising a core consisting of a spherical support particle of diameter Do made of expanded polystyrene and having an intergranular porosity of at least 50%, and a shell covering said support particle and formed by a plurality of metallic surface layers. The present invention also relates to balls that can be obtained by the method according to the invention, as well as to the use thereof for the assembly of electronic boards.

BRAZING METHOD AND METAL FILM FORMING TOOL FOR BRAZING
20230086339 · 2023-03-23 ·

In a film formation step of a brazing method, a metal brush formed by bundling a plurality of metal wires is brought into contact with a film formation target portion of a workpiece. Here, the film formation target portion is a portion that includes a joining target portion and a brazing-material-allowed portion but does not include an avoidance portion. In this state, the film formation target portion and the metal brush are relatively moved to each other. Thus, the metal film is formed on the film formation target portion. In a brazing step, the joining target portions are joined in a state where a brazing material is arranged on the joining target portion and the brazing-material-allowed portion.

USE OF A NICKEL-CHROMIUM-IRON ALLOY

Alloy with the composition (in wt. %) Ni 33.5-35.0%, Cr 26.0-28.0%, Mo 6.0-7.0%, Fe<33.5%, Mn 1.0-4.0%, Si<0.1%, Cu 0.5-1.5%, Al 0.01%-0.3%, C<0.01%, P<0.015%, S<0.01%, N 0.1-0.25%, B 0.001-0.004%, Se>0-1.0%, if required W<0.2%, Co<0.5%, Nb<0.2%, Ti<0.1%, and impurities from the melting process, is used as a welding-plating material in the area of thermal processing systems, in particular rubbish, biomass, sewage sludge and substitute fuel systems, wherein, after the build-up welding, in the operationally stressed state in a fully austenitic structural matrix, the welding-plating material forms a sigma phase and other hard particles in the weld material microstructure in a targeted manner.

BONDED BODY, CERAMIC COPPER CIRCUIT SUBSTRATE, AND SEMICONDUCTOR DEVICE

A bonded body according to an embodiment includes a ceramic substrate, a copper plate, and a bonding layer that is located on at least one surface of the ceramic substrate and bonds the ceramic substrate and the copper plate. The bonding layer includes titanium. The bonding layer includes first and second regions; the first region includes a layer including titanium as a major component; the layer is formed at an interface of the bonding layer with the ceramic substrate; and the second region is positioned between the first region and the copper plate. The bonded body has a ratio M1/M2 of a titanium concentration M1 at % in the first region and a titanium concentration M2 at % in the second region that is not less than 0.1 and not more than 5 when the Ti concentrations are measured by EDX respectively in measurement regions in the first and second regions.

BRAZING MATERIAL
20230131567 · 2023-04-27 · ·

A brazing material for brazing a brazed plate heat exchanger comprising a number of heat exchanger plates being provided with a pressed pattern of ridges and grooves adapted to provide contact points between neighbouring heat exchanger plates, such that the heat exchanger plates are kept on a distance from one another and such that interplate flow channels for media to exchange heat are formed between the heat exchanger plates comprises a brazing alloy comprising at least one melting point depressing element and metals resembling the composition of the heat exchanger plates. The brazing material comprises a mixture between grains of a melting brazing material having solidus and liquidus temperatures lower than a brazing temperature and a non-melting brazing material having solidus and liquidus temperatures above the brazing temperature. The ratio between the melting and non-melting brazing materials is such that an alloy formed by the melting and non-melting brazing materials has a solidus temperature lower than the brazing temperature and a liquidus temperature higher than the brazing temperature.

LAYER STRUCTURE AND CHIP PACKAGE THAT INCLUDES THE LAYER STRUCTURE
20230126663 · 2023-04-27 ·

A layer structure includes a first layer including at least one material selected from a first group consisting of nickel, copper, gold, silver, palladium, tin, zinc, platinum, and an alloy of any of these materials; a third layer including at least one material selected from a second group consisting of nickel, copper, gold, palladium, tin, silver, zinc, platinum, and an alloy of any of these materials; and a second layer between the first layer and the third layer. The second layer consists of or essentially consists of nickel and tin. The second layer includes an intermetallic phase of nickel and tin.

WELD STRUCTURE, STAINLESS STEEL WELDED STRUCTURE, STAINLESS STEEL WELDED CONTAINER AND STAINLESS STEEL

A weld structure includes a first stainless steel member and a second stainless steel member. A crevice made by welding is defined by welding an end of the first stainless steel member and a portion other than an end of the second stainless steel member. A portion close to the end of the first stainless steel member is formed as a weld metal portion by performing welding heat input on the portion close to the end of the first stainless steel member. In the crevice made by welding, a length L.sub.B from a boundary between the weld metal portion and a raw material portion to a crevice deepest portion and a crevice length L.sub.C from the crevice deepest portion to a 40 μm-width position satisfy L.sub.C<L.sub.B.

Austenitic stainless steel weld joint

Provided is an austenitic stainless steel weld joint that is excellent in polythionic acid SCC resistance and naphthenic acid corrosion resistance, and is also excellent in creep ductility. An austenitic stainless steel weld joint includes a base material and a weld metal. The weld metal has a chemical composition at its width-center position and at its thickness-center position consisting of, in mass %, C: 0.050% or less, Si: 0.01 to 1.00%, Mn: 0.01 to 3.00%, P: 0.030% or less, S: 0.015% or less, Cr: 15.0 to 25.0%, Ni: 20.0 to 70.0%, Mo: 1.30 to 10.00%, Nb: 0.05 to 3.00%, N: 0.150% or less, and B: 0.0050% or less, with the balance: Fe and impurities.

SOLID WIRE FOR ARC WELDING USE

An arc welding solid wire includes: a steel material; and a copper plating layer formed on a surface of the steel material, in which an amount of Cu in the steel material and the copper plating layer is 0.05 mass % to 0.30 mass % with respect to a total mass of the wire, a surface of the wire is coated with 0.05 g to 0.20 g of oil with respect to 1 kg of the wire, and on a surface of the copper plating layer, an arithmetic average roughness Rac in a circumferential direction is 0.25 .Math.m to 1.00 .Math.m, and an arithmetic average roughness Ral in a longitudinal direction is 0.07 .Math.m to 0.50 .Math.m.

SOLID WIRE FOR ARC WELDING USE

An arc welding solid wire includes: a steel material; and a copper plating layer formed on a surface of the steel material, in which an amount of Cu in the steel material and the copper plating layer is 0.05 mass % to 0.30 mass % with respect to a total mass of the wire, a surface of the wire is coated with 0.05 g to 0.20 g of oil with respect to 1 kg of the wire, and on a surface of the copper plating layer, an arithmetic average roughness Rac in a circumferential direction is 0.25 .Math.m to 1.00 .Math.m, and an arithmetic average roughness Ral in a longitudinal direction is 0.07 .Math.m to 0.50 .Math.m.