Provided is a flux capable of obtaining predetermined rheological characteristics both at room temperature and under a thermal history that is assumed for soldering and capable of suppressing the amount of a residue after soldering to realize a low residue. The flux contains a first alcohol compound that has two or more OH groups and has a melting point of lower than 25° C. and a second alcohol compound that has two or more OH groups and has a melting point of higher than 25° C., the first alcohol compound is glycerin, the second alcohol compound is 2,5-dimethylhexane-2,5-diol, the flux has a viscosity of 10 Pa.Math.s or more and 50 Pa.Math.s or less at 25° C. and has a viscosity of more than 0 Pa.Math.s and 1 Pa.Math.s or less at 100° C., and, in a case where 10 mg of the flux is heated up to 25° C. to 250° C. under a N.sub.2 atmosphere at a temperature rise rate of 10° C./min, the weight of the flux after heating is 15% or less of the weight of the flux before heating.

The invention relates generally to welding and, more specifically, to corrosion resistant weld deposits created during arc welding, such as Gas Metal Arc Welding (GMAW) or Flux Core Arc Welding (FCAW). A disclosed corrosion resistant weld deposit comprises nickel, chromium, and copper, and has a low porosity.

A weldable adhesive or sealant formulation comprising a plurality of discrete solid metallic portions within a material having a viscosity of greater than 10,000 Pa s in its green state and at room temperature.

A flux includes a solvent and a thixotropic agent, the solvent including a carboxylic acid that is liquid at ordinary temperature.

A method for bonding components is disclosed. The method may comprise positioning an interlayer between a metallic component and a metal-plated non-metallic component at a bond region, heating the bond region to a bonding temperature to produce a liquid at the bond region, and maintaining the bond region at the bonding temperature until the liquid has solidified to firm a bond between the metallic component and the metal-plated non-metallic component at the bond region. A method for providing a part having a customized coating is also disclosed. The method may comprise applying a metallic coating on a surface of a metallic substrate, and bonding the metallic coating to the metallic substrate by a transient liquid phase bonding process to provide the part having the customized coating.

Thermal sprayed coating made from a thermal spray powder material containing aluminum containing particles mechanically alloyed to a transition metal. The coating includes aluminum alloy portions alloyed to the transition metal. The thermal spray powder is made of aluminum containing particles mechanically alloyed to a transition metal.

The disclosure describes techniques for joining a first part including a ceramic or a CMC and a second part including a ceramic or a CMC using brazing. A technique may include positioning a filler material in a joint region between the first and second parts and a metal or alloy on a bulk surface of the filler material. The metal or alloy may be locally heated to melt the metal or alloy, which may infiltrate the filler material. A constituent of the molten metal or alloy may react with a constituent of the filler material to join the first and second parts. Another technique may include depositing a powder that includes the filler material and the metal or alloy in the joint region. Substantially simultaneously with depositing the powder, the powder may be locally heated. A constituent of the molten metal or alloy may react with a constituent of the filler material to join the first and second parts.

A resin composition that has both excellent flux activity and high insulation reliability, that possesses good storage stability, and that further has flexibility with good operability upon being used as a laminate is provided. The resin composition contains a chelating flux agent (A), a thermal radical polymerization initiator (B) and a radical polymerizable compound (C).

The present invention relates to a metal paste including: a first metal powder including nickel (Ni); a second metal powder including at least one selected from the group consisting of tin (Sn), zinc (Zn), bismuth (Bi), and indium (In); and a dispersing agent, and to a thermoelectric module which adopts a bonding technique using the metal paste.

Thermally conductive adhesive materials having a first metallic component with a high melting point metal; a second metallic component having a low melting point metal; a fatty acid, an optional amine, an optional triglyceride and optional additives. Also provided are methods of making the same and uses thereof for adhering electronic components to substrates.