A method for bonding components is disclosed. The method may comprise positioning an interlayer between a metallic component and a metal-plated non-metallic component at a bond region, heating the bond region to a bonding temperature to produce a liquid at the bond region, and maintaining the bond region at the bonding temperature until the liquid has solidified to form a bond between the metallic component and the metal-plated non-metallic component at the bond region. A method for providing a part having a customized coating is also disclosed. The method may comprise applying a metallic coating on a surface of a metallic substrate, and bonding the metallic coating to the metallic substrate by a transient liquid phase bonding process to provide the part having the customized coating.

Provided are flux in which solder wettability is improved, and a solder paste in which the flux is used. The flux contains 0.5-20.0 wt % of a (2-carboxyalkyl)isocyanurate adduct, and 5.0-45.0 wt % of a rosin, and furthermore contains a solvent. The (2-carboxyalkyl)isocyanurate adduct is a mono(2-carboxyalkyl)isocyanurate adduct, a bis(2-carboxyalkyl)isocyanurate adduct, a tris(2-carboxyalkyl)isocyanurate adduct, or a combination of two or more of these.

Provided is a flux capable of obtaining predetermined rheological characteristics both at room temperature and under a thermal history that is assumed for soldering and capable of suppressing the amount of a residue after soldering to realize a low residue. The flux contains a first alcohol compound that has two or more OH groups and has a melting point of lower than 25 C. and a second alcohol compound that has two or more OH groups and has a melting point of higher than 25 C., the first alcohol compound is glycerin, the second alcohol compound is 2,5-dimethylhexane-2,5-diol, the flux has a viscosity of 10 Pa.Math.s or more and 50 Pa.Math.s or less at 25 C. and has a viscosity of more than 0 Pa.Math.s and 1 Pa.Math.s or less at 100 C., and, in a case where 10 mg of the flux is heated up to 25 C. to 250 C. under a N.sub.2 atmosphere at a temperature rise rate of 10 C./min, the weight of the flux after heating is 15% or less of the weight of the flux before heating.

An iodine-containing cyclic compound including no carboxy group and including one ring skeleton or a plurality of ring skeletons forming a fused ring in one molecule, is provided. The ring of the ring skeleton includes only a carbon atom, or a carbon atom, and a nitrogen atom and/or an oxygen atom, and an iodine atom is bonded to at least one of the atoms constituting the ring of the ring skeleton.

Provided is flux used for soldering and solder paste using the same. The flux used for an air-dispensing method contains a solvent, a high viscosity solvent of 1, 2, 6-hexantriol and isobornyl cyclohexanol, and a thixotropic agent but does not contain rosin. The flux used for the air-dispensing method and a jet-dispensing method contains a solvent, a high viscosity solvent of 1, 2, 6-hexantriol and isobornyl cyclohexanol, a thixotropic agent and rosin.

Provided are: a flux that is for a solder paste and that can inhibit occurrence of voids; and a solder paste using the flux. This flux for a solder paste contains rosin, an imidazole compound, and a solvent, wherein the contained amount of the imidazole compound is 25-35 mass %. The flux also contains 0-20 mass % of a block organic acid and 0-3 mass % of an activator.

The present disclosure provides a method for bonding an electronic component and a method for manufacturing a bonded body, which are capable of sintering a silver paste at a comparatively low temperature. Disclosed is a method for bonding an electronic component using a silver paste containing silver particles, the method including: applying a silver paste containing silver particles on a surface of a substrate and setting electronic components on the silver paste applied, heating in a reducing atmosphere at a temperature of lower than 300 C., and after heating in the reducing atmosphere, heating in an oxidizing atmosphere at a temperature of 300 C. or lower.

A flux which imparts thixotropy, and which exhibits excellent printability, printing sagging-inhibiting ability, and heating sagging-inhibiting ability; and a solder paste which uses said flux. This flux includes a thixotropic agent, a rosin, an organic acid, and a solvent. The thixotropic agent includes a cyclic amide compound obtained by polycondensing a dicarboxylic acid and/or a tricarboxylic acid, and a diamine and/or a triamine into a cyclic shape; and an acyclic amide compound which is obtained by polycondensing a monocarboxylic acid, a dicarboxylic acid and/or a tricarboxylic acid into an acyclic shape. The flux includes at least 0.1 wt % but not more than 8.0 wt % of the cyclic amide compound, and at least 0.5 wt % but not more than 8.0 wt % of the acyclic amide compound. The total amount of the cyclic amide compound and the acyclic amide compound is at least 1.5 wt % but not more than 10.0 wt %.

A method of resistance spot welding a workpiece stack-up that includes an aluminum workpiece and an overlapping adjacent steel workpiece so as to minimize the thickness of an intermetallic layer comprising FeAl intermetallic compounds involves providing reaction-slowing elements at the faying interface of the aluminum and steel workpieces. The reaction-slowing elements may include at least one of carbon, copper, silicon, nickel, manganese, cobalt, or chromium. Various ways are available for making the one or more reaction-slowing elements available at the faying interface of the aluminum and steel workpieces including being dissolved in a high strength steel or being present in an interlayer that may take on a variety of forms including a rigid shim, a flexible foil, a deposited layer adhered to and metallurgically bonded with a faying surface of the steel workpiece, or an interadjacent organic material layer that includes particles containing the reaction-slowing elements.

The present invention relates to a method for producing a soldered product by which soldering can be accomplished without using a jig. The method for producing a soldered product of the present invention comprises: a provision step of providing a solder and a temporary fixing agent for temporarily fixing the solder; a temporary fixing step of temporarily fixing the solder to a soldering target with the temporary fixing agent; a vaporization step of placing the soldering target with the solder temporarily fixed thereto in a vacuum or heating the soldering target with the solder temporarily fixed thereto to a predetermined temperature lower than the melting temperature of the solder, to vaporize the temporary fixing agent in order to form gaps between the solder and the soldering target; a reduction step, performed concurrently with or after the vaporization step, of reducing, with a reducing gas at a predetermined temperature lower than the melting temperature of the solder, the solder and the soldering target left in the vaporization step; and a solder melting step, performed after the reduction step, of heating the soldering target to a predetermined temperature equal to or higher than the melting temperature of the solder to melt the solder.