Patent classifications
B29B7/90
Method of making a microporous material
A method for producing a microporous material comprising the steps of: providing an ultrahigh molecular weight polyethylene (UHMWPE); providing a filler; providing a processing plasticizer; adding the filler to the UHMWPE in a mixture being in the range of from about 1:9 to about 15:1 filler to UHMWPE by weight; adding the processing plasticizer to the mixture; extruding the mixture to form a sheet from the mixture; calendering the sheet; extracting the processing plasticizer from the sheet to produce a matrix comprising UHMWPE and the filler distributed throughout the matrix; stretching the microporous material in at least one direction to a stretch ratio of at least about 1.5 to produce a stretched microporous matrix; and subsequently calendering the stretched microporous matrix to produce a microporous material which exhibits improved physical and dimensional stability properties over the stretched microporous matrix.
Process for making pressure-sensitive adhesive and duct tape
A continuous process for making a pressure-sensitive adhesive is disclosed. A mixture comprising natural rubber having a Mooney viscosity of 85 to 100, a tackifier, a filler, and 0.1 to 5 wt. % of an added C.sub.12-C.sub.24 fatty acid based on the amount of mixture is masticated in a first section of a single- or twin-screw extruder. Mastication of the mixture continues in at least one subsequent extruder section in the presence of additional tackifier. The product is a homogeneous, reduced-viscosity pressure-sensitive adhesive. The minor proportion of added C.sub.12-C.sub.24 fatty acid aids mastication of the rubber and enables high throughput without addition of peptizers. Duct tapes made from the adhesives display improved adhesion to steel, better adhesion bond strength, and enhanced seven-day clean removability from even difficult substrates such as marble or ceramic tile.
Process for making pressure-sensitive adhesive and duct tape
A continuous process for making a pressure-sensitive adhesive is disclosed. A mixture comprising natural rubber having a Mooney viscosity of 85 to 100, a tackifier, a filler, and 0.1 to 5 wt. % of an added C.sub.12-C.sub.24 fatty acid based on the amount of mixture is masticated in a first section of a single- or twin-screw extruder. Mastication of the mixture continues in at least one subsequent extruder section in the presence of additional tackifier. The product is a homogeneous, reduced-viscosity pressure-sensitive adhesive. The minor proportion of added C.sub.12-C.sub.24 fatty acid aids mastication of the rubber and enables high throughput without addition of peptizers. Duct tapes made from the adhesives display improved adhesion to steel, better adhesion bond strength, and enhanced seven-day clean removability from even difficult substrates such as marble or ceramic tile.
Composite material
A composite material and method of producing a composite material for use in fabrication, building and construction is disclosed. A composition as disclosed herein comprises a high proportion of particulate waste material dispersed in a matrix of thermoplastic polymer and wax. A method of producing a composite material comprises melt mixing thermoplastic polymer and wax with a particulate material, thereby dispersing the particulate material in a melt mixture of the composite material.
Composite material
A composite material and method of producing a composite material for use in fabrication, building and construction is disclosed. A composition as disclosed herein comprises a high proportion of particulate waste material dispersed in a matrix of thermoplastic polymer and wax. A method of producing a composite material comprises melt mixing thermoplastic polymer and wax with a particulate material, thereby dispersing the particulate material in a melt mixture of the composite material.
Tablet-type epoxy resin composition for sealing semiconductor device, and semiconductor device sealed using the same
A tablet form of an epoxy resin composition for encapsulation of semiconductor elements, where the tablet form of the epoxy resin composition: (i) includes 97 wt % or more of tablets having a diameter of 0.1 mm to less than 2.8 mm and a height of 0.1 mm to less than 2.8 mm, as measured using an ASTM standard sieve; (ii) satisfies the following Equation 1,
where σD is a standard deviation of tablet diameters and σH is a standard deviation of tablet heights, as measured with respect to 50 tablets arbitrarily selected from the tablets; and (iii) the tablets have a compression density of 1.2 g/mL to 1.7 g/mL.
METHOD FOR PRODUCING SYNTHETIC RESIN MOLDED ARTICLE IN WHICH MARINE FLOATING PLASTIC WASTE IS USED
The present invention provides a method for manufacturing a synthetic resin molded product which does not require classification of recovered ocean floating plastic trash according to kind of plastic, and can reuse most thereof as a raw material. The method is characterized by including mixing ocean floating plastic trash P (30 to 80 wt %) having a diameter or a side of 5 mm or less or a weight of 0.1 g or less, and a woodchip W (second material) (20 to 70 wt %) having a diameter or a side of 5 mm or less, and not molten under a temperature condition of 200° C. by a mixer 3, supplying a mixture of the ocean floating plastic trash P and the woodchip W to a grinding device 4, grinding the mixture into a powder with a diameter or a side of 1 mm or less, supplying the resulting powder as a raw material for a synthetic resin molded product to a molding machine, and carrying out a molding step.
HOMOGENEOUS SHEET EXCLUDING POLYVINYL CHLORIDE
Included is a homogeneous sheet, which excludes polyvinylchloride. The sheet includes a polyurethane, a synthetic rubber blend, and a filler. The synthetic rubber blend may include a pre-mix of a synthetic rubber and white oil.
METHOD FOR FABRICATION OF 3D PRINTED PART WITH HIGH THROUGH-PLANE THERMAL CONDUCTIVITY
A method for fabrication of a 3D printed part with high through-plane thermal conductivity is provided, where pure polymer particles and a carbon-based filler for heat conduction are subjected to milling and mixing in the mechanochemical reactor disclosed in Chinese patent ZL 95111258.9 under the controlled milling conditions including milling pan surface temperature, milling pan pressure, and number of milling cycles; then a resulting mixture is extruded to obtain 3D printing filaments; and finally, the 3D printing filaments are used to fabricate the 3D printed part with high through-plane thermal conductivity through fused deposition modeling (FDM) 3D printing. The fabrication method can realize the fabrication of a 3D printed part with high through-plane thermal conductivity through the FDM 3D printing technology, features simple process, continuous production, etc., and is suitable for the industrial production of thermally-conductive parts with complex structures.
METHOD FOR FABRICATION OF 3D PRINTED PART WITH HIGH THROUGH-PLANE THERMAL CONDUCTIVITY
A method for fabrication of a 3D printed part with high through-plane thermal conductivity is provided, where pure polymer particles and a carbon-based filler for heat conduction are subjected to milling and mixing in the mechanochemical reactor disclosed in Chinese patent ZL 95111258.9 under the controlled milling conditions including milling pan surface temperature, milling pan pressure, and number of milling cycles; then a resulting mixture is extruded to obtain 3D printing filaments; and finally, the 3D printing filaments are used to fabricate the 3D printed part with high through-plane thermal conductivity through fused deposition modeling (FDM) 3D printing. The fabrication method can realize the fabrication of a 3D printed part with high through-plane thermal conductivity through the FDM 3D printing technology, features simple process, continuous production, etc., and is suitable for the industrial production of thermally-conductive parts with complex structures.