B29C35/0888

METHODS AND APPARATUSES FOR CASTING POLYMER PRODUCTS

In an example method of forming a waveguide film, a photocurable material is dispensed into a space between a first mold portion and a second mold portion opposite the first mold portion. Further, a relative separation between a surface of the first mold portion with respect to a surface of the second mold portion opposing the surface of the first mold portion is adjusted. The photocurable material in the space is irradiated with radiation suitable for photocuring the photocurable material to form a cured waveguide film. Concurrent to irradiating the photocurable material, the relative separation between the surface of the first mold portion and the surface of the second mold portion is varied and/or an intensity of the radiation irradiating the photocurable material is varied.

Method for three-dimensional fabrication with feed-through carrier

A method of forming a three-dimensional object, is carried out by (a) providing a carrier and a build plate, the build plate comprising a semipermeable member, the semipermeable member comprising a build surface with the build surface and the carrier defining a build region therebetween, and with the build surface in fluid communication by way of the semipermeable member with a source of polymerization inhibitor; (b) filling the build region with a polymerizable liquid, the polymerizable liquid contacting the build surface; (c) irradiating the build region through the build plate to produce a solid polymerized region in the build region, while forming or maintaining a liquid film release layer comprised of the polymerizable liquid formed between the solid polymerized region and the build surface, the polymerization of which liquid film is inhibited by the polymerization inhibitor; and (d) advancing the carrier with the polymerized region adhered thereto away from the build surface on the build plate to create a subsequent build region between the polymerized region and the build surface; (e) wherein the carrier has at least one channel formed therein, and the filling step is carried out by passing or forcing the polymerizable liquid into the build region through the at least one channel. Apparatus for carrying out the method is also described.

Method for three-dimensional fabrication

A method of forming a three-dimensional object, is carried out by (a) providing a carrier and a build plate, the build plate comprising a semipermeable member, the semipermeable member comprising a build surface with the build surface and the carrier defining a build region therebetween, and with the build surface in fluid communication by way of the semipermeable member with a source of polymerization inhibitor; (b) filling the build region with a polymerizable liquid, the polymerizable liquid contacting the build surface, (c) irradiating the build region through the build plate to produce a solid polymerized region in the build region, while forming or maintaining a liquid film release layer comprised of the polymerizable liquid formed between the solid polymerized region and the build surface, wherein the polymerization of which liquid film is inhibited by the polymerization inhibitor; and (d) advancing the carrier with the polymerized region adhered thereto away from the build surface on the build plate to create a subsequent build region between the polymerized region and the build surface while concurrently filling the subsequent build region with polymerizable liquid as in step (b). Apparatus for carrying out the method is also described.

POLYMERIC CUTTING EDGE STRUCTURES AND METHOD OF MANUFACTURING POLYMERIC CUTTING EDGE STRUCTURES
20200086517 · 2020-03-19 ·

A functional polymeric cutting edge structure and methods for the manufacturing cutting edge structures using polymeric materials are provided. A razor blade for use in a razor cartridge or a blade box for assembly in a razor cartridge frame may be formed using the present invention.

Nanoimprint lithography system and method

A method for transferring a pattern from a template to a nanoimprint object. A perimeter portion of the nanoimprint object is supported by a perimeter support structure. A gas pressure induced force is applied to the nanoimprint object to facilitate bending of a central portion of the nanoimprint object in a direction toward a surface of the template until the central portion of the nanoimprint object is brought into contact with the surface of the template. While the nanoimprint object is held in contact with the surface of the template, the pattern from the template is transferred to a surface of the nanoimprint object thereby creating a patterned surface on the nanoimprint object.

SILICONE MOLD
20200031024 · 2020-01-30 · ·

Provided is a silicone mold with which a curable composition containing an epoxy resin can be molded with good precision even if used repeatedly. The silicone mold according to an embodiment of the present invention is a silicone mold for use in molding a curable composition containing an epoxy resin, the silicone mold including a cured product of a silicone resin composition, wherein the cured product has a light transmittance at a wavelength of 400 nm of 80% or higher at a thickness of 1 mm, an elongation at break in accordance with JIS K 7161 of 250% or less, and a thermal linear expansion coefficient of 350 ppm/ C. or less at 20 to 40 C.

Module, system and method for applying a viscous medium to a surface and method for producing the module

The invention relates to a method and to a module (I) for applying a viscous medium (19), in particular an adhesive or lacquer, to a surface (16) wherein the module (I) comprises a reservoir (2) that can be fed with the viscous medium (19), wherein the outer surface (4) of the module (I) comprises an outlet region (5) for the viscous medium (19), wherein the module (I) comprises at least one nozzle channel (6) which fluidly connects the reservoir (2) to the outlet region (5), wherein a smallest diameter (dmin) of the at least one nozzle channel (6) is smaller than 0.8 mm and wherein the module (I) does not comprise any movable parts for closing the at least one nozzle channel (6).

METHOD AND PLANT FOR CONSOLIDATING FIBER COMPOSITE STRUCTURES

A method for consolidating a fiber composite structure with at least one thermoplastic and/or thermoelastic polymer includes arranging the structure between a plate-shaped base and a plate-shaped cover in a loading/unloading station of a conveying device. The cover is sealed with respect to the base by a seal to be displaceable in relation to the base. The method includes generating negative pressure in the interstice between the base and the cover so the ambient pressure pushes the cover against the base, the structure being clamped between the cover and the base; heating the composite structure by electromagnetic radiation preferably at least into the range of the melting temperature of the at least one polymer in a heating station, cooling the composite structure in a cooling station of the conveying device; and removing the consolidated structure from the base or removing the base onto which the structure has been placed.

Systems and techniques for splicing together optical fiber ribbon cables having different core-to-core spacings

A system forms, at an end of a multifiber ribbon cable, a multifiber ribbon cable segment having an enlarged core-to-core spacing. A UV-transparent mold is mounted on top of a chassis. The mold defines a plurality of individual fiber channels corresponding to individual fibers of the existing multifiber ribbon cable and having a spacing equal to that of the enlarged core-to-core spacing. Each individual fiber channel passes through the internal cavity. The assembled mold further includes an injection system for receiving light curable, flowable material from the reservoir and pumping system and feeding it into the internal cavity, and at least one vent for allowing air to escape from the internal cavity as the light-curable, flowable material is fed into the internal cavity. The injected material is cured by exposure to a curing light.

COMPONENT MOUNTING SYSTEM, RESIN SHAPING DEVICE, RESIN PLACING DEVICE, COMPONENT MOUNTING METHOD, AND RESIN SHAPING METHOD
20200006099 · 2020-01-02 · ·

A chip mounting system (1) includes: a chip supplying unit (11) for supplying a chip (CP); a stage (31) for holding a substrate (WT) in an orientation in which a mounting face (WTf) for mounting the chip (CP) faces vertically downward (Z direction); a head (33H) for holding the chip (CP) from the vertically downward direction (Z direction); and a head drive unit (36) for, by causing vertically upward (+Z direction) movement of the head (33H) holding the chip (CP), causes the head (33H) to approach the stage (31) to mount the chip (CP) on the mounting face (WTf) of the substrate (WT).