A method of optimizing a manufacturing process or a blade array of a razor cartridge using spatial information for a tip portion of a razor blade comprises the steps of: measuring, using an atomic force microscope including a probe having a high aspect ratio of a length to a half side angle and a probe tip with a radius less than a radius of an ultimate tip of the tip portion of the razor blade, the spatial information by traversing the probe across the tip portion of the razor blade; analyzing, by one or more processors, the spatial information as measured by the atomic force microscope, to determine one or more blade characteristics; and using the blade characteristics to adjust the manufacturing process to improve a design of the razor blade or to adjust a design characteristic of the blade array to improve a design of the razor cartridge.

A polishing apparatus includes a rotatable head body having a pressing surface, a retainer ring configured to press a polishing surface while rotating together with the head body, a stationary ring, local load applying devices configured to apply a local load to the stationary ring, and a controller. The local load applying devices include a first pressing member and a second pressing member connected to the stationary ring. The first pressing member is disposed in the upstream side of the retainer ring in the traveling direction of the polishing surface, and the second pressing member is disposed in the downstream side. The controller calculates the inclination angle of the stationary ring based on a measured value of the height of at least one of the first pressing member and the second pressing member.

A grinding apparatus includes a chuck table that holds a wafer on a holding surface; a grinding unit that has a spindle unit in which a spindle with an annular grindstone mounted to a tip thereof is rotatably supported and that grinds the wafer by use of the grindstone; a grinding feeding mechanism that puts the grinding unit into grinding feeding in a grinding feeding direction perpendicular to the holding surface; a first height gauge that measures the height of the holding surface; a second height gauge that measures the height of an upper surface of the wafer; and a calculation section that calculates the difference between the height of the holding surface and the height of the upper surface of the wafer, as the thickness of the wafer. In the grinding apparatus, the first height gauge and the second height gauge are disposed in the grinding unit.

Provided is a high-precision substrate polishing system. An apparatus for polishing a substrate includes a platen on which a polishing pad is seated and which is rotatable, a substrate carrier configured to grip a substrate and rotatable on an upper side of the platen, an infrared sensor located inside the platen and configured to measure a temperature of the substrate, and a controller configured to determine a polishing state of the substrate using a value measured by the infrared sensor.

A workpiece processing apparatus which coats a front surface of a workpiece with a resin, the workpiece having devices formed in regions demarcated by a plurality of planned dividing lines formed in a lattice pattern. The workpiece processing apparatus includes a cassette mounting base mounted with a cassette housing a plurality of workpieces, a resin coating unit that coats the front surface of the workpiece with the resin, a resin curing unit that cures the resin by applying an external stimulus to the coated resin, a resin grinding unit that flattens the cured resin by grinding the cured resin by a rotating grinding stone, and a conveying mechanism that conveys the workpiece between the units.

Systems and methods are provided for detecting contact between a manufacturing apparatus and an article being worked upon by the manufacturing apparatus. Vehicles that include the article are also provided. The system includes the manufacturing apparatus configured to perform a process on the article, a signal transmitter configured to apply an input signal to the article with during the process such that the input signal is conducted through the article, a signal receiver configured to monitor a first component of the manufacturing apparatus to detect conduction of the input signal through the first component with during the process, and a signal processor configured to determine whether contact has occurred between the first component of the manufacturing apparatus and the article based on the detection of the input signal by the signal receiver.

The disclosure relates to methods for compensating for crystal structures differential material removal rates in sub-aperture figuring. A computing machine receives an input related to a substrate crystal structure. The computing machine generates, based on the input, a surface map data capturing the substrate crystal structure. The computing machine generates, based on the surface map data structure, a figuring route data structure for a figuring tool to figure an optical surface on the crystal substrate. The computing machine controls, using the processing circuitry and based on the figuring route data structure, the figuring tool to figure the substrate crystal optical surface.

An apparatus for checking the diameter of crankpins (15) of a crankshaft in orbital motion about a geometrical axis in a numerical control machine tool includes a V-shaped reference device (10), a measuring device (6) and a support device (4) fixed to the tool holding slide (2) that movably supports the reference device and the measuring device. A control device (50) for controlling automatic displacements of the apparatus towards and away from a checking condition, includes a programmable electric motor (60) and a transmission mechanism (62). The programmable electric motor is programmed to define a start position in which the automatic displacement of the apparatus away from the checking condition can be stopped, for instance a rest position or an intermediate position between the rest position and the checking condition. The programmable electric motor is also programmed to define a displacement speed and a checking method includes steps for controlling the automatic displacements towards the checking condition.

A grinding apparatus includes a chuck table that holds a wafer on a holding surface; a grinding unit that has a spindle unit in which a spindle with an annular grindstone mounted to a tip thereof is rotatably supported and that grinds the wafer by use of the grindstone; a grinding feeding mechanism that puts the grinding unit into grinding feeding in a grinding feeding direction perpendicular to the holding surface; a first height gauge that measures the height of the holding surface; a second height gauge that measures the height of an upper surface of the wafer; and a calculation section that calculates the difference between the height of the holding surface and the height of the upper surface of the wafer, as the thickness of the wafer. In the grinding apparatus, the first height gauge and the second height gauge are disposed in the grinding unit.

A closed loop system for a grind line including at least one grinder configured to machine a part with the grind line; a first coordinate measuring machine operatively coupled to the at least one grinder; a second coordinate measuring machine operatively coupled to the at least one grinder; and a processor operatively coupled to the at least one grinder and the first coordinate measuring machine and the second coordinate measuring machine, the processor configured to provide processor outputs to the at least one grinder responsive to data collected from the first coordinate measuring machine and the second coordinate measuring machine.