A system includes an abrasion assembly containing one or more abrasion pads configured to clean a faying surface of multiple nutplates, and a shaft attached to at least one of the abrasion pads and configured to rotate some or all of the abrasion pads during cleaning, wherein cleaning includes abrading the faying surfaces with the abrasion pads. The system also includes a base configured to attach to a pressure applicator, and a pressure applicator configured to attach to the base, hold the nutplates such that the faying surface of each nutplate is capable of contacting one of the abrasion pads, and apply pressure to the nutplates such that each of the nutplates contact one of the abrasion pads during the cleaning. Furthermore, the abrasion assembly is configured to rotate the abrasion pads within at least one of the base and the pressure applicator during cleaning.

A stoning or honing device for automatically applying an essentially constant and uniform pressure of an abrasive hard component onto a suspended portion of a continuously moving metal strip surface, for the purpose of defect visual inspection, includes: a main frame supporting at least one carriage bearing a hard component, the carriage being connected to a drive system for moving the hard component towards the metal strip and to apply a controlled contact pressure thereof on the metal strip surface; and a means for moving transversally and back and forth at a defined speed the hard component bearing carriage with respect to a continuous motion direction of the strip. The device includes, on each strip side, a plurality of hard component bearing carriages having each a defined width stroke and arranged according to at least three different locations respectively associated with three separate rails including drive and control systems.

Chemical mechanical polishing can be used for touch-up polishing in which polishing is performed on a limited area of the front surface of the substrate. The contact area between the polishing pad and the substrate can be substantially smaller than the radius surface of the substrate. During polishing, the polishing pad can undergo an orbital motion. The polishing pad can be maintained in a fixed angular orientation during the orbital motion. The contact area can be arc-shaped. The contact area can be provided by one or more lower portions projecting downward from an upper portion of the polishing pad. A perimeter portion of the polishing pad can be vertically fixed to an annular member and a remainder of the polishing pad within the perimeter portion can be vertically free.

A floor polishing or grinding pad assembly is provided. In one aspects a polishing or grinding pad assembly employs a flexible pad, a reinforcement layer or ring, and multiple floor-contacting tools such as disks. In yet another aspect, at least one of the floor-contacting tools has a workpiece-contacting bottom plane having angle offset from that of a base surface of the tool, a flexible pad and/or a flexible reinforcement layer. A further aspect employs a smaller set of disks alternating between and/or offset from a larger set of the disks.

A floor polishing or grinding pad assembly is provided. In one aspect, a polishing or grinding pad assembly employs a flexible pad, a reinforcement layer or ring, and multiple floor-contacting tools such as abrasive disks. In another aspect, the reinforcement layer includes a wavy or undulating internal edge shape. A further aspect includes an inner ring edge having radially extending slots between pairs of radially enlarged tool mounting peaks. Still another aspect includes an insulator or spacer between a head of an abrasive tool and a reinforcement ring.

A floor polishing or grinding pad assembly is provided. In one aspect, a polishing or grinding pad assembly employs a fibrous pad, a reinforcement layer or ring, and multiple floor-contacting disks. In another aspect, the reinforcement layer includes a central hole through which the fibrous pad is accessible and the fibrous pad at the hole has a linear dimension (x) greater than a linear dimension (y) of one side of the adjacent reinforcement layer. In yet another aspect, at least one of the floor-contacting disks has an angle () offset from that of a base surface of the disk, the fibrous pad and/or the reinforcement layer. A further aspect employs a smaller set of disks alternating between and/or offset from a larger set of the disks. In another aspect, the reinforcement layer includes a wavy or undulating internal edge shape.

A head for polishing ceramic manufactured articles or natural stones includes a main body and at least one work tool associated with the body for polishing ceramic manufactured articles or natural stones, and an air cooler for the tool.

A floor polishing or grinding pad assembly is provided. In one aspects a polishing or grinding pad assembly employs a flexible pad, a reinforcement layer or ring, and multiple floor-contacting tools such as disks. In yet another aspect, at least one of the floor-contacting tools has a workpiece-contacting bottom plane having angle offset from that of a base surface of the tool, a flexible pad and/or a flexible reinforcement layer. A further aspect employs a smaller set of disks alternating between and/or offset from a larger set of the disks.

A substrate polishing apparatus including a stage configured to load a substrate, the stage having a flat surface, which is parallel to a first direction and a second direction, and on which the substrate is loaded, a pressing unit configured to exert a pressure on the substrate in a third direction, a rotary unit configured to revolve the pressing unit around a central axis parallel to the third direction, when viewed in a plan view, a plurality of polishing pads provided between the pressing unit and the substrate to be in contact with the substrate, and a nozzle part configured to supply a slurry onto the substrate. The polishing pads may be spaced apart from each other in a direction and may have a rectangular shape in the plan view.

According to one embodiment, a method for handling congestion in a network includes determining that there is congestion on a first device in a network, setting a congestion indicator in a header of a packet to indicate an amount of congestion at the first device, sending the packet to all devices that send traffic to the first device, receiving the packet having the multi-bit indicator in a header thereof at a device that sends traffic to the first device, and reducing a congestion window by a factor of between about 5% and about 50% based on a severity of the congestion indicated by the multi-bit indicator, wherein the congestion window is reduced by a greater factor when the congestion is indicated as being more severe. Other systems and methods for handling congestion in a network are described according to more embodiments.