A double-face polishing device and a method capable of controlling rigidity of a polishing pad through a cluster dynamic magnetic field are provided. A whole process from double-face rough polishing to precision polishing of a workpiece is implemented by adjusting a rigidity of a flexible polishing pad. The double-face polishing device capable of controlling rigidity of a polishing pad through a cluster dynamic magnetic field includes a variable-rigidity cluster magnetically-controlled polishing pad generating mechanism, a workpiece fast clamping mechanism and a workpiece movement driving mechanism. The variable-rigidity cluster magnetically-controlled polishing pad generating mechanism includes a first magnetic field generating block and a second magnetic field generating block that are symmetrically arranged, wherein the first magnetic field generating block and the second magnetic field generating block each include a shell, a deflection spindle, an eccentric camshaft, a magnet mounting base, a permanent magnet and a motor, the workpiece fast clamping mechanism includes a working tank, a clamping plate, a connection rod, a hinge plate, a fixing hinge, a square magnet, an electrical soft iron block, an annular cast iron and a strip-shaped permanent magnet, and the workpiece movement driving mechanism includes a support block, a cross beam, a horizontal linear motor, a vertical beam and a vertical linear motor.

A double-face polishing device and a method capable of controlling rigidity of a polishing pad through a cluster dynamic magnetic field are provided. A whole process from double-face rough polishing to precision polishing of a workpiece is implemented by adjusting a rigidity of a flexible polishing pad. The double-face polishing device capable of controlling rigidity of a polishing pad through a cluster dynamic magnetic field includes a variable-rigidity cluster magnetically-controlled polishing pad generating mechanism, a workpiece fast clamping mechanism and a workpiece movement driving mechanism. The variable-rigidity cluster magnetically-controlled polishing pad generating mechanism includes a first magnetic field generating block and a second magnetic field generating block that are symmetrically arranged, wherein the first magnetic field generating block and the second magnetic field generating block each include a shell, a deflection spindle, an eccentric camshaft, a magnet mounting base, a permanent magnet and a motor, the workpiece fast clamping mechanism includes a working tank, a clamping plate, a connection rod, a hinge plate, a fixing hinge, a square magnet, an electrical soft iron block, an annular cast iron and a strip-shaped permanent magnet, and the workpiece movement driving mechanism includes a support block, a cross beam, a horizontal linear motor, a vertical beam and a vertical linear motor.

The present invention is a workpiece double-disc grinding method including supporting a sheet workpiece along a circumferential direction from an outer circumference side of the workpiece by a ring holder, and simultaneously grinding both surfaces of the workpiece supported by the ring holder with a pair of grinding wheels while rotating the ring holder, wherein the surfaces of the workpiece are simultaneously ground such that a wear amount of the grinding wheels per 1 m of a grinding stock removal of the workpiece ranges from 0.10 m to 0.33 m. This workpiece double-disc grinding method can reduce nanotopography formed in previous steps such as a slicing step without degrading the flatness in the double-disc grinding step.

The present invention is a workpiece double-disc grinding method including supporting a sheet workpiece along a circumferential direction from an outer circumference side of the workpiece by a ring holder, and simultaneously grinding both surfaces of the workpiece supported by the ring holder with a pair of grinding wheels while rotating the ring holder, wherein the surfaces of the workpiece are simultaneously ground such that a wear amount of the grinding wheels per 1 m of a grinding stock removal of the workpiece ranges from 0.10 m to 0.33 m. This workpiece double-disc grinding method can reduce nanotopography formed in previous steps such as a slicing step without degrading the flatness in the double-disc grinding step.

A semiconductor wafer is processed by grinding the semiconductor wafer so as to remove material using a grinding tool while delivering a coolant into a contact region between the rotating semiconductor wafer and the grinding tool. The grinding tool has grinding teeth having a height. While grinding, first and second coolant flow rates are respectively applied onto first and second regions on one side of the semiconductor wafer by one or more nozzles. The first region is bounded by a lower right quadrant of the semiconductor wafer and the second region is bounded by a lower left quadrant. A ratio of the first coolant flow rate and a sum of the first coolant flow rate and the second coolant flow rate is no more than 35% and no less than 25%.

An automated rover device removes material from opposite surfaces of an elongate part, such as a composite stiffener. The device includes a pair of material removal tools along with a vacuum assembly for vacuuming away material removed by the tools.

A double disc surface grinding machine (10) includes work holding section (65) for holding an inner circumferential surface of an annular work (W) at a plurality of locations. The work holding section (65) includes a plurality of holding members (66) extending radially as viewed from a rotation shaft (46). Each holding member (66) is movable outward and inward radially of the rotation shaft (46), and is contactable to the inner circumferential surface of the work (W). The position adjustment section (76) connects the rotation shaft (46) and the work holding section (65) with each other, and adjusts a position of the work holding section (65) in the radial direction of the rotation shaft (46). While the inner circumferential surface of the work (W) is held by the work holding section (65), the rotation shaft (46), the position adjustment section (76), the work holding section (65) and the work (W) are rotated integrally with each other around the rotation shaft (46). Part of the rotating work (W) is sandwiched by a pair of grinding wheels (16a), (16b) to grind two main surfaces of the work (W).

A double disc surface grinding machine (10) includes work holding section (65) for holding an inner circumferential surface of an annular work (W) at a plurality of locations. The work holding section (65) includes a plurality of holding members (66) extending radially as viewed from a rotation shaft (46). Each holding member (66) is movable outward and inward radially of the rotation shaft (46), and is contactable to the inner circumferential surface of the work (W). The position adjustment section (76) connects the rotation shaft (46) and the work holding section (65) with each other, and adjusts a position of the work holding section (65) in the radial direction of the rotation shaft (46). While the inner circumferential surface of the work (W) is held by the work holding section (65), the rotation shaft (46), the position adjustment section (76), the work holding section (65) and the work (W) are rotated integrally with each other around the rotation shaft (46). Part of the rotating work (W) is sandwiched by a pair of grinding wheels (16a), (16b) to grind two main surfaces of the work (W).

Disclosed herein is an apparatus for grinding a compression line spring. The apparatus includes a lower chain conveyor (100), an upper chain conveyor (200), and grinding units (300). The lower chain conveyor includes chain units (110) and (110) provided facing each other at positions spaced apart from each other. Each chain unit (110), (110) includes first V-shaped blocks (115) for supporting compression line springs. The upper chain conveyor includes chain units (210) and (210) provided facing each other at positions spaced apart from each other. Each chain unit (210), (210) includes second V-shaped blocks (215) for compressing downward upper portions of the compression line springs seated on the first V-shaped blocks (115) and thus supporting the compression line springs. The grinding units (300) grind seat surfaces formed on opposite ends of the compression line springs that are being moved by the lower chain conveyor and the upper chain conveyor.

Disclosed herein is an apparatus for grinding a compression line spring. The apparatus includes a lower chain conveyor (100), an upper chain conveyor (200), and grinding units (300). The lower chain conveyor includes chain units (110) and (110) provided facing each other at positions spaced apart from each other. Each chain unit (110), (110) includes first V-shaped blocks (115) for supporting compression line springs. The upper chain conveyor includes chain units (210) and (210) provided facing each other at positions spaced apart from each other. Each chain unit (210), (210) includes second V-shaped blocks (215) for compressing downward upper portions of the compression line springs seated on the first V-shaped blocks (115) and thus supporting the compression line springs. The grinding units (300) grind seat surfaces formed on opposite ends of the compression line springs that are being moved by the lower chain conveyor and the upper chain conveyor.