In a wafer chuck design featuring pins or mesas making up the support surface, engineering the pins to have an annular shape, or to contain holes or pits, minimizes sticking of the wafer, and improves wafer settling. In another aspect of the invention is a tool and method for imparting or restoring flatness and roughness to a surface, such as the support surface of a wafer chuck. The tool is shaped such that the contact to the surface being treated is a circle or annulus. The treatment method may take place in a dedicated apparatus, or in-situ in semiconductor fabrication apparatus. The tool is smaller than the diameter of the wafer pin chuck, and may be approximate to the spatial frequency of the high spots to be lapped. The movement of the tool relative to the support surface is such that all areas of the support surface may be processed by the tool, or only those areas needing correction.

A disc containing copper for sapphire polishing; the annular surface of the disc is provided with a spiral grinding groove or concentric circular grinding grooves thereon; and stepped grooves are provided at the edges along both the outer ring and inner ring of the annular surface of the disc. Also provided is a method of repairing discs containing copper facing each other for sapphire polishing, comprising: first step, horizontally and transversely moving an upper disc and a lower disc turning tool, or a lower disc and an upper disc turning tool, and aligning the turning tool with the original position of the grinding groove on the corresponding disc; second step, controlling the upper disc and the lower disc to rotate in opposite directions at the same rotation speed and with the turning tools fixed, controlling the upper disc or the lower disc to be fed transversely, and turning a corresponding grinding groove via the turning tools; third step, removing the turning tools and washing the surface of the corresponding discs.

A disc containing copper for sapphire polishing; the annular surface of the disc is provided with a spiral grinding groove or concentric circular grinding grooves thereon; and stepped grooves are provided at the edges along both the outer ring and inner ring of the annular surface of the disc. Also provided is a method of repairing discs containing copper facing each other for sapphire polishing, comprising: first step, horizontally and transversely moving an upper disc and a lower disc turning tool, or a lower disc and an upper disc turning tool, and aligning the turning tool with the original position of the grinding groove on the corresponding disc; second step, controlling the upper disc and the lower disc to rotate in opposite directions at the same rotation speed and with the turning tools fixed, controlling the upper disc or the lower disc to be fed transversely, and turning a corresponding grinding groove via the turning tools; third step, removing the turning tools and washing the surface of the corresponding discs.

Provided is a finish polishing surface plate configured such that a polishing film is mounted thereon. The finish polishing surface plate includes a plate body having a planar surface; and a plurality of island shaped protrusions formed on the surface of the plate body. In the plurality of island shaped protrusions, continuous grooved recesses are formed between the respective island shaped protrusions.

Provided is a finish polishing surface plate configured such that a polishing film is mounted thereon. The finish polishing surface plate includes a plate body having a planar surface; and a plurality of island shaped protrusions formed on the surface of the plate body. In the plurality of island shaped protrusions, continuous grooved recesses are formed between the respective island shaped protrusions.

Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized abrasive particles in an additive manufacturing process, such as a 3D inkjet printing process. In one embodiment, a method of forming a polishing article includes dispensing a first plurality of droplets of a first precursor, curing the first plurality of droplets to form a first layer comprising a portion of a sub-polishing element, dispensing a second plurality of droplets of the first precursor and a second precursor onto the first layer, and curing the second plurality of droplets to form a second layer comprising portions of the sub-polishing element and portions of a plurality of polishing elements. Here, the second precursor includes functionalized abrasive particles having a polymerizable group chemically bonded to surfaces thereof.

Implementations described herein generally relate to methods and apparatus for polishing substrates, more particularly, to methods and apparatus for identifying and/or tracking polishing material in a roll-to-roll polishing system. In one implementation, a method of polishing a substrate is provided. The method comprises advancing a polishing material across a surface of a platen. The polishing material has a polishing surface and an opposing backside surface and the backside surface has a pattern of identifying features formed thereon. The method further comprises sensing the movement of the pattern of identifying features past a detector assembly. The method further comprises controlling a position of the polishing material relative to the platen based on data received from the sensed movement of the pattern of identifying features.

An object of the present invention is to provide a polishing table capable of preventing peeling or detachment of a coating of the polishing table, thereby to enable an operation for replacement of a polishing pad to be easily conducted. One embodiment of the present invention provides a polishing table having a support surface configured to support a polishing pad, the polishing pad being adapted to be used for polishing a substrate, the polishing table comprising: a stacked body comprising a stack of a porous layer and a non-porous layer, the porous layer including open pores formed in a surface thereof disposed to face a polishing pad; and a resin-based coating material disposed in the open pores so as to form at least a part of the support surface of the polishing table.

The present disclosure involves a method of making a lapping plate by electrostatically coating a platen with solid resin powder and abrasive particles followed by curing the solid resin powder to form an abrasive coating. The present disclosure also involves related lapping plates.

The present disclosure involves a method of making a lapping plate by electrostatically coating a platen with solid resin powder and abrasive particles followed by curing the solid resin powder to form an abrasive coating. The present disclosure also involves related lapping plates.