Provided is a method of manufacturing a sensor. The sensor has a casing having an opening portion, a clamp having a recessed part on its outer periphery and having one end inserted into the opening portion, and a sealing ring attached to the recessed part and disposed between the casing and the clamp. The method includes using a first divided mold to form a first component of the clamp, the first component including a main body portion and a first part located at one end side of the main body portion and forming a part of the recessed part. The first divided mold is divided so that a dividing surface intersects the main body portion and separates in an axial direction of the main body portion.

A disclosed insert molding method includes installing a first insert piece between a first mold and a second mold such that a smallest distance in a gap between the first insert piece and the first mold is smaller than a smallest distance in a gap between the first insert piece and the second mold, the first insert piece including a first through-hole of which width is larger than the smallest distance in the gap between the first insert piece and the first mold; and supplying a resin to a mold gap between the first insert piece and the first mold or the second mold, thereby to fill the mold gap with the resin, while the first insert piece and the first mold are kept to abut each other.

Provided is a method of molding an elevator and an endoscope, the method making it possible to mold an elevator integrally with an operation wire with a simple operation. A method of molding an elevator (36) is a method of molding an elevator (32) integrally with an operation wire (40), the elevator (32) being to be disposed in a distal-end-portion body (32) of an endoscope (10). The method includes: a step of disposing the operation wire (40) to extend through a cavity (106), which is formed by a first die (102) and a second die (104) that are separable in a separation direction, in a state in which the first die (102) and the second die (104) are mated to each other and in which the separation direction and a wire-axis direction of the operation wire (40) coincide with each other; a step of integrally molding the elevator (36) and the operation wire (40) by injecting a molding material (108), which is a material of the elevator (36), into the cavity (106); and a step of separating the first die (102) and the second die (104) in the separation direction after molding the elevator.

An injection molding module for performing a series of injection molding actions, includes a robotic system. The molding module in addition includes a series of anchoring members for fixing at least a portion of the robotic system at each location where an injection molding action takes place.

A construction of a telepresence robotics platform with polymeric and biomimetic over-molded tissue analogues, optimized for having the compressive, sensate, mechanical, functional, and tumescent properties of bone, cartilage, tendons, organs, muscle, fat, skin, and erogenous tissue, with options for adjustment thereof based on an operator's needs of inertial latency and center of gravity via various selected epidermal layer densities.

A device for forming or molding elements on surfaces of a semi-finished product includes a C-shaped bracket element for displacing using a manipulator to a defined position with respect to a semi-finished product. An arrangement implemented for injection molding is disposed on a first leg and a backing holder is disposed on the second leg of the C-shaped bracket element. A semi-finished product can be disposed between the backing holder and the arrangement. A first molding tool is disposed in the direction toward a surface of the semi-finished product. The arrangement and/or the backing holder is/are displaceable against the corresponding surface of the semi-finished product, such that the open side of the first molding tool applies pressure to the corresponding surface of the semi-finished product and the backing holder contacts and applies pressure to the opposite surface of the semi-finished product.

An injection mold for molding an electrical connector assembly which includes a plurality of terminals, a clamping component located above the plurality of the terminals, and a base body fastened to the plurality of the terminals and the clamping component. The injection mold includes a lower mold and an upper mold. The lower mold has a plurality of lower terminal grooves. Lower portions of the plurality of the terminals are placed in the plurality of the lower terminal grooves. The clamping component is placed on the lower mold. The upper mold is engaged with and mounted on the lower mold. A molding cavity is formed between the upper mold and the lower mold. The upper mold has a plurality of upper terminal grooves. Upper portions of the plurality of the terminals are placed in the plurality of the upper terminal grooves.

A mold for encapsulating a Pin-Fin type power module with resin is disclosed. The power module includes a DBC or IMS, power chips and multiple terminals provided on a first surface of the DBC or IMS and a Pin-Fin structure provided on a second surface of the DBC or IMS. The mold further includes: a cavity for containing the power module; multiple terminal protecting elements corresponding to the terminals, respectively, each for receiving at least a part of a terminal; and an injection hole provided on the bottom of the mold or on the side wall of the mold, The first surface faces the bottom of the mold and the injection hole is below the first surface when the power module is placed in the cavity. A method for manufacturing a power module is also provided.

A mold tool 1 is described for molding a semiconductor power module having an electrical contact pin 2 which includes an electrical contact portion 3 for contacting a substrate 4 with another electrical component. The pin 2 comprises a protruding portion 5 being a top-sided pin connector. The mold tool 1 includes a first 6 and a second mold die which, when brought together for molding, form a cavity to be filled with a mold compound for encapsulating electrical components of the semiconductor power module, and a recess 7 in the first die 6 which communicates with the cavity within the second die. The recess 7 is filled with a cushion-like soft material 8 into which the top-sided pin connector is pushed thereinto and completely surrounded by the soft material so that a sealing means is formed that prevents any contamination of the electrical contact portion 3 of the pin 2 by the molding compound introduced into the cavity. Furthermore, a method of manufacturing such a semiconductor power module is described.

A method for overmolding a tubular structure including inserting a core pin into the tubular structure so that at least a portion of a main body of the core pin extends at least partially out of the tubular structure. The method further includes clamping the tubular structure to a mold cavity structure in an Z-direction using a retaining structure, in which the retaining structure includes an inclined portion and the flexible portion extends out of the mold cavity structure. The method also includes injecting a thermoplastic material into a mold cavity of the mold cavity structure to overmold at least a portion of the tubular structure, in which the injecting of the thermoplastic material includes the thermoplastic material contacting the portion of the core pin extended from the tubular structure.