The invention relates to an assembly for loading parts to be treated into a single-side or double-side treatment machine, comprising—a part holder in the form of a plate for holding at least one part to be treated, comprising a second side and first side, said first side being flat, and said part holder delimiting at least one through-hole forming a cell for housing at least one part to be treated, and a film mounted on the first side of the part holder opposite said through-hole, allowing said part to be treated to be held at least during the loading step.

The present disclosure discloses a control method of a grinding water flow rate during a double side grinding process. A double side grinder used includes a grinding wheel, a feed unit and a water supply device, wherein a water inlet is disposed on the feed unit. The control method includes: S001: according to the operation procedure of a double side grinder, prepare for grinding and complete the installation and debugging of workpiece; S002: in the process of double side grinding, the flow rate of the water inlet is set to decrease with the shortening of the teeth length of the grinding wheel, and the flow rate of the water inlet is set to have a linear relationship with the teeth length of the grinding wheel.

A cam device includes a drive cam, a follower, a holding cam, and a restriction roller. The drive cam reciprocally rotates. The follower intermittently reciprocate linearly by the drive cam. The holding cam is rotationally driven integrally with the drive cam. The restriction roller is provided on the follower and restricts a movement of the follower by coming in contact with the holding cam. The holding cam separates from the restriction roller and the holding cam is in a holding release state, when the drive cam is in an engaged state with the follower.

A double-head grinding machine includes a disc-shaped carrier ring having a support hole for supporting a silicon wafer, a rotation mechanism rotating the carrier ring around a center of the carrier ring, and a grinding wheel including a grinding stone for grinding the silicon wafer. The support hole is circular and has a center eccentric to the center of the carrier ring.

A double-head grinding machine includes a disc-shaped carrier ring having a support hole for supporting a silicon wafer, a rotation mechanism rotating the carrier ring around a center of the carrier ring, and a grinding wheel including a grinding stone for grinding the silicon wafer. The support hole is circular and has a center eccentric to the center of the carrier ring.

A manufacturing method of the honeycomb structure uses a grinding wheel having a coarse abrasive grain layer and a pair of fine abrasive grain layers sintered and secured to be formed on both sides of the coarse abrasive grain layer, and has a grinding wheel rotating step of rotating the pair of grinding wheels disposed via a predetermined space in a state where fine abrasive grain layers of the grinding wheels face each other; a conveying step of conveying a honeycomb formed body formed by extrusion and the like; an end face grinding step of grinding end faces of the conveyed honeycomb formed body with the rotating grinding wheels; and a firing step of firing the honeycomb formed body.

A manufacturing method of the honeycomb structure uses a grinding wheel having a coarse abrasive grain layer and a pair of fine abrasive grain layers sintered and secured to be formed on both sides of the coarse abrasive grain layer, and has a grinding wheel rotating step of rotating the pair of grinding wheels disposed via a predetermined space in a state where fine abrasive grain layers of the grinding wheels face each other; a conveying step of conveying a honeycomb formed body formed by extrusion and the like; an end face grinding step of grinding end faces of the conveyed honeycomb formed body with the rotating grinding wheels; and a firing step of firing the honeycomb formed body.

A control method of a grinding water flow rate during a double side grinding process. A double side grinder used includes a grinding wheel, a feed unit and a water supply device, wherein a water inlet is disposed on the feed unit. The control method includes: prepare for grinding and complete the installation of a workpiece according to an operation procedure of the double side grinder; during a process of double side grinding, the flow rate of the water inlet is set to decrease with the shortening of the teeth length of the grinding wheel, with the flow rate of the water inlet being set to have a linear relationship with the teeth length of the grinding wheel.

A method produces wafers from a cylindrical ingot of semiconductor material having an axis and an indexing notch in an outer surface of the cylindrical ingot and parallel to the axis. The method includes, in the order specified: (a) simultaneous removal of a multiplicity of sliced wafers from the cylindrical ingot by multi-wire slicing in the presence of a cutting agent; (b) etching of the sliced wafers with an alkaline etchant in an etching bath at a temperature of 20? C. to 50? C. and for a residence time, such that the material removed from each of the sliced wafers is less than 5/1000 of an initial wafer thickness; and (c) grinding of the etched wafers by simultaneous double-disk grinding using an annular abrasive covering.

An inner-periphery-side cutoff part where a polishing surface of an upper plate inclines upward toward an inner periphery part of the upper plate and an inner-periphery-side cutoff part where a polishing surface of a lower plate inclines downward toward an inner periphery part of the lower plate are respectively formed on the respective inner periphery parts of the upper plate and the lower plate, or an outer-periphery-side cutoff part where the polishing surface of the upper plate inclines upward toward an outer periphery part of the upper plate and an outer-periphery-side cutoff part where the polishing surface of the lower plate inclines downward toward an outer periphery part of the lower plate are respectively formed on the respective outer periphery parts of the upper plate and the lower plate, or all of them are formed thereon.