A method of fabricating a chemical mechanical polishing pad includes introducing polymer precursors containing acrylate functional groups into a mold, providing abrasive particles and a photo-initiator in the polymer precursors to form a mixture, and while the mixture is contained between a bottom plate and a top cover of the mold, exposing the mixture to ultraviolet radiation through a transparent section of the mold to cause the polymer precursors to form radicals, forming a polymer matrix from the polymer precursor by causing the radicals to cross-link with one another. The polishing layer includes the polymer matrix having the abrasive particles dispersed therein.

A vat heating device is provided, including a vat and a heater. The vat has a bottom plate. The vat is used to accommodate a photosensitive resin. The heater is disposed on the bottom plate, adjacent to the photosensitive resin. The heater is used to heat the photosensitive resin. The heater is on an optical path of a light source for curing the photosensitive resin. A photocuring three-dimensional molding system containing the above vat heating device is also provided.

Provided are a cylindrical base, a master and a method for manufacturing a master enabling a uniform transfer of a fine pattern. A cylindrical base of a quartz glass having an internal strain in terms of birefringence of less than 70 nm/cm is used. A resist layer is deposited to an outer circumference surface of this cylindrical base, a latent image is formed on the resist layer, the latent image formed on the resist layer is developed and the pattern of the developed resist layer is used as a mask for etching to form a structure including concaves or convexes arranged in a plurality of rows on the outer circumference surface of the cylindrical base.

An example system for molding a photocurable material into a planar object includes a first mold structure having a first mold surface, a second mold structure having a second mold surface, and one or more protrusions disposed along at least one of the first mold surface or the second mold surface. During operation, the system is configured to position the first and second mold structures such that the first and second mold surfaces face each other with the one or more protrusions contacting the opposite mold surface, and a volume having a total thickness variation (TTV) of 500 nm or less is defined between the first and second mold surfaces. The system is further configured to receive the photocurable material in the volume, and direct radiation at the one or more wavelengths into the volume.

An example system is configured to photocure a photocurable material to form a polymer film. The system includes a first chuck configured to support a first substantially planar mold, a second chuck configured to support a second substantially planar mold, and an actuable stage coupled to the first chuck and/or the second chuck. The actuable stage is configured to position the first chuck and/or the second chuck so that the first and second molds are separated by a gap. The system also includes a sensor arrangement for obtaining measurement information indicative of a distance between the first and second molds and/or a pressure between the first and second chucks at each of at least three locations. The system also includes a control module configured control the gap between the first and second molds based on the measurement information.

A mold may include a plurality of nanostructures configured to form a lithographic pattern when imprinted into a material. Imprinting may include imprinting the mold a first predetermined distance, modifying a temperature of the material, and altering a position of the mold based on the temperature modification. One or more thermal elements may alter a temperature of a first section of the material and/or one or more nanostructures for a predetermined pulse time less than an equilibrium time required for the mold and/or material to reach a stable temperature state. A first thermal element may selectively alter the temperature of a first section of the material and/or a first nanostructure and a second thermal element may selectively alter the temperature of a second section of the material and/or a second nanostructure. The one or more thermal elements may include one or more thermoelectric elements.

An imprint method including the steps of: an exposing step to irradiate a photo curing resin, coated on a large-area substrate, with a curing light while the light-transmitting imprint mold is pressed against the photo curing resin, an amount of the curing light applied onto the photo curing resin in a light shielding region provided with the light shielding member made less than an amount of the curing light applied onto the photo curing resin in a light transmitting region of the mold so that a portion of the photo curing resin in the light shielding region is semi-cured by the use of the light shielding member provided so as to reproduce the concave-convex pattern of the transparent substrate.

In various embodiments, a method of forming a masking layer on at least a portion of an object. The method may include providing a plurality of mould pieces. The method may include forming an assembled mould using the plurality of the mould pieces. The assembled mould may include one or more inner surfaces to define a cavity for holding the portion of the object. The method may include providing a masking fluid in said cavity. The method may include providing electromagnetic waves to cure the masking fluid to form the masking layer on the portion of the object.

According to some aspects, a storage unit for storing a photopolymer resin is provided. The storage unit may comprise a photopolymer resin, a bottom face comprising at least one region of actinically transparent material, the actinically transparent material being actinically transparent with respect to the photopolymer resin, at least one wall extending upwards from said bottom face comprising at least one region of actinically opaque material, the actinically opaque material being actinically opaque with respect to the photopolymer resin, and a lid comprising the actinically opaque material and removably connectable to the at least one wall.

Provided is a curable composition which has chargeability into silicone molds and curability at excellent levels, less causes the silicone molds to swell, and allows the silicone molds to have better durability and a longer service life in repeated use. The curable composition according to the present invention contains curable compounds and a cationic initiator and is used for production of an optical component by molding using silicone molds. The curable compounds include (A) a cycloaliphatic epoxy compound in a content of 10 weight percent or more of the totality of all the curable compounds contained in the curable composition. Of the totality of all the curable compounds contained in the curable composition, 10 to 50 weight percent is a curable compound or compounds having a molecular weight of 400 or more.