Methods, devices, and systems are provided for the molding and encapsulation of flexible electronic devices. The encapsulation includes providing a mold shell made from an encapsulation material, positioning a flexible electronic device in the mold shell, and dispensing an encapsulant, in a liquid form, around the flexible electronic device. The mold shell, the dispensed encapsulant, and the electronic device forms an integral encapsulation package when the encapsulant is cured. The mold shell and the encapsulant may be made from a same material and, once cured, become an integral part of the encapsulated flexible electronic device.

An article includes a hollow enclosure defining a void. The void has a first section and a second section separate from the first section. An electronic component is housed in the first section and the second section of the void. A low pressure mold material is molded into the first section of the void and cured around a first segment of the electronic component to encapsulate the first segment of the electronic component. A support seal is inserted into the second section of the void adjacent a second segment of the electronic component. The support seal defines a sealing barrier on one side of the low pressure mold material that limits the flow of low pressure mold material out of the first section of the void.

An assembly process for assembling a basin using a molding tool operable between an open position and a closed position, the molding tool having a female molding insert, a male molding insert, and an insert jig, the female molding insert and the male molding insert cooperating to define a mold cavity when the molding tool is in the closed position, the female molding insert having an aperture, the insert jig having a sleeve and a cylinder, the cylinder repositionable within the sleeve and having an end with an end face and a pin protruding from the end face, includes applying adhesive to the pin. The assembly process also includes aligning the pin with an aperture of a basin rim insert. The assembly process also includes pressing the basin rim insert towards the end face such that the pin is received within the aperture of the basin rim insert.

A component assembly includes a workpiece and at least one elastic member. The workpiece defines an axis, and has two ends opposite to each other along the axis, and an axial hole extending through the ends. The at least one elastic member is made of an elastic material and has a ring shape. The at least one elastic member is disposed on and abuts against one of the ends of the workpiece, and surrounds the axial hole.

Methods, devices, and systems are provided for the molding and encapsulation of flexible electronic devices. The encapsulation includes providing a mold shell made from an encapsulation material, positioning a flexible electronic device in the mold shell, and dispensing an encapsulant, in a liquid form, around the flexible electronic device. The mold shell, the dispensed encapsulant, and the electronic device forms an integral encapsulation package when the encapsulant is cured. The mold shell and the encapsulant may be made from a same material and, once cured, become an integral part of the encapsulated flexible electronic device.

An article includes a hollow enclosure defining a void. The void has a first section and a second section separate from the first section. An electronic component is housed in the first section and the second section of the void. A low pressure mold material is molded into the first section of the void and cured around a first segment of the electronic component to encapsulate the first segment of the electronic component. A support seal is inserted into the second section of the void adjacent a second segment of the electronic component. The support seal defines a sealing barrier on one side of the low pressure mold material that limits the flow of low pressure mold material out of the first section of the void.

Capsule intended for receiving a substance for preparing a beverage using a coffee machine or infusion machine, to be held by a piston during the passage of the extracting liquid after piercing of the base by the pins of the piston. The capsule made from injected plastic material has a base (1) and a side wall (3) together forming part of a frustrum of a cone, as well as a rim (4) covered by a lid (5) after the filling of the capsule with the substance. The side wall (2) is shaped as a single cone frustrum between the rim (3) and the open (12) base (1), formed as a flattened ring (11), connected to the side wall (2). The side wall (2) is covered by a label (23) and the open base (1), including the ring (11) thereof, is covered by a sealed lid (14) inside the base.

The invention relates to a method for producing a cable, comprising both a molding tool with a cavity and with at least one first opening, and a line, said line consisting of at least one wire and a sheath surrounding the at least one wire. According to the invention, the line is inserted into the cavity and is guided out of the cavity via at least the first opening. A molding compound is injected into the cavity of the molding tool in a pressurized manner, wherein the line is pressed onto a seal surface of the cavity by means of the pressure of the molding compound, and the line closes the cavity at the seal surface.

A base-material/gasket unit mold which can reduce molding failure occurrence is provided. The mold includes a first half mold including a base material holding portion arranged on a first parting surface to hold a base material, and a second half mold having a second parting surface and used together with the first half mold to close and open the mold. The second half mold includes a gasket cavity defined on the second parting surface side to form a gasket main body 121 on a surface of the base material, an isolated rubber cavity forming an isolated rubber portion isolated from the gasket main body on the surface of the base material, and a mold-pressing portion arranged around the isolated rubber cavity to press the base material when the mold is closed and having a recessed part defined on a press surface side to reduce deformation of the base material.

A package is manufactured by placing a substrate, for example a lead frame, in a mold with a protection flange extending into a notch in the substrate around a contact surface. The protection flange impedes molding compound from reaching the contact surface reducing the need for a deflash step.