Patent classifications
B29C33/28
Blow molding machine with automatically actuated base coupling
A system is provided for transforming plastic parisons into plastic containers with at least one transforming station which has a blow mold within which the plastic parisons can be expanded by application of a gaseous medium, wherein the blow mold has a base part which is disposed releasably on a support, and with a first fastening mechanism in order to fasten the base part to the support, and wherein the blow mold has at least one side part which is disposed releasably on a support and a second fastening mechanism in order to fasten the side part to the support.
Transportable molding system for forming insulation on long pipes and related methods
A portable molding system is configured for forming insulation on pipes. A set of transportable process modules are configured to be shipped to a molding site, operatively connected together at the molding site to form a site-installed molding system, and subsequently disconnected for transport to another site. The set of transportable process modules includes one or more resin preparation modules configured to prepare resin for being formed into insulation on the pipes. One or more mold modules are configured to define a mold cavity. The one or more mold modules are configured to hold a pipe in the mold cavity, to receive resin prepared by the one or more resin preparation modules in the mold cavity around the pipe, and to form said resin received in the mold cavity into insulation on the pipe.
Transportable molding system for forming insulation on long pipes and related methods
A portable molding system is configured for forming insulation on pipes. A set of transportable process modules are configured to be shipped to a molding site, operatively connected together at the molding site to form a site-installed molding system, and subsequently disconnected for transport to another site. The set of transportable process modules includes one or more resin preparation modules configured to prepare resin for being formed into insulation on the pipes. One or more mold modules are configured to define a mold cavity. The one or more mold modules are configured to hold a pipe in the mold cavity, to receive resin prepared by the one or more resin preparation modules in the mold cavity around the pipe, and to form said resin received in the mold cavity into insulation on the pipe.
SEMICONDUCTOR MOLD COMPOUND TRANSFER SYSTEM AND ASSOCIATED METHODS
Mold compound transfer systems and methods for making mold compound transfer systems are disclosed herein. A method configured in accordance with a particular embodiment includes providing a sheet mold compound, and dispensing a granular mold compound directly on the sheet mold compound. The sheet mold compound can have a first density and the overall granular mold compound can have a second density less than the first density. The method further comprises transferring the solid sheet carrying the dispensed granular mold compound to a molding machine without using a release film.
SEMICONDUCTOR MOLD COMPOUND TRANSFER SYSTEM AND ASSOCIATED METHODS
Mold compound transfer systems and methods for making mold compound transfer systems are disclosed herein. A method configured in accordance with a particular embodiment includes providing a sheet mold compound, and dispensing a granular mold compound directly on the sheet mold compound. The sheet mold compound can have a first density and the overall granular mold compound can have a second density less than the first density. The method further comprises transferring the solid sheet carrying the dispensed granular mold compound to a molding machine without using a release film.
SEMICONDUCTOR MOLD COMPOUND TRANSFER SYSTEM AND ASSOCIATED METHODS
Mold compound transfer systems and methods for making mold compound transfer systems are disclosed herein. A method configured in accordance with a particular embodiment includes placing a sheet mold compound in a containment area defined by a tray cover, and dispensing a granular mold compound over the sheet mold compound. The sheet mold compound can have a first density and the overall granular mold compound can have a second density less than the first density. The method further comprises transferring the solid sheet carrying the dispensed grains to a molding machine without using a release film.
SEMICONDUCTOR MOLD COMPOUND TRANSFER SYSTEM AND ASSOCIATED METHODS
Mold compound transfer systems and methods for making mold compound transfer systems are disclosed herein. A method configured in accordance with a particular embodiment includes placing a sheet mold compound in a containment area defined by a tray cover, and dispensing a granular mold compound over the sheet mold compound. The sheet mold compound can have a first density and the overall granular mold compound can have a second density less than the first density. The method further comprises transferring the solid sheet carrying the dispensed grains to a molding machine without using a release film.
Semiconductor mold compound transfer system and associated methods
Mold compound transfer systems and methods for making mold compound transfer systems are disclosed herein. A method configured in accordance with a particular embodiment includes placing a sheet mold compound in a containment area defined by a tray cover, and dispensing a granular mold compound over the sheet mold compound. The sheet mold compound can have a first density and the overall granular mold compound can have a second density less than the first density. The method further comprises transferring the solid sheet carrying the dispensed grains to a molding machine without using a release film.
Semiconductor mold compound transfer system and associated methods
Mold compound transfer systems and methods for making mold compound transfer systems are disclosed herein. A method configured in accordance with a particular embodiment includes placing a sheet mold compound in a containment area defined by a tray cover, and dispensing a granular mold compound over the sheet mold compound. The sheet mold compound can have a first density and the overall granular mold compound can have a second density less than the first density. The method further comprises transferring the solid sheet carrying the dispensed grains to a molding machine without using a release film.
Turning device for turning a first mould part for manufacturing a wind turbine blade part relative to a second mould part
A turning device, for manufacturing wind turbine blades and turning moulds relative to each other, having a base, a rotational part movable relative to the base on an rotational axis, a first linear actuator with first and second ends, the first end attaching to the base, and the second end attaching to the rotational part at a first anchor point on a first turning axis, and a second linear actuator having first and second ends, the first end attaching to the base, and the second end attaching to the rotational part at a second anchor point on a second turning axis. The first turning axis is a first distance from the rotation axis and is moved on a first arc on the rotation axis, and the second turning axis is a second, different distance from the rotation axis and is moved along a second arc on the rotation axis.