There is provided an injection molding machine management system including an injection molding machine configured to mold a molded article with injection molding, a peripheral device configured to perform a post-process of the injection molding, and a control device communicably coupled to the injection molding machine and the peripheral device. The injection molding machine management system includes a generating section configured to generate a common identifier for each of predetermined production units and transmit the common identifier to the peripheral device. Molding data concerning the injection molding and post-process data concerning the post-process are correlated with the common identifier.

Provided is a method for producing a gear including an intermediate product forming process of solidifying a fluid material to form a gear intermediate product, and a tooth forming process of cutting the gear intermediate product to form teeth.

A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector.

An injection molding apparatus including a mold, an injection device and at least one sensor is provided. The mold has a mold cavity. The injection device is adapted to inject a material into the mold cavity such that the material is formed into a forming article. The at least one sensor is disposed on the mold and adapted to sense at least one of a temperature and a pressure in the mold cavity. The at least one sensor is located at an inner surface of the mold cavity and corresponds to a non-appearance surface of the forming article. In addition, an injection molding method is also provided.

The present invention is a method that enables continuous injection molding of a thermosetting resin composition and reuse of an unnecessary part produced during the molding. The method includes injecting a thermosetting resin composition into a mold while a curing reaction of the resin composition is incomplete. The thermosetting resin composition is then cooled in the mold until becoming semi-cured and removed as a semi-cured product from the mold. The semi-cured product is separated from the unnecessary part and separately heated to progress a thermosetting reaction of the thermosetting resin composition. The unnecessary part may be used as a reworked raw material by regrinding the unnecessary part and mixing it with a fresh thermosetting resin composition. Then, a resultant mixture is used to perform a new injection molding.

Methods and apparatuses are provided for manufacturing a transaction card. The disclosed methods and apparatuses may be used to form a transaction card frame within a mold. The transaction card frame may include one or more recessed portions formed within a first surface of the transaction card frame. The one or more recessed portions may be configured for affixing one or more electronic components.

An injection molding apparatus including a mold, an injection device and at least one sensor is provided. The mold has a mold cavity. The injection device is adapted to inject a material into the mold cavity such that the material is formed into a forming article. The at least one sensor is disposed on the mold and adapted to sense at least one of a temperature and a pressure in the mold cavity. The at least one sensor is located at an inner surface of the mold cavity and corresponds to a non-appearance surface of the forming article. In addition, an injection molding method is also provided.

A hybrid component comprising at least two component portions, which are connected via at least one connection portion, wherein: the at least one connection portion extends in a joining direction; a first component portion is formed from a first material which has a first modulus of elasticity; a second component portion is formed from a second material which has a second modulus of elasticity different from the first modulus of elasticity; and the at least one connection portion is designed at least to compensate for a sudden change in rigidity between the two component portions, the at least one connection portion having a rigidity that increases in the joining direction and in the direction of the component portion with the higher modulus of elasticity.

Methods and apparatuses are provided for manufacturing a transaction card. The disclosed methods and apparatuses may be used to form a transaction card frame within a mold. The transaction card frame may include one or more recessed portions formed within a first surface of the transaction card frame. The one or more recessed portions may be configured for affixing one or more electronic components.

A method of injection molding a building product includes providing an injection mold with a plurality of gates located adjacent a perimeter of the injection mold. The method further includes commingling a first material and a second material into a flow, the second material comprising a color that contrasts with a color of the first material and injecting the commingled flow into the plurality of gates to form a building product. Thereafter, the method includes removing the building product from the injection mold. The second material extends through an interior of the building product and appears as contrasting streaks on an exterior of the building product to form a variegated grain appearance. The method also includes notching a portion of the building product, such that the building product has a substantially linear grain in an exposed portion thereof.