Methods of polishing a patterned surface of an electrostatic chucking (ESC) substrate support to be used in plasma assisted or plasma enhanced semiconductor manufacturing chambers are provided herein. In particular, embodiments described herein, provide polishing methods that round and debur the edges of elevated features and remove dielectric material from the non-substrate contacting surfaces of a patterned substrate support to reduce defectivity associated therewith.

In a wafer chuck design featuring pins or mesas making up the support surface, engineering the pins to have an annular shape, or to contain holes or pits, minimizes sticking of the wafer, and improves wafer settling. In another aspect of the invention is a tool and method for imparting or restoring flatness and roughness to a surface, such as the support surface of a wafer chuck. The tool is shaped such that the contact to the surface being treated is a circle or annulus. The treatment method may take place in a dedicated apparatus, or in-situ in semiconductor fabrication apparatus. The tool is smaller than the diameter of the wafer pin chuck, and may be approximate to the spatial frequency of the high spots to be lapped. The movement of the tool relative to the support surface is such that all areas of the support surface may be processed by the tool, or only those areas needing correction.

In a wafer chuck design featuring pins or mesas making up the support surface, engineering the pins to have an annular shape, or to contain holes or pits, minimizes sticking of the wafer, and improves wafer settling. In another aspect of the invention is a tool and method for imparting or restoring flatness and roughness to a surface, such as the support surface of a wafer chuck. The tool is shaped such that the contact to the surface being treated is a circle or annulus. The treatment method may take place in a dedicated apparatus, or in-situ in semiconductor fabrication apparatus. The tool is smaller than the diameter of the wafer pin chuck, and may be approximate to the spatial frequency of the high spots to be lapped. The movement of the tool relative to the support surface is such that all areas of the support surface may be processed by the tool, or only those areas needing correction.

A process for making anti-reflective optical glass comprises the steps of: A. implementing an abrading tool including a carrier having a plurality of diamond cutting wires formed on the carrier; and B. centrifugally and resiliently abrading a substrate of optical glass by the abrading tool to form a plurality of microscopic protuberances or moth-eye like structures on the substrate to thereby reduce the light reflection from the substrate and increase the light transmission in the substrate.

A process for making anti-reflective optical glass comprises the steps of: A. implementing an abrading tool including a carrier having a plurality of diamond cutting wires formed on the carrier; and B. centrifugally and resiliently abrading a substrate of optical glass by the abrading tool to form a plurality of microscopic protuberances or moth-eye like structures on the substrate to thereby reduce the light reflection from the substrate and increase the light transmission in the substrate.

A local polishing system comprises: a particle estimation unit (30) for estimating the film thickness distribution of a wafer; a local polishing region setting unit (11) for setting a local polishing region on the wafer based on the film thickness distribution; a polishing head selection unit (12) for selecting a polishing head based on the size of the local polishing region; a model storage (20) holding a recipe generating model that defines the relation between an input node and an output node, the input node being an attribute of the local polishing region, the output node comprising a recipe for a polishing process; a polishing recipe generator (13) that puts an attribute of the local polishing region set by the local polishing region setting unit (11) into the input node of the recipe generating model and determines a polishing recipe for polishing the local polishing region; and a polishing recipe transmitter (15) for transmitting data of the polishing recipe to a local polishing module (200) that performs local polishing.

A local polishing system comprises: a particle estimation unit (30) for estimating the film thickness distribution of a wafer; a local polishing region setting unit (11) for setting a local polishing region on the wafer based on the film thickness distribution; a polishing head selection unit (12) for selecting a polishing head based on the size of the local polishing region; a model storage (20) holding a recipe generating model that defines the relation between an input node and an output node, the input node being an attribute of the local polishing region, the output node comprising a recipe for a polishing process; a polishing recipe generator (13) that puts an attribute of the local polishing region set by the local polishing region setting unit (11) into the input node of the recipe generating model and determines a polishing recipe for polishing the local polishing region; and a polishing recipe transmitter (15) for transmitting data of the polishing recipe to a local polishing module (200) that performs local polishing.

A disc containing copper for sapphire polishing; the annular surface of the disc is provided with a spiral grinding groove or concentric circular grinding grooves thereon; and stepped grooves are provided at the edges along both the outer ring and inner ring of the annular surface of the disc. Also provided is a method of repairing discs containing copper facing each other for sapphire polishing, comprising: first step, horizontally and transversely moving an upper disc and a lower disc turning tool, or a lower disc and an upper disc turning tool, and aligning the turning tool with the original position of the grinding groove on the corresponding disc; second step, controlling the upper disc and the lower disc to rotate in opposite directions at the same rotation speed and with the turning tools fixed, controlling the upper disc or the lower disc to be fed transversely, and turning a corresponding grinding groove via the turning tools; third step, removing the turning tools and washing the surface of the corresponding discs.

A disc containing copper for sapphire polishing; the annular surface of the disc is provided with a spiral grinding groove or concentric circular grinding grooves thereon; and stepped grooves are provided at the edges along both the outer ring and inner ring of the annular surface of the disc. Also provided is a method of repairing discs containing copper facing each other for sapphire polishing, comprising: first step, horizontally and transversely moving an upper disc and a lower disc turning tool, or a lower disc and an upper disc turning tool, and aligning the turning tool with the original position of the grinding groove on the corresponding disc; second step, controlling the upper disc and the lower disc to rotate in opposite directions at the same rotation speed and with the turning tools fixed, controlling the upper disc or the lower disc to be fed transversely, and turning a corresponding grinding groove via the turning tools; third step, removing the turning tools and washing the surface of the corresponding discs.

Provided is a finish polishing surface plate configured such that a polishing film is mounted thereon. The finish polishing surface plate includes a plate body having a planar surface; and a plurality of island shaped protrusions formed on the surface of the plate body. In the plurality of island shaped protrusions, continuous grooved recesses are formed between the respective island shaped protrusions.