Provided is a double-side polishing apparatus and a double-side polishing method which make it possible to terminate double-side polishing with timing allowing a work having been polished to have a target shape. A computing unit 13 performs a step of grouping the data of thicknesses measured using work thickness measuring devices 11 on a work basis; a step of extracting shape components of each work from the thickness data; a step of identifying a position of each of the shape components in the work radial direction; a step of computing a shape distribution of the work from the identified position ; a step of obtaining a shape index of the work from the computed shape distribution; and a step of determining timing of termination of the double-side polishing based on the obtained shape index, thus timing of termination of the double-side polishing is determined.

Provided is a double-side polishing apparatus and a double-side polishing method which make it possible to terminate double-side polishing with timing allowing a work having been polished to have a target shape. A computing unit 13 performs a step of grouping the data of thicknesses measured using work thickness measuring devices 11 on a work basis; a step of extracting shape components of each work from the thickness data; a step of identifying a position of each of the shape components in the work radial direction; a step of computing a shape distribution of the work from the identified position ; a step of obtaining a shape index of the work from the computed shape distribution; and a step of determining timing of termination of the double-side polishing based on the obtained shape index, thus timing of termination of the double-side polishing is determined.

The present invention is a polishing pad having a polishing layer for polishing surface of a wafer and a double-sided tape for attaching the polishing layer to an upper turn table of a double-side polishing apparatus, wherein, the double-sided tape has a 90 peeling adhesive strength A of 2000 g/cm or more, and a ratio A/B of the 90 peeling adhesive strength A to a 180 peeling adhesive strength B of 1.05 or more, the double-sided tape has a base material, a polishing-layer-side adhesive layer to be attached to the polishing layer, and an upper-turn-table-side adhesive layer to be attached to the upper turn table, and total thickness of the polishing-layer-side adhesive layer and the upper-turn-table-side adhesive layer is 80 m or less. This provides a polishing pad capable of suppressing deterioration of flatness of the wafer when performing double-side polishing of the wafer.

The present invention is a polishing pad having a polishing layer for polishing surface of a wafer and a double-sided tape for attaching the polishing layer to an upper turn table of a double-side polishing apparatus, wherein, the double-sided tape has a 90 peeling adhesive strength A of 2000 g/cm or more, and a ratio A/B of the 90 peeling adhesive strength A to a 180 peeling adhesive strength B of 1.05 or more, the double-sided tape has a base material, a polishing-layer-side adhesive layer to be attached to the polishing layer, and an upper-turn-table-side adhesive layer to be attached to the upper turn table, and total thickness of the polishing-layer-side adhesive layer and the upper-turn-table-side adhesive layer is 80 m or less. This provides a polishing pad capable of suppressing deterioration of flatness of the wafer when performing double-side polishing of the wafer.

One aspect of embodiment provides a wafer polishing chamber, including a wafer transfer part; a polishing part provided with an upper surface plate and lower surface plate, and configured to polish the wafer transferred from the wafer transfer part; a partition wall configured to separate positions where the transfer part and the polishing part are disposed; a plurality of fan units configured to introduce air; and a plurality of exhaust units configured to exhaust air, wherein the fan unit may be provided in at least one in an upper portion of the polishing part.

One aspect of embodiment provides a wafer polishing chamber, including a wafer transfer part; a polishing part provided with an upper surface plate and lower surface plate, and configured to polish the wafer transferred from the wafer transfer part; a partition wall configured to separate positions where the transfer part and the polishing part are disposed; a plurality of fan units configured to introduce air; and a plurality of exhaust units configured to exhaust air, wherein the fan unit may be provided in at least one in an upper portion of the polishing part.

A method for manufacturing a disk-shaped glass substrate is a method for manufacturing a disk-shaped glass substrate for cutting out one or more thin glass substrates. The method for manufacturing a disk-shaped glass substrate includes preparing a disk-shaped glass blank, which is a glass blank having two circular main surfaces, chamfering an outer edge portion of each of the two main surfaces of the disk-shaped glass blank, grinding the two main surfaces of the chamfered disk-shaped glass blank, using a double-side grinding apparatus, and polishing the two main surfaces of the ground disk-shaped glass blank, using a double-side polishing apparatus.

A wafer polishing method according to the present invention is provided with: a first polishing step (step S1) of polishing a wafer using a polishing head of an independent pressurizing system having a retainer ring capable of performing pressing operation independently of a wafer pressurizing mechanism; and a second polishing step (step S3) of polishing the wafer that has been polished in the first polishing step using a polishing head of a fixed pressurizing system having a retainer ring fixed to the wafer pressurizing mechanism.

A wafer polishing method according to the present invention is provided with: a first polishing step (step S1) of polishing a wafer using a polishing head of an independent pressurizing system having a retainer ring capable of performing pressing operation independently of a wafer pressurizing mechanism; and a second polishing step (step S3) of polishing the wafer that has been polished in the first polishing step using a polishing head of a fixed pressurizing system having a retainer ring fixed to the wafer pressurizing mechanism.

A method for conditioning a polishing pad, which is configured to polish a wafer and attached to a rotatable discoid turntable, by using a conditioning head, the method being characterized by: moving the conditioning head in a radial direction of the turntable to perform the conditioning while rotating the polishing pad attached to the turntable by rotation of the turntable; and controlling a rotational speed of the turntable and a moving speed of the conditioning head in the radial direction of the turntable in correspondence with a distance of the conditioning head from a center of the turntable. Consequently, the method for conditioning a polishing pad which enables appropriately conditioning an entire polishing surface of the polishing pad can be provided.