It is an object of the present invention to provide an abrasive material which enables: processing efficiency and finished planarity of a substrate material to be simultaneously improved at a high level; polishing costs to be reduced; and a difficult-to-process substrate composed of sapphire or silicon carbide to be polished efficiently and precisely. An abrasive material comprises a substrate and an abrasive layer laminated on a front face side of the substrate, wherein the abrasive layer includes a binder containing an inorganic substance as a principal component, and abrasive particles dispersed in the binder, wherein a front face of the abrasive layer comprises a plurality of regions provided through dividing by grooves, and wherein a maximum peak height (Rp) on the front face of the abrasive layer is no less than 2.5 μm and no greater than 70 μm.

It is an object of the present invention to provide an abrasive material which enables: processing efficiency and finished planarity of a substrate material to be simultaneously improved at a high level; polishing costs to be reduced; and a difficult-to-process substrate composed of sapphire or silicon carbide to be polished efficiently and precisely. An abrasive material comprises a substrate and an abrasive layer laminated on a front face side of the substrate, wherein the abrasive layer includes a binder containing an inorganic substance as a principal component, and abrasive particles dispersed in the binder, wherein a front face of the abrasive layer comprises a plurality of regions provided through dividing by grooves, and wherein a maximum peak height (Rp) on the front face of the abrasive layer is no less than 2.5 μm and no greater than 70 μm.

The present invention relates to a chemical mechanical polishing (CMP) apparatus for polishing a workpiece, such as a metal body, to a mirror finish. The chemical mechanical polishing apparatus includes: a polishing pad (2) having an annular polishing surface (2a) which has a curved vertical cross-section; a workpiece holder (11) for holding a workpiece (W) having a polygonal shape; a rotating device (15) configured to rotate the workpiece holder (11) about an axis of the workpiece (W); a pressing device (14) configured to press a periphery of the workpiece (W) against the annular polishing surface (2a); and an operation controller (25) configured to change a speed at which the rotating device (15) rotates the workpiece (W) according to a rotation angle of the workpiece (W). The pressing device (14) is disposed more inwardly than the workpiece holder (11) in a radial direction of the polishing table (3).

The present invention relates to a chemical mechanical polishing (CMP) apparatus for polishing a workpiece, such as a metal body, to a mirror finish. The chemical mechanical polishing apparatus includes: a polishing pad (2) having an annular polishing surface (2a) which has a curved vertical cross-section; a workpiece holder (11) for holding a workpiece (W) having a polygonal shape; a rotating device (15) configured to rotate the workpiece holder (11) about an axis of the workpiece (W); a pressing device (14) configured to press a periphery of the workpiece (W) against the annular polishing surface (2a); and an operation controller (25) configured to change a speed at which the rotating device (15) rotates the workpiece (W) according to a rotation angle of the workpiece (W). The pressing device (14) is disposed more inwardly than the workpiece holder (11) in a radial direction of the polishing table (3).

Provided are a pressure-sensitive adhesive tape, a polishing pad, a method of manufacturing the same, a polishing device and a method of manufacturing a glass substrate. The illustrative pressure-sensitive adhesive tape may be a pressure-sensitive adhesive tape for a polishing material. The pressure-sensitive adhesive tape may be effectively fixed to a surface plate without bubbles, and have excellent resistance to water and a polishing solution and shear strength applied in a polishing process. In addition, the pressure-sensitive adhesive tape may be easily removed from a carrier or surface plate for a polishing pad without residues after polishing.

Provided are a pressure-sensitive adhesive tape, a polishing pad, a method of manufacturing the same, a polishing device and a method of manufacturing a glass substrate. The illustrative pressure-sensitive adhesive tape may be a pressure-sensitive adhesive tape for a polishing material. The pressure-sensitive adhesive tape may be effectively fixed to a surface plate without bubbles, and have excellent resistance to water and a polishing solution and shear strength applied in a polishing process. In addition, the pressure-sensitive adhesive tape may be easily removed from a carrier or surface plate for a polishing pad without residues after polishing.

An observation and photography apparatus that has a polishing mechanism attached thereto. The polishing mechanism is provided with a turntable with a perpendicular rotation shaft, a polishing cloth for polishing the surface of a sample attached to the bottom surface of the turntable, and a polishing-fluid spraying nozzle disposed below the polishing cloth for spraying polishing fluid containing polishing material upward to we the polishing cloth.

An observation and photography apparatus that has a polishing mechanism attached thereto. The polishing mechanism is provided with a turntable with a perpendicular rotation shaft, a polishing cloth for polishing the surface of a sample attached to the bottom surface of the turntable, and a polishing-fluid spraying nozzle disposed below the polishing cloth for spraying polishing fluid containing polishing material upward to we the polishing cloth.

The present invention provides methods for making a pre-conditioned chemical mechanical (CMP) polishing pad having a pad surface microtexture effective for polishing comprising grinding the surface of the CMP polishing pad having a radius with a rotary grinder while it is held in place on a flat bed platen surface, the rotary grinder having a grinding surface disposed parallel to or substantially parallel to the surface of the flat bed platen and made of a porous abrasive material, wherein the resulting CMP polishing pad has a surface roughness of from 0.01 μm to 25 μm, Sq. The present invention also provides a CMP polishing pad having a series of visibly intersecting arcs on the polishing layer surface, the intersecting arcs having a radius of curvature equal to or greater than half of the radius of curvature of the pad and extending all the way around the surface of the pad in radial symmetry around the center point of the pad.

The present invention provides methods for making a pre-conditioned chemical mechanical (CMP) polishing pad having a pad surface microtexture effective for polishing comprising grinding the surface of the CMP polishing pad having a radius with a rotary grinder while it is held in place on a flat bed platen surface, the rotary grinder having a grinding surface disposed parallel to or substantially parallel to the surface of the flat bed platen and made of a porous abrasive material, wherein the resulting CMP polishing pad has a surface roughness of from 0.01 μm to 25 μm, Sq. The present invention also provides a CMP polishing pad having a series of visibly intersecting arcs on the polishing layer surface, the intersecting arcs having a radius of curvature equal to or greater than half of the radius of curvature of the pad and extending all the way around the surface of the pad in radial symmetry around the center point of the pad.