A method of using a polishing pad includes applying a slurry to a first location on the polishing pad. The method further includes rotating the polishing pad. The method further includes spreading the slurry across a first region of the polishing pad at a first rate, wherein the first region includes a plurality of first grooves, a first material property of the first region varies in a thickness direction of the polishing pad, each of the plurality of first grooves extends through at least two variations in the first material property, and the first material property comprises porosity, specific gravity or absorbance. The method further includes spreading the slurry across a second region of the polishing pad at a second rate different from the first rate, wherein the second region comprises a plurality of second grooves.

A recycled polishing pad includes an upper layer pad and a supplementary pad. The upper layer pad includes a first surface and a second surface opposite to the first surface. The first surface has a plurality of first grooves and the second surface has a plurality of second grooves. The upper layer pad further includes a connecting body connecting the first grooves and the second grooves. The supplementary pad is in contact with the second surface of the upper layer pad. A depth of each of the first grooves is less than a depth of each of the second grooves.

A polishing head assembly for polishing of semiconductor wafers includes a polishing head and a cap. The polishing head has a top portion and a recess along a bottom portion. The recess has a recessed surface. Holes extend from the top portion through the recessed surface. The cap is positioned within the recess and the cap has an annular wall and a floor extending across the annular wall. The annular wall has apertures corresponding to the holes. The floor is spaced from the recessed surface to form a chamber therebetween. The polishing head assembly also includes a band that circumscribes a portion of the annular wall. The holes and the corresponding apertures receive fasteners to removably secure the annular wall to the recessed surface.

A polishing head assembly for polishing of semiconductor wafers includes a polishing head and a cap. The polishing head has a top portion and a recess along a bottom portion. The recess has a recessed surface. Holes extend from the top portion through the recessed surface. The cap is positioned within the recess and the cap has an annular wall and a floor extending across the annular wall. The annular wall has apertures corresponding to the holes. The floor is spaced from the recessed surface to form a chamber therebetween. The polishing head assembly also includes a band that circumscribes a portion of the annular wall. The holes and the corresponding apertures receive fasteners to removably secure the annular wall to the recessed surface.

A method for fabricating a polishing pad including a plurality of polishing structures includes providing a mold having a top surface and a bottom surface, the mold including a plurality of recesses that correspond to polishing structures formed on the top surface thereof; dispensing a polymer mix on the mold and allowing the polymer mix to fill the plurality of recesses to be formed as the polishing structures; laminating a base film on the top surface of the mold; curing the polymer mix to allow the polymer mix to adhere to the base film and to form the polishing structures on the base film; and demolding the base film and the polishing structures from the mold to obtain a polishing pad sheet. Subsequently, the polishing pad sheet is cut into a plurality of polishing pads.

A method for fabricating a polishing pad including a plurality of polishing structures includes providing a mold having a top surface and a bottom surface, the mold including a plurality of recesses that correspond to polishing structures formed on the top surface thereof; dispensing a polymer mix on the mold and allowing the polymer mix to fill the plurality of recesses to be formed as the polishing structures; laminating a base film on the top surface of the mold; curing the polymer mix to allow the polymer mix to adhere to the base film and to form the polishing structures on the base film; and demolding the base film and the polishing structures from the mold to obtain a polishing pad sheet. Subsequently, the polishing pad sheet is cut into a plurality of polishing pads.

A polishing pad for chemical mechanical polishing (CMP) contains a lower polishing pad layer including a bottom surface of the polishing pad, an upper polishing pad layer including a top surface of the polishing pad, tunnels vertically spaced from the top surface of the polishing pad and from the bottom surface of the polishing pad, such that each of the tunnels laterally extends continuously to a respective opening in a peripheral sidewall of the polishing pad, and perforation holes vertically extending from the tunnels to the top surface of the polishing pad.

A polishing pad for chemical mechanical polishing (CMP) contains a lower polishing pad layer including a bottom surface of the polishing pad, an upper polishing pad layer including a top surface of the polishing pad, tunnels vertically spaced from the top surface of the polishing pad and from the bottom surface of the polishing pad, such that each of the tunnels laterally extends continuously to a respective opening in a peripheral sidewall of the polishing pad, and perforation holes vertically extending from the tunnels to the top surface of the polishing pad.

The present invention provides a polishing pad for a wafer polishing apparatus, comprising: an upper pad having a front surface part, which has a cut surface and is in contact with a wafer, a rear surface part positioned on the lower part of the front surface part, and a plurality of grid grooves passing through the front surface part and the rear surface part; a lower pad, which is arranged on the lower part of the upper pad and can be attached to a surface plate; and an adhesion part positioned between the upper pad and the lower pad to couple the upper pad with the lower pad.

The present invention provides a polishing pad for a wafer polishing apparatus, comprising: an upper pad having a front surface part, which has a cut surface and is in contact with a wafer, a rear surface part positioned on the lower part of the front surface part, and a plurality of grid grooves passing through the front surface part and the rear surface part; a lower pad, which is arranged on the lower part of the upper pad and can be attached to a surface plate; and an adhesion part positioned between the upper pad and the lower pad to couple the upper pad with the lower pad.