The present disclosure is to provide a polishing pad which is capable of providing physical properties corresponding to various polishing purposes for various polishing objects through the subdivided structural design in a thickness direction, and of securing environmental friendliness by applying a recycled or recyclable material to at least some components, in relation to disposal after use, unlike the conventional polishing pad. Specifically, it includes a polishing layer, wherein the polishing layer includes a polishing variable layer having a polishing surface; and a polishing constant layer disposed on a rear surface side of the polishing variable layer opposite to the polishing surface.

The present disclosure is to provide a polishing pad which is capable of providing physical properties corresponding to various polishing purposes for various polishing objects through the subdivided structural design in a thickness direction, and of securing environmental friendliness by applying a recycled or recyclable material to at least some components, in relation to disposal after use, unlike the conventional polishing pad. Specifically, the polishing pad includes a polishing layer, wherein the polishing layer includes a polishing variable layer having a polishing surface; and a polishing constant layer disposed on a rear surface side of the polishing variable layer opposite to the polishing surface, and wherein the polishing constant layer includes a cured product of a composition having thermosetting polyurethane particles and a binder.

The present disclosure is to provide a polishing pad which is capable of providing physical properties corresponding to various polishing purposes for various polishing objects through the subdivided structural design in a thickness direction, and of securing environmental friendliness by applying a recycled or recyclable material to at least some components, in relation to disposal after use, unlike the conventional polishing pad. Specifically, the polishing pad includes a polishing layer, wherein the polishing layer includes a polishing variable layer having a polishing surface; and a polishing constant layer disposed on a rear surface side of the polishing variable layer opposite to the polishing surface, and wherein the polishing constant layer includes a cured product of a composition having thermosetting polyurethane particles and a binder.

The hollow microballoons for CMP polishing pad of the invention are formed of at least one resin selected from the group consisting of a melamine resin, a urea resin and an amide resin and have an average particle size of 1 to 100 μm. According to the invention, there can be provided hollow microballoons for CMP polishing pad, which, when used in CMP polishing pad, exhibit excellent polishing characteristics, and can stably produce CMP polishing pad even in production of CMP polishing pad.

The hollow microballoons for CMP polishing pad of the invention are formed of at least one resin selected from the group consisting of a melamine resin, a urea resin and an amide resin and have an average particle size of 1 to 100 μm. According to the invention, there can be provided hollow microballoons for CMP polishing pad, which, when used in CMP polishing pad, exhibit excellent polishing characteristics, and can stably produce CMP polishing pad even in production of CMP polishing pad.

A polishing pad for a semiconductor fabrication operation includes a polishing region and a window region, wherein both regions are made of an interpenetrating polymer network formed from a free-radically polymerized material and a cationically polymerized material.

A polishing pad for a semiconductor fabrication operation includes a polishing region and a window region, wherein both regions are made of an interpenetrating polymer network formed from a free-radically polymerized material and a cationically polymerized material.

Embodiments relate to a porous polyurethane polishing pad for use in a chemical mechanical planarization and a process for preparing the same. It is possible to control the size and distribution of pores in the porous polyurethane polishing pad by using thermally expanded microcapsules and an inert gas as a gas phase foaming agent, whereby the polishing performance thereof can be adjusted.

Embodiments relate to a porous polyurethane polishing pad for use in a chemical mechanical planarization and a process for preparing the same. It is possible to control the size and distribution of pores in the porous polyurethane polishing pad by using thermally expanded microcapsules and an inert gas as a gas phase foaming agent, whereby the polishing performance thereof can be adjusted.

The hollow microballoons of the invention are hollow microballoons formed of a resin produced by polymerizing a polymerizing composition that contains a polyrotaxane monomer having at least two polymerizable functional groups in the molecule and a polymerizable monomer other than the polyrotaxane monomer having at least two polymerizable functional groups in the molecule. Using the hollow microballoons of the invention, a CMP polishing pad having excellent polishing characteristics and durability can be provided.