Patent classifications
B29C33/18
STACKED WORKPIECE MOLDING DEVICE
A stacked workpiece molding device 1 includes: a first mold 20 configured to suck and hold a workpiece body 42; and a second mold 30 having on an inner surface a pattern that can be transferred to a surface of a sheet material 44 stacked on the workpiece body 42 and press the sheet material 44 against the workpiece body 42. The inner surface of the second mold 30 includes a groove portion 31 that is positioned at a peripheral edge portion of the workpiece body 42, the second mold 30 includes a through-hole 32 extending to open into the groove portions 31, the through-hole 32 is connected to a first suction device 51 that sucks the sheet material 44, and the first mold 20 includes a suction hole 22 for sucking the workpiece body 42, and the suction hole 22 is connected to a second suction device 52.
DIRECT BOTTOMED ARTICLE OF FOOTWEAR WITH A FILM MOLD
An article of footwear has an upper that is direct attached with the sole in a article of footwear mold. The sole has a film extending up sidewalls of the sole to a film edge that is prior to the sidewall and the upper joining. Method of manufacture of the article of footwear includes steps of positioning a film over a mold cavity and then securing the film to the mold. The film is heated and then drawn into the mold cavity under a vacuum. The film forms a liner of the mold cavity. A foam composition is injected into the lined mold cavity. As the foam composition expands, the foam composition interacts with and mechanically engages with the upper that is poisoned at the mold cavity to allow for the mechanical engagement that results in the direct attach of the sole to the upper.
DIRECT BOTTOMED ARTICLE OF FOOTWEAR WITH A FILM
An article of footwear has an upper that is direct attached with the sole. The sole has a film extending up sidewalls of the sole to a film edge that is prior to the sidewall and the upper joining. Method of manufacture of the article of footwear includes steps of positioning a film over a mold cavity and then securing the film to the mold. The film is heated and then drawn into the mold cavity under a vacuum. The film forms a liner of the mold cavity. A foam composition is injected into the lined mold cavity. As the foam composition expands, the foam composition interacts with and mechanically engages with the upper that is positioned at the mold cavity to allow for the mechanical engagement that results in the direct attach of the sole to the upper. The film is then trimmed from the sole sidewalls.
METHOD OF FORMING COMPONENT USING METAL-RESIN COMPOSITE AND MOLD FOR FORMING SAID COMPONENT
Provided is a method of molding, by using a mold, a component including a metal plate and a thermoplastic resin containing a thermoplastic resin arranged on a surface on one side of the metal plate, the mold including at least a movable mold and a fixed mold including a support portion. Specifically, the molding method includes: an arranging step of arranging a premolded metal plate within the mold; a fixing step of fixing the metal plate by pressing the metal plate against the movable mold with use of the support portion; and a molding step including forming a cavity between the fixed mold and the metal plate by closing the mold, bringing the thermoplastic resin into close contact with the metal plate, and forming an exposed portion by exposing the metal plate out of the softened thermoplastic resin with use of the support portion. With this, without leakage of the thermoplastic resin, a joint region to a metal surface of another component can be reliably secured.
METHOD OF FORMING COMPONENT USING METAL-RESIN COMPOSITE AND MOLD FOR FORMING SAID COMPONENT
Provided is a method of molding, by using a mold, a component including a metal plate and a thermoplastic resin containing a thermoplastic resin arranged on a surface on one side of the metal plate, the mold including at least a movable mold and a fixed mold including a support portion. Specifically, the molding method includes: an arranging step of arranging a premolded metal plate within the mold; a fixing step of fixing the metal plate by pressing the metal plate against the movable mold with use of the support portion; and a molding step including forming a cavity between the fixed mold and the metal plate by closing the mold, bringing the thermoplastic resin into close contact with the metal plate, and forming an exposed portion by exposing the metal plate out of the softened thermoplastic resin with use of the support portion. With this, without leakage of the thermoplastic resin, a joint region to a metal surface of another component can be reliably secured.
Mold test apparatus and method
A mold test apparatus includes a mold support plate having a top surface on which a mold is mounted, wherein the mold support plate includes a plurality of test suction pipes communicating with paths in the mold, vacuum pipes each having one end connected to one of the plurality of test suction pipes, a pump connected to the other end of the pipe, and at least one pressure sensor configured to measure a pressure of the vacuum pipe, wherein the paths communicate with adsorption holes provided in a top surface of the mold, and wherein the at least one pressure sensor includes a determining unit configured to determine whether the adsorption holes are clogged by using the measured pressure.
SEMICONDUCTOR CHIP MOLDING DIE DEVICE
A die device for molding a plurality of semiconductor chips is provided. The die device includes a lower die including a moving plate that has a plurality of V-groove structures for suctioning a release film coated with a resin, and an upper die which descends to the lower die or ascends from the lower die, thereby closing/opening the dies. The upper die includes at least a plurality of suction vent units for suctioning a substrate on which the semiconductor chips are arranged, and the lower die includes a device for manually adjusting the tension of a spring that supports the moving plate.
SEMICONDUCTOR CHIP MOLDING DIE DEVICE
A die device for molding a plurality of semiconductor chips is provided. The die device includes a lower die including a moving plate that has a plurality of V-groove structures for suctioning a release film coated with a resin, and an upper die which descends to the lower die or ascends from the lower die, thereby closing/opening the dies. The upper die includes at least a plurality of suction vent units for suctioning a substrate on which the semiconductor chips are arranged, and the lower die includes a device for manually adjusting the tension of a spring that supports the moving plate.
Direct bottomed article of footwear with a film
An article of footwear has an upper that is direct attached with the sole. The sole has a film extending up sidewalls of the sole to a film edge that is prior to the sidewall and the upper joining. Method of manufacture of the article of footwear includes steps of positioning a film over a mold cavity and then securing the film to the mold. The film is heated and then drawn into the mold cavity under a vacuum. The film forms a liner of the mold cavity. A foam composition is injected into the lined mold cavity. As the foam composition expands, the foam composition interacts with and mechanically engages with the upper that is positioned at the mold cavity to allow for the mechanical engagement that results in the direct attach of the sole to the upper. The film is then trimmed from the sole sidewalls.
POLYMERIC STIFFENED SHEET-LIKE COMPONENT AND PROCESS FOR PRODUCING THE SAME
A process for producing a polymeric stiffened sheet-like component, for example a panel, for aircraft construction. Production includes integration of hollow stiffening profiles, for example closed omega stringers, onto a sheet-like component, for example an external skin, where the stringers and external skin are produced from thermoplastic composite material. The stringers are integrated onto the external skin by establishing contact between the stringers and the external skin and melting thermoplastic composite material with exposure to heat and pressure at the areas of contact between external skin and stringers. Melting of the other sections of the stringers is avoided with a pressurized cooling fluid with a temperature significantly below the melting point of thermoplastic composite material, the fluid flowing through the airtight enclosed space in the stringers. Use of closed airtight thermoplastic omega stringers allows integration of the stringers onto the external skin in absence of any flexible tube within the stringers.