This utility model discloses a manufacturing device of a dental floss pick, which comprises of an injection molding module, a cutting module, a carrying module and a storage module. The injection molding module is provided with a material chamber, a motor, a rotating shaft and screw, and heating is arranged on the outer periphery of the lower end of the material chamber. A nozzle is arranged at a lower end of the material chamber, an upper mold and a lower mold are arranged under the nozzle, and a shape forming mold is arranged between the upper mold and the lower mold. The cutting module encompasses of cutters directly under the blade cutter; a clamping robot is arranged between the injection molding module and the cutting module, and a suction cup robot is arranged between the cutting module and the storage module. Through the whole process, the automated carrying module is used to carry out the handling and stacking operation of the product. The whole production process realizes the automatic operation of the equipment, which greatly improves safety and production efficiency; furthermore the equipment in the utility model is naturally degradable. Thermoplastic starch plastics are produced as raw materials and the products do not pollute the environment.

An encapsulation method of electronic components comprises steps as follows: preparing electronic components with cylindrical bodies wherein a cylindrical body has front and rear ends made of metals and a middle end made of ceramics and the front end or the rear end features an outer diameter greater than the middle end of the cylindrical body; preparing a mould consisting of upper and lower moulds; encasing the cylindrical bodies inside the upper and lower moulds, injecting heated and softened protective materials into the mould in which protective materials as protective layers are coated on the cylindrical bodies; injecting the cylindrical bodies removed from the upper and lower moulds into a roller in which excessive protective layers on the front and rear ends of the cylindrical bodies are de-coated.

A composite material member having an FRP layer made of fiber-reinforced plastic, and a resin-rich layer that has a fiber content that is 5% or less of the fiber content of the FRP layer. The resin-rich layer is formed in at least a partial region of a surface of the FRP layer, and is formed from the same resin as a matrix resin of the fiber-reinforced plastic. A hole is bored so as to penetrate the FRP layer and the resin-rich layer.

Implantable medical devices are provided. In one embodiment, a device includes a body having an external surface defining an outer profile of the device. The body includes a porous matrix including a series of interconnected macropores defined by a plurality of interconnected struts each including a hollow interior. A filler material substantially fills at least a portion of the series of interconnected macropores. The external surface of the body includes a plurality of openings communicating with the hollow interior of at least a portion of the plurality of interconnected struts. In a further aspect of this embodiment, the external surface includes exposed areas of the filler material and porous matrix in addition to the exposed openings. In another aspect, the porous matrix is formed from a bioresorbable ceramic and the filler material is a biologically stable polymeric material. Still, other aspects related to this and other embodiments are also disclosed.

A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector.

An optical element for a lighting device of an automotive vehicle. The optical element includes a first portion configured to transmit electromagnetic (EM) radiation therethrough, the EM radiation including visible wavelengths and an ablation process wavelength. Also included is a second portion configured to absorb at least the ablation process wavelength, the second portion being in contact with the first portion to define an ablation process boundary which separates a surface of the first portion from an adjacent surface of the second portion. A patterned optical coating is provided on the optical element such that the optical coating material is provided on at least a part of the surface of the second portion, but not provided on the surface of the first portion.

A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation. The mold may be used to form part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector. Reuseable plates may be used instead of the heat sink panels. Alternatively the panel may be encapsulated in and separated from a re-useable mold after curing.

A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation. The mold may be used to form part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector. Reuseable plates may be used instead of the heat sink panels. Alternatively the panel may be encapsulated in and separated from a re-useable mold after curing.

A method for manufacturing a hollow part with a branch, including a resin filling step of filling a mold, the mold having a main cavity in which a hollowing piece is placed, and a branch cavity to communicate with the main cavity, in which a slide shaft is inserted to advance and withdraw, and that forms a branch pipe portion in an annular space between the branch cavity and the slide shaft, a step of forming a hollow main pipe portion by moving the hollowing piece to force excess resin out of the main cavity, and a shaft removing step of withdrawing the slide shaft to form a branch hollow portion, the hollow part with a branch being made of a resin and having the branch pipe portion integrally connected to the main pipe portion such that the main hollow portion and the branch hollow portion communicate with each other.

A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector.