Patent classifications
B24B7/17
Method of producing carrier for use in double-side polishing apparatus and method of double-side polishing wafers
A method of producing a carrier for use in a double-side polishing apparatus, the method including engaging an insert with a holding hole formed in a carrier body and sticking the insert to the holding hole, the carrier body being configured to be disposed between upper and lower turn tables to which polishing pads are attached of the double-side polishing apparatus, the holding hole being configured to hold a wafer during polishing, the insert being configured to contact an edge of the wafer to be held, the method including: performing a lapping process and a polishing process on the insert; engaging the insert subjected to the lapping process and the polishing process with the holding hole of the carrier body; and sticking and drying the engaged insert while applying a load to the insert in a direction perpendicular to main surfaces of the carrier body.
Flexible sanding device for cylinder rock specimen
A rock sanding device includes a base, a bottom sanding plate, an adjustable connecting rod, an elastic loader, a connector, a side sanding brush, a top sanding plate, an inner rod, a prong and a drill rod. The top of the drill rod is fixedly connected with the rotating shaft of the external water drilling rig and the external water drilling rig has a water inlet joint to introduce water into the drill rod. The inner rod and drill rod are connected and fixed coaxially, and the bottom of the drill rod is symmetrically welded with four prongs. The rock specimen is placed in the center of the side sanding brush. The top sanding plate and the bottom sanding plate are provided in the top side and bottom side of the rock specimen, respectively.
Flexible sanding device for cylinder rock specimen
A rock sanding device includes a base, a bottom sanding plate, an adjustable connecting rod, an elastic loader, a connector, a side sanding brush, a top sanding plate, an inner rod, a prong and a drill rod. The top of the drill rod is fixedly connected with the rotating shaft of the external water drilling rig and the external water drilling rig has a water inlet joint to introduce water into the drill rod. The inner rod and drill rod are connected and fixed coaxially, and the bottom of the drill rod is symmetrically welded with four prongs. The rock specimen is placed in the center of the side sanding brush. The top sanding plate and the bottom sanding plate are provided in the top side and bottom side of the rock specimen, respectively.
EQUIPMENT AND METHOD FOR LAYING A FILM ON A PLATE-SHAPED PART HOLDER
The invention relates to an equipment having an upstream holder for a supply reel carrying a continuous ribbon, a portion of which is suitable for forming a film intended to cover a support plate, a downstream holder, an assembly station having a base comprising having a first platen, an actuator with a movable part carrying a second platen, the second platen or the first platen being adapted to receive a support plate, wherein the second platen is adapted to cooperate with the first platen to form a tooling capable of contacting the film and the support plate when the portion of the ribbon forming the film is located between the second platen and the first platen, facing the support plate.
Dual-surface polishing device and dual-surface polishing method
An inner-periphery-side cutoff part where a polishing surface of an upper plate inclines upward toward an inner periphery part of the upper plate and an inner-periphery-side cutoff part where a polishing surface of a lower plate inclines downward toward an inner periphery part of the lower plate are respectively formed on the respective inner periphery parts of the upper plate and the lower plate, or an outer-periphery-side cutoff part where the polishing surface of the upper plate inclines upward toward an outer periphery part of the upper plate and an outer-periphery-side cutoff part where the polishing surface of the lower plate inclines downward toward an outer periphery part of the lower plate are respectively formed on the respective outer periphery parts of the upper plate and the lower plate, or all of them are formed thereon.
Dual-surface polishing device and dual-surface polishing method
An inner-periphery-side cutoff part where a polishing surface of an upper plate inclines upward toward an inner periphery part of the upper plate and an inner-periphery-side cutoff part where a polishing surface of a lower plate inclines downward toward an inner periphery part of the lower plate are respectively formed on the respective inner periphery parts of the upper plate and the lower plate, or an outer-periphery-side cutoff part where the polishing surface of the upper plate inclines upward toward an outer periphery part of the upper plate and an outer-periphery-side cutoff part where the polishing surface of the lower plate inclines downward toward an outer periphery part of the lower plate are respectively formed on the respective outer periphery parts of the upper plate and the lower plate, or all of them are formed thereon.
GRINDING APPARATUS
A grinding apparatus includes: a pair of rotary grindstones, a rotary base rotationally driven around a first rotation axis, a rotary table included in the rotary base, a fixed base rotatably supporting the rotary base, a fixed table included in the fixed base, a plurality of workpiece supporting tables supported on the rotary base and rotationally driven around a second rotation axis, a plurality of workpiece receiving holes vertically passing through an outer edge part of the workpiece supporting tables, a first motor fixed to the fixed base to rotationally drive the rotary table, a plurality of second motors fixed to the rotary base to rotationally drive the workpiece supporting tables, a controller driving the first motor and the plurality of second motors, and a slip ring disposed below the plurality of second motors and conductively connecting between the controller and the plurality of second motors.
Assembly and method for loading parts to be treated in a single-side or double-side treatment machine
The invention relates to an assembly for loading parts to be treated into a single-side or double-side treatment machine, comprising—a part holder in the form of a plate for holding at least one part to be treated, comprising a second side and first side, said first side being flat, and said part holder delimiting at least one through-hole forming a cell for housing at least one part to be treated, and a film mounted on the first side of the part holder opposite said through-hole, allowing said part to be treated to be held at least during the loading step.
Assembly and method for loading parts to be treated in a single-side or double-side treatment machine
The invention relates to an assembly for loading parts to be treated into a single-side or double-side treatment machine, comprising—a part holder in the form of a plate for holding at least one part to be treated, comprising a second side and first side, said first side being flat, and said part holder delimiting at least one through-hole forming a cell for housing at least one part to be treated, and a film mounted on the first side of the part holder opposite said through-hole, allowing said part to be treated to be held at least during the loading step.
METHOD FOR MANUFACTURING ANNULAR GLASS PLATE, METHOD FOR MANUFACTURING GLASS SUBSTRATE FOR MAGNETIC DISK, METHOD FOR MANUFACTURING MAGNETIC DISK, ANNULAR GLASS PLATE, GLASS SUBSTRATE FOR MAGNETIC DISK, AND MAGNETIC DISK
A method for manufacturing an annular glass plate that has an outer circumferential edge surface, an inner circumferential edge surface, and a thickness not larger than 0.6 mm includes processing for manufacturing an annular glass plate by irradiating each of the outer circumferential edge surface and the inner circumferential edge surface of an annular glass blank with a laser beam to melt the outer circumferential edge surface and the inner circumferential edge surface and form molten surfaces such that the molten surfaces in the outer circumferential edge surface and the inner circumferential edge surface each have an arithmetic average surface roughness Ra not larger than 0.1 μm, and the surface roughness of the molten surface in the inner circumferential edge surface becomes larger than the surface roughness of the molten surface in the outer circumferential edge surface.