A manufacturing method of a wafer with a notch includes: polishing principal surfaces of the wafer; mirror-polishing a notch chamfered portion of the notch; mirror-polishing an outer-periphery chamfered portion of an outer peripheral portion of the wafer; and finish-polishing one of principal surfaces of the wafer, the finish-polishing being performed after performing the mirror-polishing of the notch chamfered portion, the polishing of the principal surfaces, and the mirror-polishing of the outer-periphery chamfered portion in this order.

A machining machine comprises a first support disk, a first working disk coupled to the first support disk, and a counter bearing element positioned to define a working gap between the first working disk and the counter bearing element. The first working disk and the counter bearing element are configured to rotate relative to each other to machine at least one side of a flat workpiece. A pressure volume is positioned between the first support disk and the first working disk and is configured to hold a pressure fluid, which generates a pressure configured to deform the first working disk. One or more temperature-controlling channels are positioned within the first working disk and configured to hold a temperature-controlling fluid that is configured to control a temperature of the first working disk, wherein the one or more temperature-controlling channels are fluidly separate from the pressure volume.

A water-based grinding machine for polishing a surface of a metal strip includes an unwinding wheel, a polishing mechanism, a cleaning mechanism, a drying mechanism and a winding wheel. The polishing mechanism includes a first polishing wheel and a first workbench. The metal strip is drawn from the unwinding wheel into a gap between a polishing wheel and a pad, and then is drawn to the cleaning mechanism. The cleaning mechanism includes a third workbench and a cleaning liquid storage tank. At least one pair of felt wheels is arranged above the third workbench. The metal strip passes through a gap between the at least one pair of felt wheels. An outer circumference of the at least one pair of felt wheels is covered with a wool layer. The cleaning liquid storage tank is provided with a cleaning pipe. The drying mechanism includes an oven.

A water-based grinding machine for polishing a surface of a metal strip includes an unwinding wheel, a polishing mechanism, a cleaning mechanism, a drying mechanism and a winding wheel. The polishing mechanism includes a first polishing wheel and a first workbench. The metal strip is drawn from the unwinding wheel into a gap between a polishing wheel and a pad, and then is drawn to the cleaning mechanism. The cleaning mechanism includes a third workbench and a cleaning liquid storage tank. At least one pair of felt wheels is arranged above the third workbench. The metal strip passes through a gap between the at least one pair of felt wheels. An outer circumference of the at least one pair of felt wheels is covered with a wool layer. The cleaning liquid storage tank is provided with a cleaning pipe. The drying mechanism includes an oven.

Semiconductor wafers, are processed using minimally three processing operations: a first double-sided polishing operation, a second chemical-mechanical polishing operation and an epitaxial coating operation. A control system for conducting the method defines at least one operating parameter for the processing operations specifically based on at least one wafer parameter measured on the semiconductor wafer after processing in at least one processing operation, based on an actual state of a processing apparatus with which the respective processing operation is conducted, and based on optimizing wafer parameters for flatness after the wafer has undergone all three processing operations instead of optimizing each individual processing step for optimal flatness.

The present invention provides an apparatus for working oppositely arranged first and second surfaces of a pressing section. The apparatus comprises an upper working unit forming a top wall and an upper sidewall extending downwardly from the top wall; a lower working unit forming a bottom wall and a lower sidewall extending upwardly from the bottom wall; and an inflatable bellows movable between an inflated state and a deflated state by inflation with an inflation medium. The upper sidewall is arranged to guide the lower sidewall to thereby form an internal space enclosed by the top wall, the bottom wall, the upper sidewall, and the lower sidewall. The inflatable bellows is arranged in the internal space to facilitate variation of the distance between the top wall and the bottom wall during relative movement between the upper sidewall and lower sidewall by inflation of the inflatable bellows.

The present invention provides an apparatus for working oppositely arranged first and second surfaces of a pressing section. The apparatus comprises an upper working unit forming a top wall and an upper sidewall extending downwardly from the top wall; a lower working unit forming a bottom wall and a lower sidewall extending upwardly from the bottom wall; and an inflatable bellows movable between an inflated state and a deflated state by inflation with an inflation medium. The upper sidewall is arranged to guide the lower sidewall to thereby form an internal space enclosed by the top wall, the bottom wall, the upper sidewall, and the lower sidewall. The inflatable bellows is arranged in the internal space to facilitate variation of the distance between the top wall and the bottom wall during relative movement between the upper sidewall and lower sidewall by inflation of the inflatable bellows.

The invention refers to a double-sided polishing or sanding member (24) for releasable attachment to a hand-guided power tool (2). The polishing or sanding member (24) has an essentially disc-shaped form with an areal extension (26). A reinforcement plate (28) is located inside the polishing or sanding member (24) in the areal extension (26). The reinforcement plate (28) has a central attachment portion (30) for releasable attachment of the polishing or sanding member (24) to the power tool (2). It is suggested that the central attachment portion (30) comprises at least one magnetic element (32) adapted for interaction with at least one respective magnetic element (34) directly or indirectly attached to a tool shaft (14) of the power tool (2) in order to hold and secure the polishing or sanding member (24) in respect to the tool shaft (14).

The invention refers to a double-sided polishing or sanding member (24) for releasable attachment to a hand-guided power tool (2). The polishing or sanding member (24) has an essentially disc-shaped form with an areal extension (26). A reinforcement plate (28) is located inside the polishing or sanding member (24) in the areal extension (26). The reinforcement plate (28) has a central attachment portion (30) for releasable attachment of the polishing or sanding member (24) to the power tool (2). It is suggested that the central attachment portion (30) comprises at least one magnetic element (32) adapted for interaction with at least one respective magnetic element (34) directly or indirectly attached to a tool shaft (14) of the power tool (2) in order to hold and secure the polishing or sanding member (24) in respect to the tool shaft (14).

A manufacturing method of a carrier for a double-side polishing apparatus, including: preparing a carrier base material and insert thicker than the carrier base material, inserting the insert into a holding hole so as to protrude the insert from both sides of the front surface and back surface of the carrier base material, measuring each of a front protruding amount of the insert protruded from front surface of the carrier base material and a back protruding amount of the insert protruded from back surface of the carrier base material, setting each rotational speed of the upper turn table and lower turn table in starting-up polishing of the carrier so as to decrease the difference between the front protruding amount and back protruding amount, and a starting-up polishing step to subject the carrier to starting-up polishing at each set rotational speed of the upper turn table and the lower turn table.