A connector cavity assembly for a medical device, comprising at least one connector cavity comprising a plurality of electrically conductive electrode contacts spaced apart from each other and a plurality of electrically insulating insulation elements, wherein the electrode contacts and the insulation elements are arranged alternatingly; and a connector cavity housing. The connector cavity assembly is characterized in that the at least one connector cavity is removably arranged within the connector cavity housing, wherein the connector cavity housing exerts a pretension on the at least one connector cavity leading to a liquid-tight sealing between the insulation elements and the electrode contacts.

There are provided a method of manufacturing a molded product for a power module capable of integrally molding terminals and a substrate, and a terminal in a particular shape used for the manufacturing method. The method of manufacturing the molded product for a power module includes the steps of: inserting a first tip portion of each of terminals having a particular shape into a substrate; arranging the substrate in a mold such that the second tip portion is inserted into a terminal insertion portion inside the mold; and integrally molding the substrate and the terminals by flowing resin into the mold.

A printed circuit board for an electric component contains an electrically insulating substrate which has a surface and at least one electrically conductive conductor track formed within the substrate. The surface of the substrate has a sealing region which is arranged and/or configured such that the sealing region is flat and/or the substrate has a homogenous substrate thickness in the sealing region. An overmolding which adjoins the sealing region is arranged on the surface of the substrate.

The present disclosure relates to a foamed steering wheel for an automotive vehicle and is intended for an especially advantageous manufacturing process of said steering wheel. For this purpose, it is suggested that in the area of the foamed edge the foam wrapping is adjacent to a skeleton projection of the steering wheel skeleton and to a cover projection of the skeleton cover, wherein the skeleton projection and the cover projection are directly adjacent to each other and together form a substantially circumferentially closed wall projection for contacting a foaming mold.

A cartridge for a medium to be dispensed includes a head part having a dispensing outlet and a film forming a cartridge wall, with the film surrounding a cartridge chamber for the medium to be dispensed, extending at least partially (along an axial extension) in a longitudinal direction of the cartridge and having a front end being connected to the head part. The film is preferably a multilayer film having at least two layers formed from different materials, and the front end of the film is sealingly and non-releasably embedded in the head part of the cartridge, so that an end face of the front end of the film is covered, in particular completely covered, by the head part.

The invention relates to a method for producing a trim part (10) for vehicles, using an injection mold (1), in which an edge of a carrier substrate is formed by the surface cover layer (8) reaching around said edge by means of a lost seal molded to the carrier substrate.

A method of manufacturing a sensor device comprising: configuring a moulding support structure and a packaging mould so as to provide predetermined pathways to accommodate a moulding compound, the moulding support structure defining a first notional volume adjacent a second notional volume. An elongate sensor element and the moulding support structure are configured so that the moulding support structure fixedly carries the elongate sensor element and the elongate sensor element resides substantially in the first notional volume and extends towards the second notional volume, the elongate sensor element having an electrical contact electrically coupled to another electrical contact disposed within the second notional volume. The moulding support structure carrying (102) the elongate sensor element is disposed within the packaging mould (106). The moulding compound is then introduced (110) into the packaging mould during a predetermined period of time (112) so that the moulding compound fills the predetermined pathways, thereby filling the second notional volume and surrounding the elongate sensor element within the second notional volume without contacting the elongate sensor element.

A package is manufactured by placing a substrate, for example a lead frame, in a mold with a protection flange extending into a notch in the substrate around a contact surface. The protection flange impedes molding compound from reaching the contact surface reducing the need for a deflash step.

The mold device according to the present invention is a mold device to resin-seal the semiconductor device including an insert electrode, and in the semiconductor device, the insert electrode is provided with an insert hole, a nut having a screw hole is disposed in the insert electrode so that the insert hole and the screw hole communicate with each other, the mold device includes a mold body into which resin is injected to resin-seal the semiconductor device, including a side of the insert electrode where the nut is disposed, and a rod-like member that is inserted into the insert hole, and the rod-like member is inserted into the screw hole of the nut through the insert hole of the insert electrode to draw the nut to the side of the insert electrode.

A connector (1) includes first terminals (3A), a first resin core (2A), second connector terminals (3B), second resin cores (2B) and an outer resin part (4). Base ends (312) of inner end parts (31A) of the first terminals (3A) face a second exposed surface (21B) of the second resin core (2B) with a clearance (S) formed between the base end parts (312) and the second exposed surface (21B). Tips (311) of the inner end parts (31A) of the first terminals (3A) are formed with bent tips (311A) projecting away from the second exposed surface (21B). The second exposed surface (21B) has a size to entirely surround the inner end parts (31A) of the first terminals (3A).