A method and an apparatus for processing a peripheral portion of a substrate, such as a wafer, are disclosed. The substrate processing method includes: holding a substrate on a substrate stage; rotating the substrate stage and the substrate about an axis of the substrate stage; directing a laser beam to an edge portion of the rotating substrate to form an annular crack in the substrate; and pressing a polishing tool against the edge portion of the rotating substrate to form a stepped recess in a peripheral portion of the substrate.

The present invention relates to a device for sanding surfaces of a workpiece, preferably at least portions of which are made of wood, a manufactured wood product, plastic or such like. The present invention further relates to a sanding method and to a sanding machine comprising: a carrier element (11), a plurality of pressure segments (12a, 12b, 12c) which can be actuated, in particular electromagnetically actuated, and which are disposed along the carrier element (11) and are each designed to press a sanding element, especially a sanding belt (21), against a workpiece (1), and at least one sensor (13a, 13b, 13c) for sensing a compressive force applied to a workpiece by one of the pressure segments.

The present invention relates to a device for sanding surfaces of a workpiece, preferably at least portions of which are made of wood, a manufactured wood product, plastic or such like. The present invention further relates to a sanding method and to a sanding machine comprising: a carrier element (11), a plurality of pressure segments (12a, 12b, 12c) which can be actuated, in particular electromagnetically actuated, and which are disposed along the carrier element (11) and are each designed to press a sanding element, especially a sanding belt (21), against a workpiece (1), and at least one sensor (13a, 13b, 13c) for sensing a compressive force applied to a workpiece by one of the pressure segments.

Loopback rolls which can transfer and guide a polishing tape (T) in a tangential direction of a pressure contact roll (R) is provided, a top edge face (RG1) and a tapered peripheral edge (RG) having a pair of slant edge faces (RG2) are formed on a periphery of the pressure contact roll, by both of which the polishing tape can be bent into a substantially V-shape in cross section, and a switchable pressure contact mechanism (7) is switchably provided which pressure contacts each of bent portions (T) of the polishing tape, which is bent into the substantially V-shape in cross section by the tapered peripheral edge to one tooth face (B1) or the other tooth face of a bottom land (B) of a worm (W).

A polishing head having a simple construction and a compact size is disclosed. The polishing head includes: a polishing-tool pressing member for supporting a polishing tool; a movable shaft coupled to the polishing-tool pressing member; a housing which houses the movable shaft therein; and a diaphragm which forms a pressure chamber between an end portion of the movable shaft and the housing, the diaphragm including a central portion in contact with the end portion of the movable shaft, an inner wall portion connecting with the central portion and extending along a side surface of the movable shaft, a folded-back portion connecting with the inner wall portion and having a curved cross section, and an outer wall portion connecting with the folded-back portion and located outside the inner wall portion.

A method and an apparatus which can efficiently polish an entirety of a back surface, including an outermost area thereof, of a substrate while the back surface of the substrate faces downward are disclosed. The method includes rotating a substrate by rotating a plurality of rollers about their respective own axes while the rollers contact a periphery of the substrate with a back surface of the substrate facing downward; and polishing an entirety of the back surface of the substrate by moving a polishing tool relative to the substrate while supplying a liquid onto the back surface of the substrate and while placing the polishing tool in contact with the back surface of the substrate, the polishing tool being located at a lower side of the substrate.

A polishing apparatus polishes a periphery of a substrate by bringing a polishing tool into sliding contact with the substrate. The polishing apparatus includes a substrate-holding mechanism configured to hold a substrate and rotate the substrate, a polishing mechanism configured to press a polishing tool against a periphery of the substrate so as to polish the periphery, and a periphery-supporting mechanism configured to support the periphery of the substrate by a fluid. The periphery-supporting mechanism is configured to support a surface of the substrate from an opposite side or the same side of the periphery of the substrate.

A polishing apparatus polishes a periphery of a substrate by bringing a polishing tool into sliding contact with the substrate. The polishing apparatus includes a substrate-holding mechanism configured to hold a substrate and rotate the substrate, a polishing mechanism configured to press a polishing tool against a periphery of the substrate so as to polish the periphery, and a periphery-supporting mechanism configured to support the periphery of the substrate by a fluid. The periphery-supporting mechanism is configured to support a surface of the substrate from an opposite side or the same side of the periphery of the substrate.

A sanding machine for sanding panels, including a supporting structure, a sanding unit supported by the supporting structure, a surface for supporting and sliding of the panels located beneath the sanding unit and along which the panels are fed in a predetermined feed direction; the sanding unit including a trestle supporting a sanding belt, the trestle including a plurality of rollers having respective axes parallel to the supporting surface, the sanding belt being endless and looped around the rollers, one of the rollers being motorized to move the sanding belt during the sanding of the panels, the sanding unit further including at least one opposing member to force the belt against the panel to be sanded.

A sanding machine for sanding panels, including a supporting structure, a sanding unit supported by the supporting structure, a surface for supporting and sliding of the panels located beneath the sanding unit and along which the panels are fed in a predetermined feed direction; the sanding unit including a trestle supporting a sanding belt, the trestle including a plurality of rollers having respective axes parallel to the supporting surface, the sanding belt being endless and looped around the rollers, one of the rollers being motorized to move the sanding belt during the sanding of the panels, the sanding unit further including at least one opposing member to force the belt against the panel to be sanded.