A polishing apparatus capable of forming a step-shaped recess having a right-angled cross section in an edge portion of a substrate, such as a wafer, is disclosed. The polishing apparatus includes: a substrate rotating device configured to rotate the substrate about a rotation axis; a first roller having a first circumferential surface configured to press a polishing tape against the edge portion of the substrate; and a second roller having a second circumferential surface in contact with the first circumferential surface. The second roller has a tape stopper surface that restricts movement of the polishing tape in a direction away from the rotation axis. The tape stopper surface is located radially outward of the first circumferential surface.

A sanding machine, in particular for processing wood surfaces, includes a support and transport plane for the forwarding of the workpieces to be processed; and a belt sanding unit with a transverse abrasive belt inside which a pressure pad is arranged obliquely. The pressure pad is divided into a plurality of pressure elements which can be actuated individually and are controlled by respective sensors that constitute a control beam. Methods are described for compensating the different distances between sensor and respective pressure elements that avoid adaptations of the position of the workpiece to be processed, in particular if the machine contains further non inclined processing units. The sanding machine is particularly suitable even for the processing of large workpieces.

A sanding machine, in particular for processing wood surfaces, includes a support and transport plane for the forwarding of the workpieces to be processed; and a belt sanding unit with a transverse abrasive belt inside which a pressure pad is arranged obliquely. The pressure pad is divided into a plurality of pressure elements which can be actuated individually and are controlled by respective sensors that constitute a control beam. Methods are described for compensating the different distances between sensor and respective pressure elements that avoid adaptations of the position of the workpiece to be processed, in particular if the machine contains further non inclined processing units. The sanding machine is particularly suitable even for the processing of large workpieces.

The present invention relates to a polishing apparatus and a polishing method for polishing a flat portion of a substrate, such as a wafer. The polishing apparatus (100) includes: a substrate holder configured to hold a substrate (W) and rotate the substrate W; a polishing-tape feeding mechanism (141) configured to advance a polishing tape (3) in its longitudinal direction; and at least one polishing head (10) arranged near a flat portion of the substrate (W), wherein the polishing head (10) has a fluid pressing structure (12) configured to press the polishing tape (3) with fluid against the flat portion of the substrate, and the fluid pressing structure (12) has a fluid supply port (13) arranged so as to face a back surface of the polishing tape (3).

The present invention relates to a polishing apparatus and a polishing method for polishing a flat portion of a substrate, such as a wafer. The polishing apparatus (100) includes: a substrate holder configured to hold a substrate (W) and rotate the substrate W; a polishing-tape feeding mechanism (141) configured to advance a polishing tape (3) in its longitudinal direction; and at least one polishing head (10) arranged near a flat portion of the substrate (W), wherein the polishing head (10) has a fluid pressing structure (12) configured to press the polishing tape (3) with fluid against the flat portion of the substrate, and the fluid pressing structure (12) has a fluid supply port (13) arranged so as to face a back surface of the polishing tape (3).

A device has laterally mobile pressure devices on belt sanders in throughfeed, which are brought into position so that workpieces detected by detectors are sanded in a laterally limited area in the longitudinal direction. An arrangement of such pressure arrangements represents, for example, a segmented sanding pad. The method of lateral movement of its segments and the devices created for this purpose enable, among other things, the sanding of frames in the wood grain direction of their individual parts and/or their center panel as well as the application of sanding patterns to workpiece surfaces.

A device has laterally mobile pressure devices on belt sanders in throughfeed, which are brought into position so that workpieces detected by detectors are sanded in a laterally limited area in the longitudinal direction. An arrangement of such pressure arrangements represents, for example, a segmented sanding pad. The method of lateral movement of its segments and the devices created for this purpose enable, among other things, the sanding of frames in the wood grain direction of their individual parts and/or their center panel as well as the application of sanding patterns to workpiece surfaces.

Equipment (300) for the surface sanding of plate-shaped bodies (101), in particular of tiles, said equipment (300) comprising support and feeding means (100) for supporting said plate-shaped bodies (101) and feeding said plate-shaped bodies (101) along a given feed direction (D), so that during the movement along said given direction (D) the surface of each said plate-shaped body (101) that shall be sanded can be visible and accessed, said equipment (300) including a sanding module (200) provided with sanding means defining a sanding abrasive surface and with moving means for moving said abrasive surface in contact with the visible surface of said plate-shaped bodies (101) in succession during the movement thereof; wherein said sanding means comprise a closed belt (201) that defines said sanding abrasive surface and is suitable to be driven into rotation by means of said moving means.

Equipment (300) for the surface sanding of plate-shaped bodies (101), in particular of tiles, said equipment (300) comprising support and feeding means (100) for supporting said plate-shaped bodies (101) and feeding said plate-shaped bodies (101) along a given feed direction (D), so that during the movement along said given direction (D) the surface of each said plate-shaped body (101) that shall be sanded can be visible and accessed, said equipment (300) including a sanding module (200) provided with sanding means defining a sanding abrasive surface and with moving means for moving said abrasive surface in contact with the visible surface of said plate-shaped bodies (101) in succession during the movement thereof; wherein said sanding means comprise a closed belt (201) that defines said sanding abrasive surface and is suitable to be driven into rotation by means of said moving means.

A method and an apparatus for processing a peripheral portion of a substrate, such as a wafer, are disclosed. The substrate processing method includes: holding a substrate on a substrate stage; rotating the substrate stage and the substrate about an axis of the substrate stage; directing a laser beam to an edge portion of the rotating substrate to form an annular crack in the substrate; and pressing a polishing tool against the edge portion of the rotating substrate to form a stepped recess in a peripheral portion of the substrate.