A molding apparatus includes a movable molding surface with molding cavities, a pressure shoe with a stationary outer surface that defines in cooperation with the molding surface a pressure zone, and a resin source configured to introduce molten resin into the pressure zone to be forced into the molding cavities by pressure in the pressure zone. The molding surface is movable with respect to the pressure shoe to introduce molding cavities to the pressure zone to be filled with resin while the outer surface of the pressure shoe and the molding surface define in between an entrance gap of decreasing width upstream of the pressure zone. The outer surface of the pressure shoe is spaced from the molding surface in the pressure zone to define a minimum gap at which the outer surface of the pressure shoe has a slope parallel to the molding surface. The pressure shoe is adapted to be held in a flexed condition against resin in the pressure zone while forcing resin into the cavities, with the outer surface of the pressure shoe curved upstream of the pressure zone.

The present disclosure relates to a method for transferring an embossed structure to at least a part of a surface of a coating (B2), using a composite (F1B1) composed of a substrate (F1) and of an at least partially embossed and at least partially cured coating (B1), where the coating (B2) and the coating (B1) of the composite (F1B1) have embossed structures which are mirror images of one another. Also described herein is a composite (B2B1F1). Further described herein is a use of this composite for producing an at least partially embossed coating (B2) in the form of a free film or a composite (B2KF2) composed of a substrate (F2), at least one adhesive (K), and the coating (B2).

The present disclosure relates to a method for transferring an embossed structure to a surface of a coating composition (B2a), which includes the steps (1-i) and (2-i) or (1-ii) and (2-ii) and also the steps (3) and optionally (4), where the steps (1-i) and (2-i) or (1-ii) and (2-ii) are performed using a composite (F1B1) which is employed as an embossing die (p2) of an embossing tool (P2) and which is composed of a substrate (F1) and of an at least partially embossed and at least partially cured coating (B1), and the coating composition (B1a) used for producing (B1) of the composite (F1B1) is a radiation-curable coating composition of defined constitution. Also described herein is a composite (F1B1).

The present disclosure relates to a method for transferring an embossed structure to a surface of a coating composition (B2a), which includes the steps (1-i) and (2-i) or (1-ii) and (2-ii) and also the steps (3) and optionally (4), where the steps (1-i) and (2-i) or (1-ii) and (2-ii) are performed using a composite (F1B1) which is employed as an embossing die (p2) of an embossing tool (P2) and which is composed of a substrate (F1) and of an at least partially embossed and at least partially cured coating (B1), and the coating composition (B1a) used for producing (B1) of the composite (F1B1) is a radiation-curable coating composition of defined constitution. Also described herein is a composite (F1B1).

The present invention discloses a silencer for automobile. The silencer is formed by press molding. The silencer has a first molded surface and a second molded surface which are opposite to each other in a thickness direction. The silencer at least includes a first fiber layer on which the first molded surface is formed and a second fiber layer integrated with an opposite surface to the first molded surface, the opposite surface being on the first fiber layer. Fibers of the second fiber layer exist partly on the opposite surface on the first fiber layer.

The invention relates to a method for producing microstructures, the method including providing a planar mold element, which includes at least one mold opening for the microstructure to be produced, wherein the at least one mold opening has a first opening and a second opening; providing a first formulation at the second opening; generating a negative pressure in the mold opening; and taking up the first formulation through the second opening into the mold opening on account of the negative pressure in the mold opening. The invention further relates to a system for producing microstructures.

A pressing machine that applies heat and pressure to a press object transported in a first direction includes a first die having a first heater, a second die having a second heater and being disposed above the first die, a support member that supports the first die and the second die, and a movement mechanism that moves the support member from a first position to a second position located in a second direction intersecting the first direction from the first position, in which the first position is the position at which the first die and the second die apply heat and pressure to the press object and the second position is the position at which the first die and the second die do not face the press object.

An apparatus for forming an opening device on a receiving portion of a sheet packaging material for packaging pourable food products comprises a molding unit having a first and a second mold selectively set in an open configuration, in which they are spaced from one another to allow feed of the packaging material therebetween, and in a closed configuration, in which they cooperate with faces of the packaging material and delimit a closed mold cavity housing the receiving portion of the packaging material and adapted to be filled with molten plastic material to define, when the plastic material sets, the opening device. The apparatus further comprises feeding device to feed molten plastic material to the molding zone in the open configuration of the first and second mold, and pressing device exerting pressure on the dose to force it to fill the mold cavity and to form the opening device.

There is described an apparatus for forming opening devices on a sheet packaging material for packaging pourable food products; the apparatus comprises conveying means for advancing the packaging material along a given path, at least one molding unit arranged along the path and adapted to mold one opening device on a receiving portion of the packaging material, and at least one movable element carrying the molding unit and advanced parallel to at least a portion of the path to allow the molding unit to form the opening device while the packaging material is being advanced along the path.

A molding apparatus includes a movable molding surface with molding cavities, a pressure shoe with a stationary outer surface that defines in cooperation with the molding surface a pressure zone, and a resin source configured to introduce molten resin into the pressure zone to be forced into the molding cavities by pressure in the pressure zone. The molding surface is movable with respect to the pressure shoe to introduce molding cavities to the pressure zone to be filled with resin while the outer surface of the pressure shoe and the molding surface define in between an entrance gap of decreasing width upstream of the pressure zone. The outer surface of the pressure shoe is spaced from the molding surface in the pressure zone to define a minimum gap at which the outer surface of the pressure shoe has a slope parallel to the molding surface. The pressure shoe is adapted to be held in a flexed condition against resin in the pressure zone while forcing resin into the cavities, with the outer surface of the pressure shoe curved upstream of the pressure zone.